HP BladeSystem c-Class architecture Technology brief, 4th edition

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you the ability to see exactly how and where you’re using power, and it allows you to optimize the
enclosure for your power and cooling environment.
Through the Onboard Administrator controller, you can access real-time power and temperature data
to monitor your environment. Onboard Administrator allocates power to the device bays based on the
specific configuration of each blade. As you insert blades into the enclosure, the Onboard
Administrator discovers each one and allocates power, based on measured maximum power. For
ProLiant servers, the BIOS performs a power test during POST and adjusts the power allocation.
Onboard Administrator also lets you adjust operating conditions to meet your data center
requirements. You can maximize performance based on your power and cooling budgets and reduce
the need for expensive power and cooling upgrades.
Server blades and processors
HP Power Regulator and Insight Control power management software let you measure the power
consumption of each blade and control the active processor power on ProLiant and Integrity servers.
This technology takes advantage of processor performance states to scale power to meet performance
requirements. For more information about HP Power Regulator technology, see these websites:
www.hp.com/servers/power-regulator for ProLiant servers and www.hp.com/go/integritythermallogic for
Integrity servers.
Visit this website for additional information about Insight Control power management:
http://h18013.www1.hp.com/products/servers/management/ipm/index.html.
Precise ducting throughout the server blade manages airflow and temperature based on the unique
thermal requirements of all critical components. This ensures that no air bypasses the server blade,
which gives you the most thermal work from the least amount of air. This concept allows flexibility in
heat sink design. Our engineers have designed heat sinks that closely match the requirements of the
server blade and processor architecture.
Most important, c-Class server blades incorporate intelligent management processors (iLO for ProLiant
server blades, Integrity iLO for Integrity server blades) that provide detailed thermal information for
every blade. The iLO devices forward management information to the Onboard Administrator so you
can access it through the Onboard Administrator interface.
Enclosure
At the enclosure level, Thermal Logic provides a number of advantages:
• Dynamic Power Saver mode to operate power supplies at high efficiencies
• Active Cool Fans to minimize power consumption
• Mechanical design features to optimize airflow
• Enclosure-level Dynamic Power Capping to set power limits
Dynamic Power Saver Mode
Most power supplies operate inefficiently when lightly loaded and more efficiently when heavily
loaded. Dynamic Power Savings mode saves power by running the required power supplies at a
higher load and putting unneeded power supplies in a standby mode. When power demand
increases, the standby power supplies deliver the required extra power. As a result, the enclosure
operates at optimum efficiency with no impact on redundancy.