HP BladeSystem c-Class architecture Technology brief, 4th edition

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Availability technologies
The BladeSystem c-Class enclosure uses redundant configurations to eliminate single points of failure,
and its architecture reduces the risk of component failures and the time required for changes. The c-
Class enclosure employs multiple signal paths and redundant hot-pluggable components to provide
maximum uptime for components in the enclosure.
Redundant configurations
The B c-Class enclosure minimizes the chances of a failure by providing redundant power supplies,
cooling fans, and interconnect modules. For example, customers have the option of using power
supplies in an N+N redundant configuration or an N+1 configuration. You can place the interconnect
modules side-by-side for redundancy. In addition, you can use redundant Onboard Administrator
modules in an active-standby configuration.
The c-Class architecture provides redundant paths using multiple facility power feeds into the
enclosures, blade-to-interconnect bay connectivity, and blade-to-enclosure manager connectivity.
Because all c-Class components are hot pluggable, you can quickly reestablish a redundant
configuration in the event of a failure.
Reliable components
We took every opportunity in the c-Class architecture to design for reliability, especially for critical
components considered single points of failure. Our customers sometimes ask if the NonStop signal
midplane for the BladeSystem c-Class enclosure could be a single point of failure because it is not
replicated. We designed the midplane to mitigate that risk (as described in the “General-purpose
flexible design
” section).
In the unlikely event that an Onboard Administrator module fails, server blades and interconnect
modules continue to operate. The module can be removed and replaced without affecting operations
of the server blades and interconnect modules.
A component’s operating temperature can play a significant role in reliability. The mechanical design
of the BladeSystem c-Class enclosures minimizes the operating temperature of components in all
critical areas. The Active Cool fan design and the Onboard Administrator’s thermal monitoring of the
entire system add to the lifespan of components by making sure that the fans cool the entire
enclosure. Because of its unique fan blade, housing, motor windings, bearings, and drive circuit, the
Active Cool fan provides higher reliability than typical server fans.
Reducing configuration time
Several important technologies in the BladeSystem c-Class reduce the amount of time needed to
replace, upgrade, and configure systems: Onboard Administrator and the related Insight Display,
Virtual Connect technology, and hot-plug devices.
With the intelligence of the Onboard Administrator and the easy-to-use Insight Display panel, you can
configure and troubleshoot systems in minutes, rather than hours or days. Adopting Virtual Connect
technology removes administrative burdens from LAN and SAN administrators because they are not
required to change their network setup every time a server blade configuration changes. It is quick
and easy to migrate the network service from a failed server blade to a functional server blade.
Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server
blades, and storage blades are hot pluggable, making it easy to repair or upgrade your systems.