HP BladeSystem c-Class architecture Technology brief, 4th edition

Introduction

The HP BladeSystem c-Class architecture is a flexible infrastructure that makes the computing, network,

and storage resources easy to install and arrange. It creates a general-purpose infrastructure that

accommodates your changing business needs. This technology brief explains how the architecture

supports such flexibility.

Shared cooling, power, and management resources support the flexible, modular components. This

integrated aspect of the BladeSystem c-Class―especially the Onboard Administrator and Integrated

Lights-Out (iLO) management tools―are key components of the BladeSystem c-Class environment.

These management resources comprise a pre-boot configuration environment and support innovative

technologies like Virtual Connect.

This paper includes a short description of the components within the BladeSystem c-Class and

explains how they work together. But it does not discuss details about all BladeSystem products. For

product details, refer to the HP BladeSystem website at

www.hp.com/go/bladesystem or refer to other

technology briefs at http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-

servers.html#bl.

Enclosures and hardware components

The HP BladeSystem c-Class enclosure holds these components:

• ProLiant server blades

• ProLiant workstation blades

• Integrity server blades

• Storage blades

• I/O option blades

• Interconnect modules (switches, pass-thru modules, and Virtual Connect modules)

• NonStop passive signal midplane

• Passive power backplane

• Power supplies and fans

• Onboard Administrator modules

We have optimized the HP BladeSystem c7000 enclosure (Figure 1) for enterprise data centers. A

single BladeSystem c7000 enclosure is 10U high. It holds up to 16 server, storage, or I/O option

blades and up to 8 interconnect modules.