HP BladeSystem c3000 Enclosure and c3000 Tower Enclosure Maintenance and Service Guide

Removal and replacement procedures 38
3.
Remove the Dual Onboard Administrator module (on page 38) or Onboard Administrator blank (on
page 38) from the DDR2 Onboard Administrator module.
CAUTION: For mandatory cooling, do not operate the enclosure for any periods with more than
one interconnect component or blank removed. When removing an active interconnect
component, replace it with a blank.
To replace the component, reverse the removal procedure.
Dual Onboard Administrator module
To remove the component:
1. Press the release button, and then pull the handle open.
2. Remove the Dual Onboard Administrator module.
CAUTION: For best cooling practices, do not operate the enclosure for extended periods with
more than one component or blank removed. When removing an active component, replace it
with a blank.
To replace the component, reverse the removal procedure.
Onboard Administrator blank
To remove the component:
1. Press the release tabs.