Installation Guide, Second Edition - HP Integrity BL60p Server Blade

Introduction
Power Subsystem (on System Board)
Chapter 1
24
Power Subsystem (on System Board)
Each server blade receives bulk DC voltage from the enclosure. Bulk DC voltage is then converted to the
required DC voltages needed by the server blade’s power block.
The server blade DC-to-DC power subsystem has two major components: E-Fuse (input fuse), and the LB40
(DC-to-DC conversion circuit). E-Fuse functionality provides an electronic fuse to support insertion and
removal of individual blades while -48 VDC inlet power is present on the enclosure backplane. It also
generates a non-switched 12 V output rail that is used to generate 3.3 V standby and 5.0 V standby voltage
rails through point-of-load (POL) converters. LB40 modules take the -48 VDC power from the enclosure
backplane through the E-Fuse, and generates a switched 12 V output rail when the server blade is powered
on.
All other switched voltage rails in the design are provided through POL converters that tap into this 12 V
switched rail. CPU power pods also connect to this switched 12 V rail, and are controlled through their
respective enable pins.
Nonswitched 3.3 V standby and 5.0 V voltage rails are always present to support power management,
minimal fans, baseboard management control (BMC), server blade management, and portions of the LAN
circuitry. The switched POL voltage rails are 12 V, 3.3 V, 5 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V and 1.25 V.
The 12 V, 5 V and 3.3 V standby power rails are energized whenever -48 VDC power is present to the blade.
The LB40 12 V output is turned on when a server blade power-on is detected and is sent to the system board
for direct use and for feeding a distributed system of DC-to-DC converters (POLs), which generate the
operating voltages that power the server blade circuitry.
To minimize peak power consumption, internal disk power-ups are staggered.
CPU / Core Electronics Complex
The server blade board houses two Zero Insertion Force (ZIF) CPU sockets, two application specific integrated
circuits (ASICs), clock generation and distribution circuitry, voltage conversion, boundary scan, ITP
(In-Target Probe for processors), and debug features.
Intel® Itanium® CPU Module
The CPU in the server blade is an Intel® Itanium® moderate-power (100 W), moderate-cost processor. The
processor operates at 1.6 GHz, and has 3 MB of cache enabled. The CPU module includes the CPU chip, the
CPU power pod (12 VDC in), a custom passive heatsink assembly (unique for the BL60p server blade), and
the hardware to attach all of the module pieces together.
The CPUs are connected to the main chipset component, through the front-side bus (FSB). In the server
blade, the FSB operates at 200 MHz, and since data can be transferred on each clock edge, the data transfer
rate is 400 MTransfers/sec peak (approximately 6 GB/s). One end of the FSB is electrically terminated with
the Zx1 ASIC. The other end of the bus is terminated with a CPU module. In the middle, you can load an
additional processor. For the server blade to function properly, the processor must be mounted in the module
farthest away from the ASIC to electrically terminate the FSB.