HP Integrity BL860c i2, BL870c i2 & BL890c i2 Server Blades WEEE Disassembly Instructions HP Part Number: AD399-9007A Published: April 2010 Edition: 1
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Table of Contents 1 Product End-of-Life Disassembly Instructions.................................................................5 Models and Descriptions........................................................................................................................5 Items Requiring Selective Treatment......................................................................................................5 HP Integrity BL860c i2...........................................................................
1 Product End-of-Life Disassembly Instructions The Waste from Electric and Electronic Equipment (WEEE) Disassembly Instructions manual is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of this product to remove components and materials requiring selective treatment. Models and Descriptions This document provides disassembly instructions for the servers listed.
Components and waste containing asbestos None Components, parts and materials containing refractory ceramic fibers None Components, parts and materials containing radioactive substances None HP Integrity BL870c i2 The following table lists the classified items requiring selective treatment for the HP Integrity BL870c i2 server blade Item Description Notes Qty. of Items Included in Product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 cm2.
HP Integrity BL890c i2 The following table lists the classified items requiring selective treatment for the HP Integrity BL890c i2 server blade Item Description Notes Qty. of Items Included in Product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 cm2. Up to 64 Batteries All types including standard alkaline 4 and lithium coin or button style batteries.
Product Disassembly Process The following table lists the basic steps that you should follow to remove components and materials requiring selective treatment. 8 Step Process 1 Battery – locate battery and remove by hand or small flat blade screw driver. 2 Capacitor – locate capacitor and pry from the printed circuit board with a large flat head screw driver. 3 Printed Circuit Boards – follow removal instructions found in the system specific documentation if needed.
