NonStop NS-Series Planning Guide (H06.04+)
Table Of Contents
- What’s New in This Manual
- About This Manual
- 1 System Hardware Overview
- 2 Installation Facility Guidelines
- 3 System Installation Specifications
- 4 Integrity NonStop NSSeries System Description
- NonStop System Primer
- NonStop Advanced Architecture
- NonStop Blade Complex
- Processor Element
- Duplex Processor
- Triplex Processor
- Processor Synchronization and Rendezvous
- Memory Reintegration
- Failure Recovery for Duplex Processor
- Failure Recovery for Triplex Processor
- ServerNet Fabric I/O
- System Architecture
- Modular Hardware
- NonStop S-Series I/O Hardware
- System Models
- Default Startup Characteristics
- Migration Considerations
- System Installation Document Packet
- 5 Modular System Hardware
- Modular Hardware Components
- Cabinets
- AC Power PDUs
- Modular Cabinet PDU Keepout Panel
- NonStop Blade Element
- Logical Synchronization Unit (LSU)
- LSU Indicator LEDs
- Processor Switch
- P-Switch Indicator LEDs
- Processor Numbering
- I/O Adapter Module (IOAM) Enclosure and I/O Adapters
- Fibre Channel Disk Module
- Tape Drive and Interface Hardware
- Maintenance Switch (Ethernet)
- Optional UPS and ERM
- System Console
- Enterprise Storage System
- Component Location and Identification
- NonStop S-Series I/O Enclosures
- Modular Hardware Components
- 6 System Configuration Guidelines
- Enclosure Locations in Cabinets
- Internal ServerNet Interconnect Cabling
- Cable Labeling
- Cable Management System
- Internal Interconnect Cables
- Dedicated Service LAN Cables
- Cable Length Restrictions
- Internal Cable Part Numbers
- NonStop Blade Elements to LSUs
- NonStop Blade Element to NonStop Blade Element
- LSUs to Processor Switches and Processor IDs
- Processor Switch ServerNet Connections
- Processor Switches to IOAM Enclosures
- FCSA to Fibre Channel Disk Modules
- FCSA to Tape Devices
- P-Switch to NonStop S-Series I/O Enclosure Cabling
- IOAM Enclosure and Disk Storage Considerations
- Fibre Channel Devices
- G4SAs to Networks
- Default Naming Conventions
- PDU Strapping Configurations
- 7 Example Configurations
- A Cables
- B Control, Configuration, and Maintenance Tools
- Support and Service Library
- System Console
- Maintenance Architecture
- Dedicated Service LAN
- IP Addresses
- Ethernet Cables
- SWAN Concentrator Restriction
- System-Up Dedicated Service LAN
- Dedicated Service LAN Links With One IOAM Enclosure
- Dedicated Service LAN Links to Two IOAM Enclosures
- Dedicated Service LAN Links With IOAM Enclosure and NonStop SSeries I/O Enclosure
- Dedicated Service LAN Links With NonStop S-Series I/O Enclosure
- Initial Configuration for a Dedicated Service LAN
- Operating Configurations for Dedicated Service LANs
- OSM
- System-Down OSM Low-Level Link
- AC Power Monitoring
- AC Power-Fail States
- C Guide to Integrity NonStop NSSeries Server Manuals
- Safety and Compliance
- Index

Installation Facility Guidelines
HP Integrity NonStop NS-Series Planning Guide—529567-005
2-5
Flooring
Flooring
Integrity NonStop NS-series servers can be installed either on the site’s floor with the
cables entering from above the equipment or on raised flooring with power and I/O
cables entering from underneath. Because cooling airflow through each enclosure in
the modular cabinets is front-to-back, raised flooring is not required for system cooling.
The site floor structure and any raised flooring (if used) must be able to support the
total weight of the installed computer system as well as the weight of the individual
modular cabinets and their enclosures as they are moved into position. To determine
the total weight of each modular cabinet with its installed enclosures, refer to Modular
Cabinet and Enclosure Weights With Worksheet on page 3-9.
For your site’s floor system, consult with your HP site preparation specialist or an
appropriate floor system engineer. If raised flooring is to be used, the design of the
Integrity NonStop NS-series server modular cabinet is optimized for placement on 24-
inch floor panels.
Dust and Pollution Control
NonStop servers do not have air filters. Any computer equipment can be adversely
affected by dust and microscopic particles in the site environment. Airborne dust can
blanket electronic components on printed circuit boards inhibiting cooling airflow and
causing premature failure from excess heat, humidity, or both. Metallically conductive
particles can short circuit electronic components. Tape drives and some other
mechanical devices can experience failures resulting from airborne abrasive particles.
For recommendations to keep the site as dust and pollution free as possible, consult
with your heating, ventilation, and air conditioning (HVAC) engineer or your HP site
preparation specialist.
Zinc Particulates
Over time, fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin
surfaces such as aged raised flooring panels and supports. If these whiskers are
disturbed, they can break off and become airborne, possibly causing computer failures
or operational interruptions. This metallic particulate contamination is a relatively rare
but possible threat. Kits are available to test for metallic particulate contamination, or
you can request that your site preparation specialist or HVAC engineer test the site for
contamination before installing any electronic equipment.
Receiving and Unpacking Space
Identify areas that are large enough to receive and to unpack the system from its
shipping cartons and pallets. Be sure to allow adequate space to remove the system
equipment from the shipping pallets using supplied ramps. Also be sure adequate










