NonStop NS-Series Planning Guide (H06.04+)
Table Of Contents
- What’s New in This Manual
- About This Manual
- 1 System Hardware Overview
- 2 Installation Facility Guidelines
- 3 System Installation Specifications
- 4 Integrity NonStop NSSeries System Description
- NonStop System Primer
- NonStop Advanced Architecture
- NonStop Blade Complex
- Processor Element
- Duplex Processor
- Triplex Processor
- Processor Synchronization and Rendezvous
- Memory Reintegration
- Failure Recovery for Duplex Processor
- Failure Recovery for Triplex Processor
- ServerNet Fabric I/O
- System Architecture
- Modular Hardware
- NonStop S-Series I/O Hardware
- System Models
- Default Startup Characteristics
- Migration Considerations
- System Installation Document Packet
- 5 Modular System Hardware
- Modular Hardware Components
- Cabinets
- AC Power PDUs
- Modular Cabinet PDU Keepout Panel
- NonStop Blade Element
- Logical Synchronization Unit (LSU)
- LSU Indicator LEDs
- Processor Switch
- P-Switch Indicator LEDs
- Processor Numbering
- I/O Adapter Module (IOAM) Enclosure and I/O Adapters
- Fibre Channel Disk Module
- Tape Drive and Interface Hardware
- Maintenance Switch (Ethernet)
- Optional UPS and ERM
- System Console
- Enterprise Storage System
- Component Location and Identification
- NonStop S-Series I/O Enclosures
- Modular Hardware Components
- 6 System Configuration Guidelines
- Enclosure Locations in Cabinets
- Internal ServerNet Interconnect Cabling
- Cable Labeling
- Cable Management System
- Internal Interconnect Cables
- Dedicated Service LAN Cables
- Cable Length Restrictions
- Internal Cable Part Numbers
- NonStop Blade Elements to LSUs
- NonStop Blade Element to NonStop Blade Element
- LSUs to Processor Switches and Processor IDs
- Processor Switch ServerNet Connections
- Processor Switches to IOAM Enclosures
- FCSA to Fibre Channel Disk Modules
- FCSA to Tape Devices
- P-Switch to NonStop S-Series I/O Enclosure Cabling
- IOAM Enclosure and Disk Storage Considerations
- Fibre Channel Devices
- G4SAs to Networks
- Default Naming Conventions
- PDU Strapping Configurations
- 7 Example Configurations
- A Cables
- B Control, Configuration, and Maintenance Tools
- Support and Service Library
- System Console
- Maintenance Architecture
- Dedicated Service LAN
- IP Addresses
- Ethernet Cables
- SWAN Concentrator Restriction
- System-Up Dedicated Service LAN
- Dedicated Service LAN Links With One IOAM Enclosure
- Dedicated Service LAN Links to Two IOAM Enclosures
- Dedicated Service LAN Links With IOAM Enclosure and NonStop SSeries I/O Enclosure
- Dedicated Service LAN Links With NonStop S-Series I/O Enclosure
- Initial Configuration for a Dedicated Service LAN
- Operating Configurations for Dedicated Service LANs
- OSM
- System-Down OSM Low-Level Link
- AC Power Monitoring
- AC Power-Fail States
- C Guide to Integrity NonStop NSSeries Server Manuals
- Safety and Compliance
- Index
System Installation Specifications
HP Integrity NonStop NS-Series Planning Guide—529567-005
3-11
Nonoperating Temperature, Humidity, and Altitude
Nonoperating Temperature, Humidity, and Altitude
•
Temperature:
°
Up to 72-hour storage: - 40° to 150° F (-40° to 66° C)
°
Up to 6-month storage: -20° to 131° F (-29° to 55° C)
°
Reasonable rate of change with noncondensing relative humidity during the
transition from warm to cold
•
Relative humidity: 10% to 80%, noncondensing
•
Altitude: 0 to 40,000 feet (0 to 12,192 meters)
Cooling Airflow Direction
Each enclosure includes its own forced-air cooling fans or blowers. Air flow for each
enclosure enters from the front of the modular cabinet and rack and exhausts at the
rear.
Typical Acoustic Noise Emissions
•
70 dB(A) (sound pressure level at operator position)
Tested Electrostatic Immunity
•
Contact discharge: 8 KV
•
Air discharge: 20 KV
Calculating Specifications for Enclosure
Combinations
The example configuration in this subsection shows listed components installed in a
single modular (42U) HP modular cabinet. Cabinet weight includes the PDUs and their
associated wiring and receptacles.
Power and thermal calculations assume that each enclosure in the cabinet is fully
populated; for example, a NonStop Blade Element with four processors. The power
and heat load is less when enclosures are not fully populated, such as a NonStop
Blade Element with fewer processors or less memory, a Fibre Channel disk module
with fewer disk drives, or an LSU enclosure with fewer LSUs.
AC current calculations assume that one PDU delivers all power. In normal operation,
the power is split equally between the two PDUs in the cabinet. However, calculate the
power load to assume delivery from only one PDU to allow the system to continue to
operate if one of the two AC power sources or PDUs fails.
This example show completed weight, power, and thermal calculations for each
cabinet in the system. For a total thermal load for a system with multiple cabinets, add
the heat outputs for all the cabinets in the system.










