NonStop NS-Series Planning Guide (H06.05+)

Installation Facility Guidelines
HP Integrity NonStop NS-Series Planning Guide—529567-008
2-5
Weight
mounted in ultra-thin server and storage enclosures, which are then deployed into
modular cabinets in large numbers. This higher concentration of devices results in
localized heat, which increases the potential for hot spots that can damage the
equipment.
Additionally, variables in the installation site layout can adversely affect air flows and
create hot spots by allowing hot and cool air streams to mix. Studies have shown that
above 70°F (20°C), every increase of 18°F (10°C) reduces long-term electronics
reliability by 50%.
Cooling airflow through each enclosure in the Integrity NonStop NS-series server is
front-to-back. Because of high heat densities and hot spots, an accurate assessment
of air flow around and through the server equipment and specialized cooling design is
essential for reliable server operation. For an airflow assessment, consult with your HP
cooling consultant or your heating, ventilation, and air conditioning (HVAC) engineer.
Because each modular cabinet houses a unique combination of enclosures, use the
Heat Dissipation Specifications and Worksheet on page 3-11 to calculate the total heat
dissipation for the hardware installed in each cabinet. For air temperature levels at the
site, refer to Operating Temperature, Humidity, and Altitude on page 3-12.
Weight
Modular cabinets for Integrity NonStop NS-series servers have a foot print and height
comparable to NonStop S-series servers with stacked enclosures. But each populated
modular cabinet in Integrity NonStop NS-series servers can be more than twice as
heavy as a NonStop S-series server stack. Because each modular cabinet houses a
unique combination of enclosures, total weight must be calculated based on what is in
the specific cabinet, as described in Modular Cabinet and Enclosure Weights With
Worksheet on page 3-10.
Flooring
Integrity NonStop NS-series servers can be installed either on the site’s floor with the
cables entering from above the equipment or on raised flooring with power and I/O
cables entering from underneath. Because cooling airflow through each enclosure in
the modular cabinets is front-to-back, raised flooring is not required for system cooling.
The site floor structure and any raised flooring (if used) must be able to support the
total weight of the installed computer system as well as the weight of the individual
modular cabinets and their enclosures as they are moved into position. To determine
the total weight of each modular cabinet with its installed enclosures, refer to Modular
Cabinet and Enclosure Weights With Worksheet on page 3-10.
Note. Failure of site cooling with the server continuing to run can cause rapid heat buildup and
excessive temperatures within the hardware. Excessive internal temperatures can result in full
or partial system shutdown. Ensure that the site’s cooling system remains fully operational
when the server is running.