NonStop NS-Series Servers Site Preparation (H06.03+)

Facility Guidelines
HP Integrity NonStop NS-Series Site Preparation Guide—527836-005
2-3
Power Cables for European Union
combination of enclosures, calculate the total power consumption for the hardware
installed in each cabinet as described in
Enclosure Power Loads on page 3-6. Then add together the total power consumption
values for all the modular cabinets in the system.
Power Cables for European Union
If your site is in one of the European Union (EU) countries or in an area that complies
with EU regulations, you can order Integrity NonStop NS-series modular cabinets with
PDU power cables specifically manufactured and color coded for use in the EU. These
are often called harmonized cables and comply with color coding and materials
standards different from those used in North America and Japan.
Uninterruptible Power Supply (UPS)
Unlike previous NonStop servers that used internal batteries for memory hold-up
through power failures, Integrity NonStop NS-series servers require either the optional
HP model R5500 XR UPS installed in each modular cabinet or a site UPS to support
system operation through a power failure. This system operation support can include a
planned orderly shutdown at a predetermined time in the event of an extended power
failure. A timely and orderly shutdown prevents an uncontrolled and asymmetric
shutdown of the system resources from depleted UPS batteries.
Extended runtime modules (ERMs) can be included with the R5500 XR UPS to extend
the power back-up time. For estimated back-up times, refer to Model R5500 XR
Integrated UPS on page 3-7. For further information on the R5500 XR UPS, contact
your HP representation or refer to the HP UPS R5500 XR Models User Guide; part
number 351642, available at:
http://h10032.www1.hp.com/ctg/Manual/c00065453.pdf
Cooling and Humidity Control
Do not rely on an intuitive approach to cooling design or to simply achieve an energy
balance—that is, summing up to the total power dissipation from all the hardware and
sizing a comparable air conditioning capacity. Today’s high-performance servers use
semiconductors that integrate multiple functions on a single chip with very high power
densities. These chips plus high power density mass storage and power supplies are
mounted in ultra-thin server and storage enclosures, which are then deployed into
computer racks in large numbers. This higher concentration of devices results in
localized heat, which increases the potential for hot spots that can damage the
equipment.
Additionally, variables in the installation site layout can adversely affect air flows and
create hot spots by allowing hot and cool air streams to mix. Studies have shown that
above 70°F (20°C), every increase of 18°F (10°C) reduces long-term electronics
reliability by 50%.