Operations Guide, Fourth Edition - HP Integrity rx1620

B System Information
Features Summary
Processor
• Two processor sockets
• One or two Itanium 2 CPUs: 1.3 GHz or 1.6 GHz, 3.0 MB L2 cache
• Front-side bus (FSB): 200MHz, double data rate, 6.4GB/s peak data bandwidth
Memory
• 8 memory DIMM slots
• 256MB, 512MB, 1GB and 2 GB standard 184-pin 2.5V DDR2100 registered ECC DIMMs (1.2"
height)
• 125MHz memory bus frequency, 250MTransfers/s data, 8 GB/s peak data bandwidth
• Minimum system memory: 512MB (2x 256MB DIMMs)
• Maximum system memory: 16GB with 2GB DIMMs
• DIMMs are installed in pairs or quads
• Specific four DIMM configuration enables lock-step mode, chip spare (chip kill), and
maximum memory bandwidth
I/O Expansion
• Two PCI-X 133MHz 64bit 3.3V slots
• Each PCI-X slot on a separate PCI-X bus
• Top PCI-X slot full length; bottom slot length
• One 25W or two 15W cards supported
Internal Core I/O
• Dual channel SCSI U320 controller (LSI SYM53C1030); 1 SCSI channel cabled internally for
integrated disks; 1 channel for 68pin external connector
• On internal disk backplane, two single connector attachment (SCA)-2 80-pin connectors for
hot-plug SCSI disks
• IDE controller with 1 internal cabled connection for an optional “slim-line” optical device
External core I/O
• One U320 SCSI 68pin HDCI connector
• Two 10/100/1000Base-T Ethernet LAN port RJ-45 connector
• Two USB 2.0 ports
• One 16550 compatible serial port (DB9 connector); console port if no management processor
(MP) card installed, general purpose serial port if MP installed
Power supply unit
• 100-240V AC inlet (autosensing)
• 460W DC output power
Motherboard manageability
• Baseboard Management Controller (BMC)
• Temperature monitoring & fan speed control by BMC
• BMC manageability console via built-in serial port
• IPMI protocol for communication between BMC, system, and ECI card
Features Summary 111