Site Preparation Guide - HP Integrity rx1620

General Site Preparation Guidelines
Electrical Factors
Chapter 3
24
• Better— A grounded #6 AWG minimum copper wire grid mechanically clamped to floor pedestals and
properly bonded to the building/site ground.
• Good—Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground
grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment
points for connection to service entrance ground and HP computer equipment). The use of conductive floor
tiles with this style of grid further enhances ground performance. The structure needs to be mechanically
bonded to a known good ground point.
Figure 3-1 Raised Floor Metal Strip Ground System
Equipment Grounding Implementation Details
Connect all HP equipment cabinets to the site ground grid as follows:
Step 1. Attach one end of each ground strap to the applicable cabinet ground lug.
Step 2. Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point
(nonraised floor).
Step 3. Check that the braid contact on each end of the ground strap consists of a terminal and connection
hardware (a 1/4-in. [6.0-mm] bolt, nuts, and washers).
Step 4. Check that the braid contact connection points are free of paint or other insulating material and
treated with a contact enhancement compound (similar to Burndy Penetrox).
Floor panel
Ground wire
to power panel
Band and pedestal
Grounding braid
to computer equipment
Hex bolt