Site Preparation Guide HP Integrity rx7620 Server Fourth Edition Manufacturing Part Number : A7027-96032 October 2006 Printed in the U.S.A. © Copyright 1979-2006 HP Development Company, L.P.
Legal Notices © Copyright 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Revision History First Edition Initial release. September 2003.
Contents 1. Introduction Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 System Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 I/O Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents Electrostatic Discharge Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Facility Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Floor Loading . . . . . . . . . . . . . . . . . . . . . .
Contents v
Contents vi
Contents vii
Contents viii
Tables Table 1-1. PCI-X Slot Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 1-2. Cell Board CPU Load Order. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 1-3. HP Integrity rx7620 Server DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 1-4. DIMM Load Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables x
Figures Figure 1-1. HP Integrity rx7620 Server (left-front view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 1-2. HP Integrity rx7620 Server (without front bezel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 1-3. System Backplane Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 1-4. PCI-X Board to Cell Board Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures xii
Figures xiii
Figures xiv
1 Introduction The HP Integrity rx7620 Server is a member of HP’s business-critical computing platform family: a mid-range, mid-volume server, positioned as an upgrade to the HP 9000 rp7410 product in the IA-64 product line. The HP Integrity rx7620 Server shares the same hardware as the HP 9000 rp7410 with changes to the cell board, CPU modules, core I/O and the PCI-X backplane. The HP Integrity rx7620 Server provides increased performance over its predecessor.
Introduction Overview Overview The HP Integrity rx7620 Server is a 10U, 8-socket Symmetric Multi-Processing, rack-mount server that accommodates up to 64 GB of memory, PCI-X I/O, and internal peripherals, including disks and DVD/tape. Its high availability features include N+1 hot-pluggable fans and power, redundant power cords, and hot-pluggable PCI-X cards and internal disks.
Introduction Overview Figure 1-2 HP Integrity rx7620 Server (without front bezel) System Backplane The system backplane comprises the system clock generation logic, the system reset generation logic, DC-to-DC converters, power monitor logic, and two Local Bus Adapter (LBA) link-to-PCI converter ASICs.
Introduction Overview Only half of the MP/SCSI Core I/O board set connects to the system backplane. The MP/SCSI boards plug into the backplane, while the LAN/SCSI boards plug into the PCI-X backplane. Figure 1-3 System Backplane Block Diagram System backplane MP Core I/O MP/SCSI PCI-X backplane Cell board 0 MP Core I/O MP/SCSI Cell board 1 Cell boards are perpendicular to the system backplane.
Introduction Overview of these high-speed bi-directional rope links for a total aggregate bandwidth of approximately 4 GB/sec. Each LBA acts as a bus bridge, supporting either one or two ropes and capable of driving 33 Mhz or 66 Mhz for PCI cards. The LBAs can also drive at 66 Mhz or 133 Mhz for PCI-X cards.
Introduction Overview Table 1-1 I/O Partition PCI-X Slot Types Slot Devicea 0 8 PCI (33 or 66 MHz) / PCI-X (66 or 133 MHz) 64-bit, 3.3V connector, Hot Plug Slot. 0 7 PCI (33 or 66 MHz) / PCI-X (66 or 133 MHz) 64-bit, 3.3V connector, Hot Plug Slot. 0 6 PCI (33 or 66 MHz) / PCI-X (66 or 133 MHz) 64-bit, 3.3V connector, Hot Plug Slot. 0 5 PCI (33 or 66 MHz) / PCI-X (66 or 133 MHz) 64-bit, 3.3V connector, Hot Plug Slot. 0 4 PCI (33 or 66 MHz) / PCI-X (66 or 133 MHz) 64-bit, 3.
Introduction Detailed HP Integrity rx7620 Server Description Detailed HP Integrity rx7620 Server Description Figure 1-5 HP Integrity rx7620 Server 8-Socket Block Diagram Cell Board 0 Cell Board 0 Memory Memory CPU CPU CPU PDH CC CPU CPU PDH CC CPU DVD/ Tape CPU CPU CC Link Bulk Power Supply (x2) Clocks Disk Backplane Reset System Backplane SBA Link PCI-X Power (x2) LBA LBA Disk Disk Disk Disk PCI SBA SBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA SC
Introduction Detailed HP Integrity rx7620 Server Description Cell Board The cell board contains several hardware blocks connected by several data buses. The major hardware blocks are the Central Processor Units (CPUs), the Cache Coherency Controller (CC), the memory Controllers, and the Memory. Minor hardware blocks include Clock Distribution, Power Distribution, Reset Circuit, and PDH Riser Board Interface.
Introduction Detailed HP Integrity rx7620 Server Description Figure 1-7 shows a simplified view of the memory subsystem. It consists of two independent access paths, each path having its own address bus, control bus, data bus, and DIMMs. In practice, the CC runs the two paths 180 degrees out of phase with respect to each other to facilitate pipelining in the CC. Address and control signals are fanned out through register ports to the synchronous dynamic random access memory (SDRAM) on the DIMMs.
Introduction Detailed HP Integrity rx7620 Server Description Central Processor Units The cell board can hold up to four CPU modules and can be populated with CPUs in increments of one after meeting the minimum of two CPUs installed on the cell board. On a cell board, the processors must be the same type and speed. See Table 1-2 for the CPU load order that must be maintained when adding CPUs to the cell board. Refer to Figure 1-8 for the locations on the cell board for installing CPUs.
Introduction Detailed HP Integrity rx7620 Server Description The HP Integrity rx7620 Server supports DIMMs with densities of 64, 128, 256, and 512 Mb for the SDRAM devices. Table 1-3 shows each supported DIMM size, the resulting total system capacity, and the memory component density. Each DIMM is connected to two buffer chips on the cell board. DIMMs must be loaded in sets of four at specific locations. For best performance, HP recommends loading sets of eight DIMMs.
Introduction Detailed HP Integrity rx7620 Server Description A quad seen in Figure 1-9 is a grouping of four DIMMs. Configurations with 8 or 16 DIMM slots loaded are recommended. The DIMM sizes in a quad can be different but the DIMMs in an echelon must be the same size.
Introduction Detailed HP Integrity rx7620 Server Description Cells and nPartitions NOTE In the following discussion, the term “cell” refers to a cell board. A cell board that has an I/O link to a bootable device and a console (usually supplied by an MP/SCSI Core I/O card) is a potential boot cell. The cell that contains the boot console I/O path is the called the root cell. Both cells are potential root cells. The primary or default root cell in a single nPartition system is the bottom cell (cell 1).
Introduction Detailed HP Integrity rx7620 Server Description Internal Disk Devices for HP Integrity rx7620 Server In an HP Integrity rx7620 Server, the top internal disk drives connect to cell 1 through the core I/O for cell 1. Both of the bottom disk drives connect to cell 0 through the core I/O for cell 0. The CD/DVD/DAT drive connects to cell 1 through the core I/O card for cell 1. Figure 1-10 Internal Disks DVD/CD/DAT Path: 1/0/0/3/1 Drive 1-1 Path: 1/0/0/3/0.6 Drive 1-2 Path: 1/0/1/0/0/1/1.
Introduction Detailed HP Integrity rx7620 Server Description Mass Storage (Disk) Backplane Internal mass storage connections to disks are routed on the mass storage backplane, having connectors and termination circuitry. All disks are hot-pluggable. The HP Integrity rx7620 Server accommodates one internal removable media device. Therefore, only one power connector for a removable media device is required on the mass storage backplane.
Introduction Server Description Server Description Dimensions The dimensions of the HP Integrity rx7620 Server are as follows: • Width: 44.45 cm (17.5 inches), constrained by EIA standard 19 inch racks. • Depth: Defined by cable management constraints to fit into standard 36-inch deep racks (Rittal/Compaq, Rosebowl I): 25.5 inches from front rack column to PCI connector surface 26.7 inches from front rack column to MP Core I/O connector surface 30 inches overall package dimension, including 2.
Introduction Server Description The bulk power supply section is partitioned by a sealed metallic enclosure located in the bottom of the package. This enclosure houses the N+1 fully redundant BPSs. Figure 1-11 Right-Front View of HP Integrity rx7620 Server PCI-X cards Front panel display board Cell boards PCI Power modules Bulk powers supplies The PCI-X card section, located toward the rear, is accessed by removing the top cover. The PCI OLR fan modules are located in front of the PCI-X cards.
Introduction Server Description Cell boards are accessed from the right side of the chassis behind a removable side cover.
A System Specifications This chapter describes the basic server configuration and its physical specifications and requirements.
System Specifications Dimensions and Weights Dimensions and Weights This section provides dimensions and weights of the system components. Table A-1 HP Integrity rx7620 Server Dimensions and Weights Standalone Packaged Height 17.3 in / 43.9 cm 35.75 in / 90.8 cm Width 17.5 in / 44.4 cm 28.0 in / 71.1 cm Depth 30.0 in / 76.2 cm 28.38 in / 72.0 cm Weight - Pounds (kilograms) 220 lb / 100 kg N/A The shipping box, pallet, ramp, and container adds approximately 50 lb to the total system weight.
System Specifications Electrical Specifications Electrical Specifications This section provides electrical specifications for HP Integrity rx7620 Servers. Grounding The site building shall provide a safety ground for each AC service entrance to all cabinets. Install a protective earthing conductor that is identical in size, insulation material, and thickness to the branch-circuit supply conductors. The PE conductor must be green with yellow stripes.
System Specifications Electrical Specifications Table A-4 AC Power Specifications Requirements Value Comments Nominal input voltage 200/208/220/230/240 (VAC rms) Frequency range (minimum maximum) 50 - 60 (Hz) Number of phases 1 Maximum input current 12 amps Per line cord Maximum inrush current 30 A peak for 15 ms Per line cord Power factor correction >0.98 >0.95 At all loads of 50% - 100% of supply rating At all loads 0f 25% - 50% of supply rating Ground leakage current (mA) <3.
System Specifications Environmental Specifications Environmental Specifications This section provides the environmental, power dissipation, noise emission, and airflow specifications for HP Integrity rx7620 Servers. Temperature and Humidity The cabinet is actively cooled using forced convection in a Class C1-modified environment. Operating Environment The system is designed to run continuously and meet reliability goals in an ambient temperature of 5° to 35° C at sea level.
System Specifications Environmental Specifications PCI/Mass Storage Section Cooling Six 92 mm fans located between the mass storage devices and the PCI card cage provide airflow through these devices. The PCI fans are powered with housekeeping power and run at full speed at all times. The air is pulled through the mass storage devices and pushed through the PCI Card Cage.
System Specifications Environmental Specifications Airflow The HP Integrity rx7620 Server requires that the cabinet air intake temperature be between 68° and 77° F (20° and 25° C) at 960 CFM. Figure A-1 illustrates the location of the inlet and outlet airducts on a single cabinet.
System Specifications System Requirements Summary System Requirements Summary This appendix summarizes the requirements that must be considered in preparing the site for the HP Integrity rx7620 Server. Power Consumption and Air Conditioning To determine the power consumed and the air conditioning required, follow the guidelines in Table A-5. NOTE When determining power requirements, consider any peripheral equipment that will be installed during initial installation or as a later update.
System Specifications System Requirements Summary Table A-7 Weight Summary (Continued) Component Quantity Multiply By DVD 2.2 lb / 1.0 kg Disk Drive 1.6 lb / 0.73 kg Chassis with skins and front bezel cover 131 lb / 59.
System Specifications System Requirements Summary 28 Appendix A
B General Site Preparation Guidelines Appendix B 29
General Site Preparation Guidelines Electrical Factors Electrical Factors NOTE Electrical practices and suggestions in this guide are based on North American practices. For regions and areas outside North America, local electrical codes will take precedence over North American electrical codes. An example would be the recommendation that the PE (Protective Earthing) conductor be green with yellow stripes.
General Site Preparation Guidelines Electrical Factors • Circuit breakers • An emergency power cutoff switch • Devices specific to the geographic location, such as earthquake protection Lighting Requirements for Equipment Servicing Adequate lighting and utility outlets in a computer room reduce the possibility of accidents during equipment servicing. Safer servicing is also more efficient and, therefore, less costly.
General Site Preparation Guidelines Electrical Factors • Wide and rapid variations in input power frequency • Electrical storms • Large inductive sources (such as motors and welders) • Faults in the distribution system wiring (such as loose connections) • Microwave, radar, radio, or cell phone transmissions Power System Protection The server can be protected from the sources of many of these electrical disturbances by using: • A dedicated power distribution system • Power conditioning equipment
General Site Preparation Guidelines Electrical Factors Building Distribution All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to provide ground continuity) Conduit that is exposed and subject to damage should be constructed of rigid galvanized steel. Power Routing Power drops and interface cables from the equipment are routed down from the power panel, through a grommet protected opening (beneath the floor level), and under the floor panels.
General Site Preparation Guidelines Electrical Factors Dual Power Source Grounding When dual power sources are utilized, strong consideration should be given to measure voltage potentials. The use of dual power might create an electrical potential that can be hazardous to personnel and might cause performance issues for the equipment. Dual power sources might originate from two different transformers or two different UPS devices.
General Site Preparation Guidelines Electrical Factors • Good—Use the raised floor structure as a signal reference grid. In this case, the floor must be designed as a ground grid with bolted stringers and corrosion resistive plating (to provide low resistance and attachment points for connection to service entrance ground and server equipment). The use of conductive floor tiles with this style of grid further enhances ground performance.
General Site Preparation Guidelines Electrical Factors System Installation Guidelines This section contains information about installation practices. Some common problems are highlighted. Both power cable and data communications cable installations are discussed. NOTE In domestic installations, the proper receptacles should be installed prior to the arrival of HP equipment. Refer to the appropriate installation guide for installation procedures.
General Site Preparation Guidelines Environmental Elements Environmental Elements The following environmental elements can affect server installation: • Computer room preparation • Cooling requirements • Humidity level • Air conditioning ducts • Dust and pollution control • Metallic particle contamination • Electrostatic discharge (ESD) prevention • Acoustics (noise reduction) Computer Room Preparation The following guidelines are recommended when preparing a computer room for the server: •
General Site Preparation Guidelines Environmental Elements • Reheating • Air distribution • System controls adequate to maintain the computer room within the operating range Lighting and personnel must also be included. For example, a person dissipates about 450 Btu per hour while performing a typical computer room task. At altitudes above 10,000 ft (3048 m), the lower air density reduces the cooling capability of air conditioning systems.
General Site Preparation Guidelines Environmental Elements If a ceiling plenum return air system or a ducted ceiling return air system is used, the return air grilles in the ceiling should be located directly above the computer equipment cabinets. The following three types of air distribution system are listed in order of recommendation: • Underfloor air distribution system.
General Site Preparation Guidelines Environmental Elements Humidity Level Maintain proper humidity levels at 40 to 55% RH. High humidity causes galvanic actions to occur between some dissimilar metals. This eventually causes a high resistance between connections, leading to equipment failures. High humidity can also have an adverse affect on some magnetic tapes and paper media. CAUTION Low humidity contributes to undesirably high levels of electrostatic charges. This increases the ESD voltage potential.
General Site Preparation Guidelines Environmental Elements Metallic Particle Contamination Metallic particulates can be especially harmful around electronic equipment. This type of contamination can enter the data center environment from a variety of sources, including but not limited to raised floor tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners, or worn printer components.
General Site Preparation Guidelines Environmental Elements • Ensure that all equipment and flooring are properly grounded and are at the same ground potential. • Use conductive tables and chairs. • Use a grounded wrist strap (or other grounding method) when handling circuit boards. • Store spare electronic modules in antistatic containers. • Maintain recommended humidity level and airflow rates in the computer room.
General Site Preparation Guidelines Facility Characteristics Facility Characteristics This section contains information about facility characteristics that must be considered for the installation or operation of the server. Facility characteristics are: • Floor loading • Windows • Altitude effects Floor Loading The computer room floor must be able to support the total weight of the installed computer system as well as the weight of the individual cabinets as they are moved into position.
General Site Preparation Guidelines Facility Characteristics Table B-3 Floor Loading Term Definitions (Continued) Term Definition Live load The load that the floor system can safely support. Expressed in lb/ft2 (kg/m2). Concentrated load The load that a floor panel can support on a one square inch (6.45 cm2) area at the panel’s weakest point (typically the center of the panel), without the surface of the panel deflecting more than a predetermined amount.
General Site Preparation Guidelines Facility Characteristics Table B-4 Typical Raised Floor Specifications (Continued) Itema Rating Concentrated loadb 1250 lb (567 kg) Ultimate load 4000 lb (1814 kg) per panel Rolling load 400 lb (181 kg) Average floor load 500 lb (227 kg) a. From Table B-3 on page 43 b. With 0.08 in. (0.2 cm) of span maximum deflection Windows Avoid housing computers in a room with windows. Sunlight entering a computer room can cause problems.
General Site Preparation Guidelines Space Requirements Space Requirements This section contains information about space requirements for an HP Integrity rx7620 Server. This data should be used as the basic guideline for space plan developments. Other factors, such as airflow, lighting, and equipment space requirements must also be considered. Delivery Space Requirements There should be enough clearance to move equipment safely from the receiving area to the computer room.
General Site Preparation Guidelines Space Requirements The service area space requirements, shown in Figure B-3, are minimum dimensions. If other equipment is located so that it exhausts heated air near the cooling air intakes of the computer system cabinets, larger space requirements are needed to keep ambient air intake to the computer system cabinets within the specified temperature and humidity ranges. Figure B-3 Footprint 24.0 in 58.8 cm Rack Rear Rear Anti-Tip Foot With Ballasat Service Area 36.
General Site Preparation Guidelines Equipment Footprint Templates Equipment Footprint Templates The equipment footprint template and floor plan grid are drawn to the same scale (0.25 in. = 1 ft). These templates are provided to show basic equipment dimensions and space requirements for servicing. The service areas shown on the template drawings are lightly shaded.
General Site Preparation Guidelines Computer Room Layout Plan Computer Room Layout Plan Use the following procedure to create a computer room layout plan: 1. Remove the floor plan grid from the document. See Figure B-4. 2. Remove a copy of each applicable equipment footprint template. See Figure B-3. 3. Cut out each template selected in 2, then place it on the floor plan grid. 4. Position the pieces until the desired layout is obtained, then fasten the pieces to the grid.
General Site Preparation Guidelines Computer Room Layout Plan Figure B-4 Planning Grid Scale: 1/4 inch = 1 foot 60SP016A 12/20/99 50 Appendix B
General Site Preparation Guidelines Power Plug Configuration Power Plug Configuration There are several different power cables designed for use with hp servers. The region the server ships to will determine which power cable ships with the server. The following provides the site preparation specialist with the knowledge of what to expect to receive based on the regional shipping destination.
General Site Preparation Guidelines Power Plug Configuration NOTE Several examples follow though this list is not meant to be all inclusive nor is this list meant to imply every plug shown is one that is available for the server.
General Site Preparation Guidelines Power Plug Configuration Figure B-11 L6-30 Plug Figure B-12 NEMA 5-20P Plug on left (receptacle on right) Figure B-13 ISI 32 Plug Appendix B 53
General Site Preparation Guidelines Power Plug Configuration Figure B-14 GB 1002 Plug Power Cable The power cable length and configuration will vary based on the region the server ships to. This is an example of one power cable configuration used to supply power to the server.
General Site Preparation Guidelines Conversion Factors and Formulas Conversion Factors and Formulas The conversion factors provided in this appendix are intended to ease data calculation for systems that do not conform specifically to the configurations listed in this Site Preparation Guide. Listed below are the conversion factors used in this document, as well as additional conversion factors which may be helpful in determining those factors required for site planning.
General Site Preparation Guidelines Sample of an Installation Schedule Sample of an Installation Schedule The following schedule lists the sequence of events for a typical system installation: • 60 days before installation — Floor plan design completed and mailed to HP (if required to be an HP task) • 30 days before installation — Primary power and air conditioning installation completed — Telephone and data cables installed — Fire protection equipment installed — Major facility changes completed — Spec
General Site Preparation Guidelines Sample Site Inspection Checklist Sample Site Inspection Checklist Table B-5 Customer and HP Information Customer Information Name: Phone No: Street Address: City or Town: State or Province: Country Zip or postal code: Primary customer contact: Phone No.: Secondary customer contact: Phone No.: Traffic coordinator: Phone No.
General Site Preparation Guidelines Sample Site Inspection Checklist Table B-6 Site Inspection Checklist (Continued) Please check either Yes or No. If No, include comment# or date 7. Are there channels or cutouts for cable routing? 8. Is there a remote console telephone line available with an RJ11 jack? 9. Is a telephone line available? 10. Are customer supplied peripheral cables and LAN cables available and of the proper type? 11. Are floor tiles in good condition and properly braced? 12.
General Site Preparation Guidelines Sample Site Inspection Checklist Table B-6 Site Inspection Checklist (Continued) Please check either Yes or No. If No, include comment# or date 23. Is there a telephone available for emergency purposes? 24. Is there a fire protection system in the computer room? 25. Is antistatic flooring installed? 26. Are there any equipment servicing hazards (loose ground wires, poor lighting, etc.)? Comment or Date Cooling No. Area or condition 27.
General Site Preparation Guidelines Delivery Survey Delivery Survey The delivery survey forms list delivery or installation requirements. If any of the items on the list apply, enter the appropriate information in the areas provided on the form. Special instructions or recommendations should be entered on the special instructions or recommendations form.
General Site Preparation Guidelines Delivery Survey • Special security requirements applicable to the facility, such as security clearance Figure B-16 Delivery Survey (Part 1) DELIVERY CHECKLIST DOCK DELIVERY Yes Is dock large enough for a semitrailer? No Circle the location of the dock and give street name if different than address. North East West South STREET DELIVERY Circle the location of access door and list street name if different than address.
General Site Preparation Guidelines Delivery Survey Figure B-17 Delivery Survey (Part 2) ELEVATOR Fill in the following information if an elevator is required to move equipment. Capacity (lb or kg) Depth Height Width Height Depth Width STAIRS Please list number of flights and stairway dimensions.
General Site Preparation Guidelines Delivery Survey Site Preparation Glossary A-B Apparent power A value of power for AC circuits that is calculated as the product of RMS current times RMS voltage, without taking the power factor into account. ASHRAE Standard 52-76 Industry standard for air filtration efficiency set forth by the American Society of Heating, Refrigerating, and Air-Conditioning Engineers, Inc. ASL Above sea level. board A printed circuit assembly (PCA). Also called a card or adapter.
General Site Preparation Guidelines Delivery Survey L-N Latent cooling capacity An air conditioning system's capability to remove heat from the air. Leakage current A term relating to current flowing between the AC supply wires and earth ground. The term does not necessarily denote a fault condition. In power supplies, leakage current usually refers to the 60 Hertz current, which flows through the EMI filter capacitors that are connected between the AC lines and ground.
General Site Preparation Guidelines Delivery Survey True power In an AC circuit, true power is the actual power consumed. It is distinguished from apparent power by eliminating the reactive power component that may be present. Typical input current The operating current of the product measured using a typical load and target voltage. Typical power consumption Represents the expected power consumption of a given configuration.
General Site Preparation Guidelines Delivery Survey 66 Appendix B
Index A air conditioning system recommendations, 38 air distribution system room space return air, 39 air ducts, 25 illustrated, 25 average floor loading, 44 B backplane mass storage, 15, 20 PCI, 4, 14 system, 4, 14, 17, 20, 23 basic air conditioning equipment requirements, 37 basic air distribution systems, 38 C cell board, 8, 17, 18, 20, 23 circuit breaker, 31 component power requirements, 21 computer room layout plan, 49 computer room safety fire protection, 30 computer system sample installation schedul
Index power quality, 31 power requirements component, 21 power system protection, 32 power wiring, 32 R raised floor ground system, illustrated, 35 S sources of electrical disturbances, 31 space requirements, 46 computer room layout, 49 delivery space requirements, 46 equipment footprint templates, 48 system backplane, 4, 14, 17, 20, 23 system installation guidelines, 36 data communications cables, 36 wiring connections, 36 system specifications, 19 T typical installation schedule, 56 W wiring connections,
Index 69
