HP Integrity rx7640 and HP 9000 rp7440 Servers Site Preparation Guide HP Part Number: AB312–9011A Published: November 2007 Edition: 4
© Copyright 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation.
Table of Contents About This Document.........................................................................................................9 Intended Audience.................................................................................................................................9 Publishing History..................................................................................................................................9 Related Information...................................................
Acoustic Noise Specification...........................................................................................................34 Airflow.............................................................................................................................................34 System Requirements Summary...........................................................................................................35 Power Consumption and Air Conditioning................................................
List of Figures 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 1-9 1-10 1-11 1-12 2-1 A-1 A-2 A-3 A-4 8-Socket Server Block Diagram.....................................................................................................14 Server (Front View With Bezel) ....................................................................................................15 Server (Front View Without Bezel)................................................................................................15 Right-Front View.........
List of Tables 1-1 1-2 1-3 1-4 1-5 1-6 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 Cell Board CPU Module Load Order............................................................................................19 Server DIMMs...............................................................................................................................21 PCI-X paths for Cell 0....................................................................................................................24 PCI-X Paths Cell 1........
About This Document This document covers the HP Integrity rx7640 and HP 9000 rp7440 Servers. This document does not describe system software or partition configuration in any detail. For detailed information concerning those topics, refer to the HP System Partitions Guide: Administration for nPartitions. Intended Audience This document is intended to be used by customer engineers assigned to support the HP Integrity rx7640 and HP 9000 rp7440 Servers.
Related Information You can access other information on HP server hardware management, Microsoft® Windows® administration, and diagnostic support tools at the following Web sites: http://docs.hp.com The main Web site for HP technical documentation is http://docs.hp.com. Server Hardware Information: http://docs.hp.com/hpux/hw/ The http://docs.hp.com/hpux/hw/ Web site is the systems hardware portion of docs.hp.com.
It provides HP nPartition server hardware management information, including site preparation, installation, and more. Windows Operating System Information You can find information about administration of the Microsoft® Windows® operating system at the following Web sites, among others: • http://docs.hp.com/windows_nt/ • http://www.microsoft.
HP Encourages Your Comments HP encourages your comments concerning this document. We are committed to providing documentation that meets your needs. Send any errors found, suggestions for improvement, or compliments to: feedback@fc.hp.com Include the document title, manufacturing part number, and any comment, error found, or suggestion for improvement you have concerning this document.
1 HP Integrity rx7640 Server and HP 9000 rp7440 Server Overview The HP Integrity rx7640 and HP 9000 rp7440 Servers are members of HP’s business-critical computing platform family in the mid-range product line. The information in chapters one through six of this guide applies to the HP Integrity rx7640 and HP 9000 rp7440 Servers, except for a few items specifically denoted as applying only to the HP Integrity rx7640 Server. Chapter seven covers any information specific to the HP 9000 rp7440 Server only.
Figure 1-1 8-Socket Server Block Diagram Cell Board 0 Cell Board 0 Memory Memory CPU CPU PDH CPU CC CPU CPU PDH CC CPU CPU DVD/ Tape CPU CC Link Bulk Power Supply (x2) Disk Backplane Clocks Reset System Backplane LBA SBA Link PCI-X Power (x2) Disk Disk Disk PCI SBA SBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA SCSI LAN/SCSI Boards Indicates hot pluggable link or bus SCSI SCSI LAN LAN SCSI SCSI MP MP LAN/SCSI Boards Indicates cable PCI-X Di
Figure 1-2 Server (Front View With Bezel) Figure 1-3 Server (Front View Without Bezel) Power Switch Removable Media Drive PCI Power Supplies Front OLR Fans Bulk Power Supplies Hard Disk Drives Detailed Server Description 15
The server has the following dimensions: • Depth: Defined by cable management constraints to fit into standard 36-inch deep rack: 25.5 inches from front rack column to PCI connector surface 26.7 inches from front rack column to MP Core I/O connector surface 30 inches overall package dimension, including 2.7 inches protruding in front of the front rack columns. • • Width: 44.45 cm (17.5 inches), constrained by EIA standard 19 inch racks. Height: 10U – 0.54 cm = 43.91 cm (17.287 inches).
The PCI OLR fan modules are located in front of the PCI-X cards. These six 9.2-cm fans are housed in plastic carriers. They are configured in two rows of three fans. Four OLR system fan modules, externally attached to the chassis, are 15-cm (6.5-inch) fans. Two fans are mounted on the front surface of the chassis and two are mounted on the rear surface. The cell boards are accessed from the right side of the chassis behind a removable side cover.
Figure 1-6 Front Panel LEDs and Power Switch Cell Board The cell board, illustrated in Figure 1-7, contains the processors, main memory, and the CC application specific integrated circuit (ASIC) which interfaces the processors and memory with the I/O, and to the other cell board in the server. The CC is the heart of the cell board, enabling communication with the other cell board in the system. It connects to the processor dependent hardware (PDH) and micro controller hardware.
Because of space limitations on the cell board, the PDH and microcontroller circuitry resides on a riser board that plugs into the cell board at a right angle. The cell board also includes clock circuits, test circuits, and de-coupling capacitors. PDH Riser Board The PDH riser board is a small card that plugs into the cell board at a right angle.
Figure 1-8 CPU Locations on Cell Board Socket 2 Socket 3 Cell Controller Socket 1 Socket 0 Memory Subsystem Figure 1-9 shows a simplified view of the memory subsystem. It consists of two independent access paths, each path having its own address bus, control bus, data bus, and DIMMs . Address and control signals are fanned out through register ports to the synchronous dynamic random access memory (SDRAM) on the DIMMs. The memory subsystem comprises four independent quadrants.
Figure 1-9 Memory Subsystem DIMMs The memory DIMMs used by the server are custom designed by HP. Each DIMM contains DDR-II SDRAM memory that operates at 533 MT/s. Industry standard DIMM modules do not support the high availability and shared memory features of the server. Therefore, industry standard DIMM modules are not supported. The server supports DIMMs with densities of 1, 2, and 4 Gb.
On the server, each nPartition has its own dedicated portion of the server hardware which can run a single instance of the operating system. Each nPartition can boot, reboot, and operate independently of any other nPartitions and hardware within the same server complex. The server complex includes all hardware within an nPartition server: all cabinets, cells, I/O chassis, I/O devices and racks, management and interconnecting hardware, power supplies, and fans.
System Backplane The system backplane contains the following components: • • • • • The system clock generation logic The system reset generation logic DC-to-DC converters Power monitor logic Two local bus adapter (LBA) chips that create internal PCI buses for communicating with the core I/O card The backplane also contains connectors for attaching the cell boards, the PCI-X backplane, the core I/O board set, SCSI cables, bulk power, chassis fans, the front panel display, intrusion switches, and the system
board 0 and cell board 1 communicates through an SBA over the SBA link. The SBA link consists of both an inbound and an outbound link with an effective bandwidth of approximately 11.5 GB/sec. The SBA converts the SBA link protocol into “ropes.” A rope is defined as a high-speed, point-to-point data bus. The SBA can support up to 16 of these high-speed bi-directional rope links for a total aggregate bandwidth of approximately 11.5 GB/sec.
Table 1-4 PCI-X Paths Cell 1 Cell PCI-X Slot I/O Chassis Path 1 1 1 1/0/8/1 1 2 1 1/0/10/1 1 3 1 1/0/12/1 1 4 1 1/0/14/1 1 5 1 1/0/6/1 1 6 1 1/0/4/1 1 7 1 1/0/2/1 1 8 1 1/0/1/1 The server supports two internal SBAs. Each SBA provides the control and interfaces for eight PCI-X slots. The interface is through the rope bus (16 ropes per SBA).
Table 1-5 PCI-X Slot Types I/O Partition Slot1 0 1 1 Maximum MHz Maximum Peak Ropes Bandwidth Supported Cards PCI Mode Supported 8 133 533 MB/s 001 3.3 V PCI or PCI-X Mode 1 7 133 1.06 GB/s 002/003 3.3 V PCI or PCI-X Mode 1 6 266 2.13 GB/s 004/005 3.3 V or 1.5 V PCI-X Mode 2 5 266 2.13 GB/s 006/007 3.3 V or 1.5 V PCI-X Mode 2 4 266 2.13 GB/s 014/015 3.3 V or 1.5 V PCI-X Mode 2 3 266 2.13 GB/s 012/013 3.3 V or 1.5 V PCI-X Mode 2 2 133 1.06 GB/s 010/011 3.
to the cell controller chip on cell board 2, and the ASIC on cell location 1 connects to the cell controller chip on cell board 3 through external link cables. Downstream, the ASIC spawns 16 logical 'ropes' that communicate with the core I/O bridge on the system backplane, PCI interface chips, and PCIe interface chips. Each PCI chip produces a single 64–bit PCI-X bus supporting a single PCI or PCI-X add-in card. Each PCIe chip produces a single x8 PCI-Express bus supporting a single PCIe add-in card.
Table 1-6 PCI-X/PCIe Slot Types (continued) I/O Partition Slot1 Maximum Peak Maximum MHz Bandwidth Ropes Supported Cards PCI Mode Supported 1 8 66 533 MB/s 001 3.3 V PCI or PCI-X Mode 1 7 133 1.06 GB/s 002/003 3.3 V PCI or PCI-X Mode 1 6 266 2.13 GB/s 004/005 3.3 V PCI-e 5 266 2.13 GB/s 006/007 3.3 V PCI-e 4 266 2.13 GB/s 014/015 3.3 V PCI-e 3 266 2.13 GB/s 012/013 3.3 V PCI-e 2 133 1.06 GB/s 010/011 3.3 V PCI or PCI-X Mode 1 1 133 1.06 GB/s 008/009 3.
2 Server Site Preparation This chapter describes the basic server configuration and its physical specifications and requirements. Dimensions and Weights This section provides dimensions and weights of the system components. Table 2-1 gives the dimensions and weights for a fully configured server. Table 2-1 Server Dimensions and Weights Standalone Packaged Height- Inches (centimeters) 17.3 (43.9) 35.75 (90.8) Width- Inches (centimeters) 17.5 (44.4) 28.0 (71.1) Depth- Inches (centimeters) 30.0 (76.
Table 2-3 Example Weight Summary (continued) Component Quantity Multiply Weight (kg) DVD drive 1 2.2 (1.0) 4.4 (2.0) Hard disk drive 4 1.6 (0.73) 6.40 (2.90) Chassis with skins and front bezel cover 1 90.0(41.0) 131.0 (59.42) Total weight 286.36 (129.89) Table 2-4 Weight Summary Component Quantity Multiply By Cell Board 27.8 (12.16) PCI Card 0.34 (0.153) Power Supply (BPS) 18 (8.2) DVD Drive 2.2 (1.0) Hard Disk Drive 1.6 (0.73) Chassis with skins and front bezel cover 90.
Table 2-5 Power Cords Part Number Description Where Used 8120-6895 Stripped end, 240 volt International - Other 8120-6897 Male IEC309, 240 volt International - Europe 8121-0070 Male GB-1002, 240 volts China 8120-6903 Male NEMA L6-20, 240 volt North America/Japan System Power Specifications Table 2-6 and Table 2-7 list the AC power requirements for the servers. These tables provide information to help determine the amount of AC power needed for your computer room.
load. This number can safely be used to compute thermal loads and power consumption for the system under all conditions. Environmental Specifications This section provides the environmental, power dissipation, noise emission, and airflow specifications for the server. Temperature and Humidity The cabinet is actively cooled using forced convection in a Class C1-modified environment. The recommended humidity level for Class C1 is 40 to 55% relative humidity (RH).
Environmental Temperature Sensor To ensure that the system is operating within the published limits, the ambient operating temperature is measured using a sensor placed near the chassis inlet, between the cell boards. Data from the sensor is used to control the fan speed and to initiate system overtemp shutdown. Non-Operating Environment The system is designed to withstand ambient temperatures between -40° to 70° C under non-operating conditions.
Table 2-9 Typical Server Configurations for the HP Integrity rx7640 Server (continued) Cell Boards Memory Per PCI Cards Cell Board (assumes 10 watts each) DVDs Hard Disk Core I/O Bulk Power Drives Supplies Typical Power Typical Cooling Qty GBytes Qty Qty Qty Qty Qty Watts BTU/hr 2 8 8 0 2 2 2 1921 6558 1 8 8 0 1 1 2 1262 4308 The air conditioning data is derived using the following equations. • • • Watts x (0.860) = kcal/hour Watts x (3.
Figure 2-1 Airflow Diagram System Requirements Summary This section summarizes the requirements that must be considered in preparing the site for the server. Power Consumption and Air Conditioning To determine the power consumed and the air conditioning required, follow the guidelines in Table 2-9. NOTE: When determining power requirements, consider any peripheral equipment that will be installed during initial installation or as a later update.
A Templates This appendix contains blank floor plan grids and equipment templates. Combine the necessary number of floor plan grid sheets to create a scaled version of the computer room floor plan. Figure A-1 illustrates the overall dimensions required for the server. Figure A-1 Server Space Requirements Equipment Footprint Templates Equipment footprint templates are drawn to the same scale as the floor plan grid (1/4 inch = 1 foot).
2. 3. 4. 5. Cut and join them together (as necessary) to create a scale model floor plan of your computer room. Remove a copy of each applicable equipment footprint template. Cut out each template selected in step 3; then place it on the floor plan grid created in step 2. Position pieces until the desired layout is obtained; then fasten the pieces to the grid. Mark locations of computer room doors, air-conditioning floor vents, utility outlets, and so on.
Figure A-3 Planning Grid Computer Room Layout Plan 39
Figure A-4 Planning Grid 40 Templates
Index A O air ducts, 34 illustrated, 35 ASIC, 13 operating environment, 32 B backplane mass storage, 28, 29 PCI, 23, 28 system, 17, 23, 28, 29, 33 C cell board, 16, 17, 18, 29, 33 cell controller, 13 component power requirements, 31 controls, 17 core I/O, 13 D DAT, 13 dimensions and weights, 29 DIMMs, 20 memory, 20 disk internal, 28 disk drive, 13 DVD/CD, 13 E P PCI, 13 PCI backplane, 23, 28 PDH riser board, 19 power plugs, 13 requirement, 13 power cords, 30 power requirements component, 31 power su
