Site Preparation Guide, Server Expansion Unit for the HP Integrity rx8640 Server Expansion Unit for the HP Integrity rx8640 HP Part Number: AB301-9009A Published: September 2007 Edition: Third Edition
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Table of Contents About this Document..........................................................................................................9 Book Layout............................................................................................................................................9 Intended Audience.................................................................................................................................9 Printing History..................................................
A Templates......................................................................................................................31 Equipment Footprint Templates...........................................................................................................31 Computer Room Layout Plan...............................................................................................................31 Index................................................................................................
List of Figures 1-1 1-2 1-3 1-4 1-5 1-6 1-7 2-1 A-1 A-2 A-3 A-4 SEU (Front View)...........................................................................................................................11 SEU (Without Front Bezel)............................................................................................................12 SEU Block Diagram.......................................................................................................................17 Internal Disks................
List of Tables 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 2-1 2-2 2-3 2-4 2-5 2-6 2-7 SEU Core I/O Boot Path.................................................................................................................13 Cell 2 PCI Slot Boot Paths..............................................................................................................15 Cell 3 PCI Slot Boot Paths..............................................................................................................
About this Document This document covers the new HP Server Expansion Unit. This document does not describe system software or partition configuration operations in any detail. For information concerning those topics refer to the HP System Partitions Guide.
information for IT professionals on a wide variety of topics, including software, hardware, and networking. Books about HP-UX Published by Prentice Hall The http://www.hp.com/hpbooks/ Web site lists the HP books that Prentice Hall currently publishes, such as HP-UX books including: • HP-UX 11i System Administration Handbook http://www.hp.com/hpbooks/prentice/ptr_0130600814.html • HP-UX Virtual Partitions http://www.hp.com/hpbooks/prentice/ptr_0130352128.
1 Server Expansion Unit Overview The Server Expansion Unit (SEU) is a member of the HP business-critical computing platform family: a 9U tall, mid-range, mid-volume I/O expansion cabinet. It provides additional I/O performance with the inclusion of 16 PCI-X slots or a combination of 8 PCI-X slots and 8 PCI-e slots, two additional core I/O cards, four more hard disk drives, and two removable media drives. The SEU connects to the HP Integrity rx8640 server, providing additional I/O slots to the server.
Figure 1-2 SEU (Without Front Bezel) Features include: • • • • • • • • • • • Better availability and up time than previous SEU Depth optimized (shallower, fewer racking issues) Increased performance density Increased PCI-X performance Internal removable media Up to four additional internal disks Dual power cords enable N+1 redundancy on AC input Up to sixteen additional PCI-X slots Combination of eight additional PCI-X slots and eight additional PCI-e slots (with PCI-X/PCIe backplane).
contains clock generation circuits, manageability circuits, DC-to-DC converters, power monitor logic, and fan control. Core I/O Backplane Module The core I/O backplane is housed in a separate sheet metal module holding the backplane and the core I/O boards. This module can be removed from the rear of the chassis for easy access to the core I/O backplane. The module adapts the core I/O sockets in a horizontal mounting position to the system backplane, which is mounted vertically.
Table 1-1 SEU Core I/O Boot Path (continued) Core I/O card Device Path Description 3 1 Gb LAN 3/0/0/1/0 The SYS LAN connector located on core I/O 3. 3 SCSI drive 3/0/0/2/0.6.0 Hard drive located in the bottom left disk bay. 3 SCSI drive 3/0/0/2/1.X.0 Removable media DVD (X = 2) or DDS-4 (X = 3) tape drive located in the upper disk bay. 3 SCSI drive 3/0/0/3/0.6.0 Hard drive located in the bottom right disk bay.
NOTE: Fans driven to a high RPM in dense air cannot maintain expected RPM and will be considered bad by the MP leading to a “False Fan Failure” condition. PCI-X Slot Boot Paths Table 1-3 and Table 1-3 list the mapping of PCI-X slots to ropes and boot paths. Pathing will have to be modified for PCI cards that have different devices and functions.
Each PCI/PCI-X slot has a host-to-PCI bridge associated with it, and each PCIe slot has a host-to-PCIe bridge associated with it. A dual slot hot swap controller chip and related logic is also associated with each pair of PCI or PCIe slots. The I/O chip on either cell location 0 or 1 is a primary I/O system interface. Upstream, the I/O chips communicate directly with the cell controller ASIC on the host cell board via a high bandwidth logical connection known as the HSS link.
Detailed SEU Description Figure 1-3 SEU Block Diagram Rope100 Mercury ASIC Single Rope to Core I/O 1 Rope101 E-Link to Cell 1 or Cell 3 Rope103 Gemini ASIC Escalante ASIC 1 LEDs +3.3VAUX +3.3V +5V +12V -12V LEDs Slot1_7 PCI-X 133MHZ Bus Gemini ASIC Slo1_6 PCI-X 266MHZ Bus Dual HotSwap Controller Gemini ASIC Rope104 Rope105 Rope106 Rope107 Rope117 Rope116 Rope115 Rope114 Slot1_8 PCI-X 66/133MHZ Bus Dual HotSwap Controller Rope102 LEDs +3.3VAUX +3.
Figure 1-4 Internal Disks Slot 0 Drive Slot 0 Media Slot 1 Drive Slot 3 Drive Slot 1 Media Slot 2 Drive Table 1-4 Removable DVD Media Drive Path DVD Media Path Slot 0 Media 2/0/0/2/1.2.0 Slot 1 Media 3/0/0/2/1.2.0 Table 1-5 Removable DDS-4 Media Drive Path DDS-4 Media Path Slot 0 Media 2/0/0/2/1.3.0 Slot 1 Media 3/0/0/2/1.3.0 Table 1-6 Hard Disk Drive Path Hard Drive Path Slot 0 Drive 2/0/0/2/0.6.0 Slot 1 Drive 2/0/0/3/0.6.0 Slot 2 Drive 3/0/0/2/0.6.0 Slot 3 Drive 3/0/0/3/0.6.
Figure 1-5 System Backplane (Side View in Chassis) System Backplane The voltage regulator modules (VRMs) that provide 3.3 V and 3.3 V standby are located on this backplane. The backplane also has the connectors to provide a hardware interface to the SEU chassis. Clocks and Reset The system backplane contains reset and clock circuitry that propagates through the whole system. The system backplane central clocks drive all major chip set clocks.
slots are keyed for 3.3V connectors (accepting both Universal and 3.3V cards). The PCI-X backplane does not provide any 5V slots for the I/O cards. The external link for the SEU attaches the cell controller on cell board 2 to SBA 0 and attaches the cell controller on cell board 3 to SBA 1 of the PCI-X board in the SEU cabinet. The PCI-X backplane is physically one board but behaves like two independent partitions. SBA 0 and its associated LBAs and eight PCI-X slots form one I/O partition.
Table 1-8 PCI-X/PCIe I/O Backplane Slot Types I/O Partition 0 1 1 2 Slot1 Maximum Speed MHz Ropes Supported Cards PCI Mode Supported 82 66 001 3.3 V PCI or PCI-X Mode 1 7 133 002/003 3.3 V PCI or PCI-X Mode 1 6 266 004/005 3.3 V PCIe 5 266 006/007 3.3 V PCIe 4 266 014/015 3.3 V PCIe 3 266 012/013 3.3 V PCIe 2 133 010/011 3.3 V PCI or PCI-X Mode 1 1 133 008/009 3.3 V PCI or PCI-X Mode 1 82 66 001 3.3 V PCI or PCI-X Mode 1 7 133 002/003 3.
SEU Description Dimensions The dimensions of the SEU are as follows: • • Width: 17.5 inches, constrained by electronic industries alliance (EIA) standard 19-inch racks. Depth: Defined by cable management constraints to fit into a standard 36-inch deep rack: * 25.5 inches from front rack column to PCI connector surface. * 26.7 inches from front rack column to core I/O connector surface. * 30 inches overall package dimension, including 2.7 inches protruding in front of the front rack columns.
The PCI on-line replacement (OLR) fan modules are located in front of the PCI cards. These six fans are housed in plastic carriers. They are configured in two rows of three fans. Four OLR system fan modules, externally attached to the chassis, are 120-mm (4.7-inch) fans. Two fans are mounted on the front surface of the chassis and two are mounted on the rear surface.A cable harness that connects from the rear of the BPSs to the system backplane provides DC power distribution.
2 Server Site Preparation This chapter describes the basic configuration, physical specifications and requirements for the server. Dimensions and Weights This section provides dimensions and weights of the Server Expansion Unit components. Table 2-1 SEU Dimensions and Weights Standalone Packaged Height—Inches (centimeters) 15.8 (40.0) 28.0 (71.1) Width—Inches (centimeters) 17.5 (44.5) 28.38 (72.1) Depth—Inches (centimeters) 30.0 (76.2) 35.75 (90.8) Weight1—Pounds (kilograms) 165 (74.8) 210.
Circuit Breaker The Marked Electrical for the SEU is 7A per line cord. The recommended circuit breaker size is 20 amps for North America. For countries outside North America, consult your local electrical authority that has jurisdiction for the recommended circuit breaker size. The SEU contains two C20 power receptacles located at the bottom rear bulkhead. A minimum of one power cord must be used to maintain normal operation of the SEU.
Table 2-5 System Power Requirements Power Required (50 - 60 Hz) Watts VA Comments Maximum Theoretical Power 921 940 See Note 1 Marked Electrical Power ––– 1300 30A @ 180 VAC, See Note 2 Typical Maximum Power 601 613 See Note 3 Note 1: Maximum Theoretical Power: or “Maximum Configuration” (Input power at the ac input expressed in Watts and Volt-Amps to take into account Power factor correction.) The calculated sum of the maximum worst case power consumption for every subsystem in the server.
Table 2-6 Example ASHRAE Thermal Report (continued) Condition Full configuration Typical configuration 601 394 ASHRAE class 150 150 255 255 165 165 70.50 75.00 h=17.29 401.32 w=17.50 444.50 d=30.00 762.00 h=17.29 401.32 w=17.50 444.50 d=30.00 762.
ventilation and to help reduce the localized airflow dead spots that typically occur at the faceplate tail of each PCI card. Standby Cooling Several components within the chassis consume significant amounts of power while the system is in standby mode. The fans within the power supply operate at full speed during standby. Typical Power Dissipation and Cooling Table 2-7 provides calculations for configurations exactly as described in the table.
Figure 2-1 Airflow Diagram 30 Server Site Preparation
A Templates This appendix contains blank floor plan grids and equipment templates. Combine the necessary number of floor plan grid sheets to create a scaled version of the computer room floor plan. Figure A-1 illustrates the overall dimensions required for the servers. Figure A-1 Server Space Requirements Equipment Footprint Templates Equipment footprint templates are drawn to the same scale as the floor plan grid (1/4 inch = 1 foot).
2. 3. 4. 5. Cut and join them together (as necessary) to create a scale model floor plan of your computer room. Remove a copy of each applicable equipment footprint template (Figure A-2). Cut out each template selected in step 3; then place it on the floor plan grid created in step 2. Position pieces until you obtain the desired layout, then fasten the pieces to the grid. Mark locations of computer room doors, air-conditioning floor vents, utility outlets, and so on.
Figure A-3 Planning Grid Computer Room Layout Plan 33
Figure A-4 Planning Grid 34 Templates
Index AC power specifications, 26 air ducts, 29 illustrated, 30 PCI-X/PCIe I/O backplane backplane, 15 power cords, 26 power requirements component, 26 B S backplane, 18 mass storage, 21, 25 PCI, 12, 19 PCI-X, 14 PCI-X/PCIe I/O backplane, 15 system, 12, 18, 19, 21, 23, 25, 28 system backplane, 12, 18, 19, 21, 23, 25, 28 system specifications, 25 A T temperature, 27 Templates, 31 C cell board, 18, 19, 22, 25, 28 circuit breaker, 26 component power requirements, 26 computer system air ducts, 29 coolin
