HP Integrity Superdome 2 User Service Guide

2 System specifications
Dimensions and weights
Component dimensions
Table 1 Component dimensions
Height (in/cm)Depth (in/cm)Width (in/cm)Component
31.4/79.832.6/82.817.6/44.7Compute enclosure
24.48/62.1819.69/50.012.02/5.13Server blade
6.8/17.322.5/57.217.2/43.7I/O expansion enclosure
Component weights
Table 2 Compute enclosure weights
Max quantity per enclosureWeight (lb/kg)Component
1143.0/64.9Compute enclosure chassis
1
148.7/22.1I/O chassis
2
141.5/18.8Midplane Brick
18.0/3.6Onboard Administrator tray
152.7/0.9Active Cool Fan
125.0/2.3Power supply module
14.7/2.1DVD module
21.8/0.8Onboard Administrator module
22.6/1.2GPSM
47.3/3.3XFM
82.9/1.3I/O interconnect module
3
1
Does not include I/O chassis or Midplane Brick.
2
Part of the enclosure assembly the XFM and I/O switch modules install into
3
Maximum weight for an interconnect module.
Table 3 Other component weights
Weight (lb/kg)Component
65.0/29.5IOX enclosure
1
35.0/15.9CB900s i2 or CB900s i4 Server Blade
2
1
Fully loaded with all PCIe cards
2
Fully loaded with all DIMMs
For more information about general site preparation guidelines, see the Generic Site Preparation
Guide.
Dimensions and weights 21