HP Modular Cooling System Generation 2 site preparation guide - Technical white paper

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Chapter 1: HP Modular Cooling System
Generation 2 overview
This chapter provides an overview of the HP Modular Cooling System Generation 2. Throughout this
chapter, the various specifications and aspects of the system are defined as thoroughly as possible so
that all data is considered for a successful site preparation.
Product overview
The HP Modular Cooling System Generation 2 (MCS G2) is a modular, distributed cooling solution
that removes the high levels of heat generated by today’s advanced server and mass storage systems.
The HP MCS G2 provides a uniform, effective, affordable, and distributed cooling approach for
servers and other IT equipment installed in server racks. The HP MCS G2 (figure 1) is a closed-loop
cooling system integrated as part of a nonventilated server enclosure, in contrast to a conventional
‖open‖ server enclosure with perforated front and rear doors.
Figure 1: HP MCS G2 air flow
The special horizontal air flow of the HP MCS G2 fully supports the industry-standard front-to-back
cooling principle (i.e., cold air is drawn into the front of the server and warm air is expelled out of the
rear of the unit). All devices receive adequate and evenly distributed cool air regardless of their
mounting position within the enclosure. The HP MCS G2 distributes precisely cooled, targeted air flow
evenly across the front of the IT equipment. Warmed air is then channeled from the rear of the IT
equipment into the side-mounted HP MCS G2 unit, cooled, then recirculated back to the front of the
equipment stack. In the dual IT rack configuration, the left side panel of HP MCS G2 cooling unit is
removed to provide cooling and air recirculation for an additional IT rack. In this configuration, the
cooling capacity of the HP MCS G2 is divided between the two IT racks.