HP StorageWorks Disk enclosure I/O module replacement instructions (504221-001, September 2009)

HP StorageWorks
Disk enclosure I/O module
replacement instructions
This document details the procedures for replacing a
failed I/O module in an HP enclosure.
© Copyright 2009 Hewlett-Packard Development Company, L.P.
First edition: June 2009
The information in this document is subject to change without notice.
Printed in the US
www.hp.com
*504221-001*
About this document
For the latest documentation, go to http://www.hp.com/support/
manuals, and select your product.
The information contained herein is subject to change without notice.
The only warranties for HP products and services are set forth in the
express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional
warranty. HP shall not be liable for technical or editorial errors or
omissions contained herein.
WARRANTY STATEMENT: To obtain a copy of the warranty for this
product, see the warranty information website: h
ttp://www.hp.com/
go/storagewarranty
Before you begin
Observe the following precautions when replacing a module.
CAUTION:
Removing a module significantly changes air flow within the
enclosure. All enclosure bays must be populated with a module
or blanking panel for the enclosure to cool properly. If a
module fails, leave it in place in the enclosure until a new
module is available to install.
Parts can be damaged by electrostatic discharge. Use proper
anti-static protection. Refer to the documentation that shipped
with your system for additional information.
NOTE:
Port-colored (purple) latches on components mean the
component is hot-swappable. It can be removed and replaced
without having to power the system down.
NOTE:
All disk enclosures will ship with two I/O modules installed and
ready for use. However, in some of the configurations, they will
only cable up and use one of them. In those environments, the
I/O module is not hot-pluggable. An I/O module is only
hot-pluggable when both are in use but one has failed or is
failing.
NOTE:
Illustrations in this document may show modules or a chassis
that differ from your device. However, replacement procedures
are the same for all chassis that use this component.
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