HP ProLiant BL45p Generation 2 Server Blade Maintenance and Service Guide Part Number 415895-004 September 2007 (Fourth Edition)
© Copyright 2006, 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 16 Server blade components (primary side)............................
Diagnostic tools .......................................................................................................................... 68 Troubleshooting resources ........................................................................................................................ 68 HP Insight Diagnostics.............................................................................................................................. 68 HP Insight Diagnostics survey functionality .......................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair). Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
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Customer self repair 13
Customer self repair 14
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Illustrated parts catalog Server blade components (primary side) Item Description Spare part number Customer self repair (on page 5) Mechanical components 1 Access panel, primary 419505-001 Mandatory1 2 Hard drive blank 392613-001 Mandatory1 3 Hardware and plastics kit 419530-001 Mandatory1 a) Heatsink blank — — b) Processor air baffle — — c) Power converter module retainer — — d) Front bezel, HP ProLiant BL45p Generation 2 Server Blade, primary — — Illustrated parts catalog 16
Item Description Spare part number Customer self repair (on page 5) e) Front bezel, HP ProLiant BL45p Generation 2 Server Blade, secondary* — — f) Front bezel, HP ProLiant BL25p Generation 2 Server Blade* — — g) Screws, power connector, 6-32 (2)* — — System components 4 Power converter module 419733-001 Optional2 5 Fan assembly 416429-001 Optional2 6 Processors — — a) 2.8-GHz AMD Opteron™ processor model 8220** 438872-001 Optional2 b) 2.
Item Description Spare part number Customer self repair (on page 5) 15 Fibre Channel mezzanine* — — a) HP QLogic-based Fibre Channel Mezzanine HBA for p-Class BladeSystem 371703-001 Mandatory1 b) HP Emulex-based Fibre Channel Mezzanine HBA for p-Class BladeSystem 399853-001 Mandatory1 Standard NIC mezzanine* — — a) Broadcom 5708 NIC 416557-001 Mandatory1 b) Broadcom 5721 NIC 416558-001 Mandatory1 16 Cables 17 Power button/LED board cable* 436072-001 Mandatory1 18 Hard drive back
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. 3 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria.
Illustrated parts catalog 20
Server blade components (secondary side) Item Description Spare part number Customer self repair (on page 5) Mechanical components 1 Access panel, secondary 430123-001 Mandatory1 2 Hardware and plastics kit 419530-001 Mandatory1 a) Heatsink blank — — b) Processor air baffle — — c) Power converter module retainer — — d) Front bezel, HP ProLiant BL45p Generation 2 Server Blade, secondary — — e) Front bezel, HP ProLiant BL45p Generation 2 Server Blade, primary* — — f) Front bezel, H
Item Description Spare part number Customer self repair (on page 5) 5 Processors — — a) 2.8-GHz AMD Opteron™ processor model 8220** 438872-001 Optional2 b) 2.6-GHz AMD Opteron™ processor model 8218* ** 419540-001 Optional2 c) 2.4-GHz AMD Opteron™ processor model 8216* ** 419539-001 Optional2 d) 2.2-GHz AMD Opteron™ processor model 8214* ** 419538-001 Optional2 e) 2.
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation.
Illustrated parts catalog 24
Removal and replacement procedures Required tools You need the following items for some procedures: • T-15 Torx screwdriver (provided inside the server blade) • T-5 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 68) Safety considerations Before performing service procedures, review all the safety information.
CAUTION: When performing non-hot-plug operations, you must power down the server blade and/or the system. However, it may be necessary to leave the server blade powered up when performing other operations, such as hot-plug installations or troubleshooting. Rack warnings and cautions WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks.
CAUTION: Do not operate the server blade for long periods with the access panel open or removed. Operating the server blade in this manner results in improper airflow and improper cooling that can lead to thermal damage. Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.
Power down the server blade Power down the server blade using either of the following methods: • Press the Power On/Standby button on the server blade front panel. Be sure that the server blade is in standby mode by observing that the system power LED is amber. This process may take 30 seconds, during which time some internal circuitry remains active. • Use the virtual power button feature in iLO 2.
CAUTION: To prevent damage to electrical components, properly ground the server blade before beginning any installation procedure. Improper grounding can cause ESD. Access panel Primary access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server blade before beginning any installation procedure. Improper grounding can cause ESD.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank. Remove the component as indicated. To replace the component, reverse the removal procedure. Hard drive To remove the component: 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 74). 2.
To replace the component: 1. Open the release latch and prepare the hard drive for installation. 2. Install the hard drive. 3. Determine the status of the hard drive from the hot-plug hard drive LEDs ("SAS and SATA hard drive LED combinations" on page 74). 4. Resume normal server operations. Power button/LED board cable To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4.
5. Remove the power button/LED board cable. CAUTION: Always align the cable before closing the connector. Failure to align the cable properly can result in damage to the cable or the connector. To replace the component, reverse the removal procedure. Processor air baffle To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the processor air baffle.
IMPORTANT: To ensure proper cooling, be sure the correct processor air baffle is installed at all times. Fan assembly To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32). 5. Disconnect the fan cables. 6. Remove the fan assembly. To replace the component, reverse the removal procedure.
Hard drive backplane power and data cable To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32). 5. Remove the fan assembly ("Fan assembly" on page 33). 6. Disconnect the hard drive backplane power and data cable. To replace the component, reverse the removal procedure.
8. Remove the hard drive backplane. To replace the component, reverse the removal procedure. DIMMs To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the DIMM. To replace the component, reverse the removal procedure.
Fibre Channel mezzanine To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the FC mezzanine. To replace the component, reverse the removal procedure. NIC mezzanine To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29).
4. Remove the NIC mezzanine. To replace the component, reverse the removal procedure. I/O signal board To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the I/O signal board. To replace the component, reverse the removal procedure.
HP Smart Array E200i Controller battery To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the battery housing from the server. 5. Remove the battery from the battery housing. To replace the component, reverse the removal procedure.
HP Smart Array E200i Controller battery cable To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the HP Smart Array E200i Controller battery ("HP Smart Array E200i Controller battery" on page 38). 5. Disconnect the battery cable from the cache module. To replace the component, reverse the removal procedure.
4. Disconnect the battery cable from the cache module. 5. Remove the cache module. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32).
5. Remove the heatsink. To replace the heatsink: 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Remove the protective cover from the heatsink. CAUTION: After the cover is removed, do not touch the thermal interface media.
3. Install the heatsink. 4. Install the access panel. 5. Install the server blade. Processor To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4. Remove the heatsink ("Heatsink" on page 40). 5. Open the processor retaining latch and the processor socket retaining bracket.
6. Using your fingers, remove the failed processor. To replace the component: CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. IMPORTANT: Be sure the processor remains inside the processor installation tool.
1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket.
3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracket and the processor retaining latch. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6.
7. Install the heatsink ("Heatsink" on page 40). 8. Install the access panel. 9. Install the server blade. System battery If the server blade no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. Power converter module To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29).
4. Remove the power converter module. To replace the component, reverse the removal procedure. Power converter module retainer To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. 4. Remove the power converter module retainer.
Secondary system board To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32). 5. Remove the fan assembly ("Fan assembly" on page 33). 6. Remove all DIMMs ("DIMMs" on page 35). 7. Remove the FC mezzanine, if installed ("Fibre Channel mezzanine" on page 36). 8.
15. Using your fingers, remove the failed processor. 16. Disengage the power connector from the chassis. Retain the thumbscrews for future use.
17. Remove the secondary system board. To replace the system board: 1. Install the spare system board in the server blade before installing the processor. 2. Install the power connector onto the chassis. 3.
a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 4. Install the processor socket cover onto the processor socket of the failed system board. 5. Install the processor on the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server blade hood label for specific instructions.
6. Close the processor retaining latch and the processor socket retaining bracket. 7. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 8. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
9. Install the heatsink ("Heatsink" on page 40). IMPORTANT: To maintain proper cooling, be sure the processor air baffle is installed at all times. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 10. Install all components removed from the failed system board. 11. Install the secondary access panel. 12. Install the server blade. 13. Power up the server blade.
Primary system board To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32). 5. Remove the fan assembly ("Fan assembly" on page 33). 6. Remove all DIMMs ("DIMMs" on page 35). 7. Remove the FC mezzanine, if installed ("Fibre Channel mezzanine" on page 36). 8.
23. Remove the power converter module ("Power converter module" on page 47). 24. Disconnect all cables connected to the system board ("System board components" on page 75). 25. Remove the heatsink ("Heatsink" on page 40). 26. Open the processor retaining latch and the processor socket retaining bracket. 27. Using your fingers, remove the failed processor.
28. Disengage the power connector from the chassis. Retain the thumbscrews for future use. 29. Remove the primary system board. To replace the system board: 1. Install the spare system board in the server blade before installing the processor.
2. Install the power connector onto the chassis. 3. Prepare the processor socket on the spare system board: a. Remove the processor socket protective cover.
b. Open the processor retaining latch and the processor socket retaining bracket. 4. Install the processor socket cover onto the processor socket of the failed system board. 5. Install the processor on the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server blade hood label for specific instructions.
6. Close the processor retaining latch and the processor socket retaining bracket. 7. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 8. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
10. Install all components removed from the failed system board. 11. Install the primary access panel. 12. Install the secondary system board. 13. Install the power connector onto the chassis. IMPORTANT: To maintain proper cooling, be sure the processor air baffle is installed at all times. 14. Install all components removed from the secondary system board. 15. Install the secondary access panel. 16. Install the server blade. 17. Power up the server blade.
Power button/LED board To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the processor air baffle ("Processor air baffle" on page 32). 5. Remove the fan assembly ("Fan assembly" on page 33). 6. Remove all DIMMs ("DIMMs" on page 35). 7. Remove the FC mezzanine, if installed ("Fibre Channel mezzanine" on page 36). 8.
13. Remove the secondary chassis. 14. Remove the primary access panel ("Primary access panel" on page 29). 15. Remove the power button/LED board cable ("Power button/LED board" on page 62). 16. Remove the two T-5 screws and the power button/LED board. To replace the component, reverse the removal procedure. Primary front bezel 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the access panel ("Access panel" on page 29). 4.
6. Remove all DIMMs ("DIMMs" on page 35). 7. Remove the FC mezzanine, if installed ("Fibre Channel mezzanine" on page 36). 8. Remove the NIC mezzanine, if installed ("NIC mezzanine" on page 36). 9. Remove the I/O signal board ("I/O signal board" on page 37). 10. Disconnect all cables connected to the system board ("System board components" on page 75). 11. Remove the secondary system board ("Secondary system board" on page 49). 12. Remove the secondary chassis. 13.
Secondary front bezel To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the secondary front bezel. To replace the component, reverse the removal procedure. Secondary LED board cable To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3.
4. Remove the secondary LED board cable. To replace the component, reverse the removal procedure. Secondary LED board To remove the component: 1. Power down the server blade (on page 28). 2. Remove the server blade (on page 28). 3. Remove the secondary access panel ("Secondary access panel" on page 29). 4. Remove the secondary LED board cable ("Secondary LED board cable" on page 65). 5. Remove the secondary LED board. To replace the component, reverse the removal procedure.
Server blade bay blank Remove the server blade blank from the server blade enclosure. CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade enclosure unless all bays are populated with either a component or a blank. To replace a server blade blank, align the blank with the empty bay and slide it in until the blank is fully seated.
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides simple procedures for resolving common problems as well as a comprehensive course of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance.
NOTE: The current version of SmartStart provides the memory spare part numbers for the server blade. To download the latest version, see the HP website (http://www.hp.com/support). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
configuration information collected about your systems, ISEE enables fast restoration of your systems. Install ISEE on your systems to help mitigate risk and prevent potential critical problems. For more information on ISEE, refer to the HP website (http://www.hp.com/hps/hardware/hw_enterprise.html). To download HP ISEE, visit the HP website (http://www.hp.com/hps/hardware/hw_downloads.html). For installation information, refer to the HP ISEE Client Installation and Upgrade Guide (ftp://ftp.hp.
Internal USB functionality An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data. For additional security, external USB functionality can be disabled through RBSU. Disabling external USB support in RBSU disables the USB connectors on the local I/O cable.
Server component identification Front panel LEDs Item LED description Status 1 UID LED Blue = Identified Blue flashing = Active remote management Off = No active remote management 2 Health LED Green = Normal Green flashing = Booting Amber flashing = Degraded condition Red flashing = Critical condition 3 NIC 1* Green = Network linked Green flashing = Network activity Off = No link or activity 4 NIC 2* Green = Network linked Green flashing = Network activity Off = No link or activity 5 NIC 3*
Item LED description Status 6 NIC 4* Green = Network linked Green flashing = Network activity Off = No link or activity 7 NIC 5* Green = Network linked Green flashing = Network activity Off = No link or activity 8 NIC 6* Green = Network linked Green flashing = Network activity Off = No link or activity 9 NIC 7* Green = Network linked Green flashing = Network activity Off = No link or activity 10 NIC 8* Green = Network linked Green flashing = Network activity Off = No link or activity 11 S
Item Description 4 Hard drive bay 2 * The I/O port is used with the local I/O cable to perform some server blade configuration and diagnostic procedures.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.
Item Description 2 Power converter module 3 FC mezzanine connectors (2) 4 NIC mezzanine connector 5 System maintenance switch (SW4) 6 Processor 3 memory bank F 7 Processor 3 memory bank E 8 DIMM slots 9-12 9 Processor socket 3 (blank shown) 10 Fan connectors (5) 11 Front panel/LED board connector 12 Processor socket 1 (populated) 13 DIMM slots 1-4 14 Processor 1 memory bank A 15 Processor 1 memory bank B 16 Hard drive backplane data cable connector 17 Hard drive backplane po
Item Description 5 Processor 2 memory bank C 6 DIMM slots 5-8 7 Processor socket 2 (populated) 8 Fan connectors (5) 9 Processor socket 4 (blank shown) 10 DIMM slots 13-16 11 Processor 4 memory bank G 12 Processor 4 memory bank H 13 System board handles (2) 14 FC mezzanine connectors (2) 15 I/O signal board DIMM slot numbering Primary system board DIMM slot numbering (processors 1 and 3) Item Description Memory bank 1 DIMM slot 9 Processor 3 memory bank E 2 DIMM slot 10 Proce
Secondary system board DIMM slot numbering (processors 2 and 4) Item Description Memory bank 1 DIMM slot 5 Processor 2 memory bank C 2 DIMM slot 6 Processor 2 memory bank C 3 DIMM slot 7 Processor 2 memory bank D 4 DIMM slot 8 Processor 2 memory bank D 5 DIMM slot 16 Processor 4 memory bank H 6 DIMM slot 15 Processor 4 memory bank H 7 DIMM slot 14 Processor 4 memory bank G 8 DIMM slot 13 Processor 4 memory bank G System maintenance switch Position Function Default 1* iLO 2 se
Internal USB connector For more information, see "Internal USB functionality (on page 71).
Item Connector Description 6 iLO RJ-45 (10/100 Ethernet) For connecting an Ethernet to the server blade iLO interface from a client device The local I/O cable ships with the enclosure.
Cabling Using the local I/O cable The local I/O cable enables the user to perform server blade administration, configuration, and diagnostic procedures in two ways: • Connecting locally to the server blade iLO 2 interface • Connecting video and USB devices directly to the server blade Local administration using iLO 2 To connect locally to iLO 2 with the local I/O cable, you must have the following: • A client device with a 10/100 Ethernet RJ-45 connector • A network cable with RJ-45 connectors To
2. Connect the local I/O cable to the I/O port on the server blade. CAUTION: Disconnect the local I/O cable when not in use. The port and connector do not provide a permanent connection. Rear iLO 2 connector performance degrades when the local I/O cable is connected, even if the iLO 2 connector on the cable is not in use. CAUTION: Before disconnecting the local I/O cable, observe the following guidelines: • Completely log out of the current iLO 2 session before disconnecting from the iLO 2 port.
CAUTION: Disconnect the local I/O cable when not in use. The port and connector do not provide a permanent connection. Rear iLO 2 connector performance degrades when the local I/O cable is connected, even if the iLO 2 connector on the cable is not in use. NOTE: For this configuration, a USB hub is not necessary. To connect additional devices, use a USB hub. 1. Connect the local I/O cable to the server blade. 2. Connect a monitor to the video connector. 3. Connect a USB mouse to one USB connector. 4.
o USB CD-ROM drive o USB keyboard o USB mouse NOTE: Use a USB hub when connecting a USB diskette drive and/or USB CD-ROM drive to the server blade. The USB hub provides additional connections.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 60°C (-40°F to 140°F) Storage -20°C to 60°C (-4°F to 140°F) Maximum wet bulb temperature 30°C (86°F) Relative humidity (noncondensing)** Operating 10% to 90% Shipping 10% to 90% Storage 10% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
Acronyms and abbreviations BBWC battery-backed write cache CSR Customer Self Repair DIMM dual inline memory module ESD electrostatic discharge FC Fibre Channel HBA host bus adapter HTTP hypertext transfer protocol I/O input/output iLO 2 Integrated Lights-Out 2 IML Integrated Management Log ISEE Instant Support Enterprise Edition KVM keyboard, video, and mouse Acronyms and abbreviations 86
LED light-emitting diode NIC network interface controller OSEM Open Services Event Manager PSP ProLiant Support Pack RBSU ROM-Based Setup Utility ROM read-only memory SAS serial attached SCSI SATA serial ATA SIM Systems Insight Manager SMTP Simple Mail Transfer Protocol UID unit identification UPS uninterruptible power system USB universal serial bus WEBES Web-Based Enterprise Service Acronyms and abbreviations 87
Index A access panel 16, 21, 29 ADU (Array Diagnostic Utility) 69 Array Diagnostic Utility (ADU) 69 B battery 16, 21, 46, 75, 76 battery cables, connecting 39 battery-backed write cache battery pack 16, 21 buttons 72 C cable part numbers 16, 21 cable, LED board 65 cables 16, 21, 81 cabling 81, 82 cache module 16, 21, 39, 75 cache module, removing 39 cautions 25 component identification 72 components 16, 21, 68, 72 connectors 72, 74 controller 16, 21 CSR (customer self repair) 5 customer self repair (CSR)
LEDs, unit identification (UID) 72 local I/O cable 16, 21, 79, 81 local I/O cable connector 79 M management tools 68 N NIC LEDs 72 NIC mezzanine 36 NIC mezzanine connectors 75, 76 O Open Services Event Manager 70 P part numbers 16 power button/LED board 16, 21 power button/LED board cable 16, 31 power connectors, external 74 power converter module 16, 21, 47, 75, 76 power converter module retainer 16, 21, 48 powering down 28 preparation procedures 27 primary access panel 29 primary front bezel 63 primar
