HP ProLiant BL45p Generation 2 Server Blade Maintenance and Service Guide

Removal and replacement procedures 49
Secondary system board
To remove the component:
1. Power down the server blade (on page 28).
2. Remove the server blade (on page 28).
3. Remove the secondary access panel ("Secondary access panel" on page 29).
4. Remove the processor air baffle ("Processor air baffle" on page 32).
5. Remove the fan assembly ("Fan assembly" on page 33).
6. Remove all DIMMs ("DIMMs" on page 35).
7. Remove the FC mezzanine, if installed ("Fibre Channel mezzanine" on page 36).
8. Remove the NIC mezzanine, if installed ("NIC mezzanine" on page 36).
9. Remove the I/O signal board ("I/O signal board" on page 37).
10. Remove the power converter module ("Power converter module" on page 47).
11. Remove the secondary LED board cable ("Secondary LED board cable" on page 65).
12. Disconnect all cables connected to the system board ("System board components" on page 75).
13. Remove the heatsink ("Heatsink" on page 40).
14. Open the processor retaining latch and the processor socket retaining bracket.