Technologies in HP ProLiant Gen8 c-Class server blades

AMD Opteron processors

HP ProLiant Gen8 server blades based on AMD processors use up to two Multi-Core AMD Opteron 6200 Series processors

with 4, 8, 12, or 16 cores per processor with PCIe 2.0 using the AMD SR5690 and SP5100 chipsets.

The building block of 8-core Opteron 6200 series processors is the Bulldozer module. The Bulldozer module executes

two parallel threads using two 128-bit integer cores. Each core has four pipelines and a dedicated integer, but share the

fetch/decode stage and the L2 cache. The flexible floating point unit can be dedicated or shared between the two cores

per cycle.

The AMD Opteron 6200 series processor has 8 Bulldozer modules, runs from 1.6 GHz up to 2.6 GHz, and operates from

85 W up to 140 W. The processors fit into the 1944-pin G34 socket and use the AMD SR5690/SP5100 chipset.

The AMD Opteron 6200 series processor consists of two 8-core dies with four Hyper Transport 3.0 links that operate up

to 6.4 GT/s. It has two integrated memory controllers, each with two DDR3 memory channels that operate up to 1866

GT/s. The memory controllers are compatible with LR DIMMs, RDIMMs, UDIMMs, and low-voltage DIMMs.

The AMD Opteron 6200 series processors incorporate the following technologies:

 HT Assist AMD Smart Fetch Technology

 AMD-P suite of power-management features

 AMD-V™ with Rapid Virtualization Indexing

For complete listings of all processor models and specifications, see the HP ProLiant Gen8 server blade QuickSpecs:

http://www.hp.com/go/blades

Thermal technologies

We make it possible for you to manage ProLiant Gen8 server blade component and ambient temperatures through

innovative component engineering, efficient server blade design, and HP Thermal Logic technologies.

Thermal engineering

For ProLiant c-Class server blades, we’ve designed smaller heat sinks than rack-mount servers use. The server blade

heat sinks have vapor chamber bases, thinner fins, and tighter fin pitch than previous designs to achieve the largest

possible heat transfer surface in the smallest possible package (Figure 8). The smaller heat sink allows more space on

the server blades for DIMM slots and hard drives.

Figure 8:

Top view

Side view