Technologies in HP ProLiant G7 c-Class server blades with AMD Opteron™ processors, 3rd Edition

ManualsBrandsHP ManualsServerHP ProLiant BL685c G7 Server

Technologies in HP ProLiant G7 c-Class server blades

with AMD Opteron™ processors

Technology brief, 3rd edition

Introduction ......................................................................................................................................... 2

ProLiant server design principles ............................................................................................................ 2

ProLiant c-Class server blade architecture ................................................................................................ 2

Processor technologies ......................................................................................................................... 5

Configuration and management technologies.......................................................................................... 6

BladeSystem OA .............................................................................................................................. 6

Integrated Lights-Out for ProLiant server blades .................................................................................... 6

Power management technologies ........................................................................................................... 7

Power meter .................................................................................................................................... 7

HP Power Regulator for ProLiant servers .............................................................................................. 7

HP Dynamic Power Capping and HP Power Capping .......................................................................... 7

HP Thermal Logic technologies .............................................................................................................. 8

Memory technologies ........................................................................................................................... 9

Unbuffered and registered DIMMs ..................................................................................................... 9

Memory interleaving ........................................................................................................................ 9

Memory bank interleaving ............................................................................................................. 9

Memory channel interleaving ....................................................................................................... 10

Memory node interleaving ........................................................................................................... 10

Error correction .......................................................................................................................... 10

I/O technologies ............................................................................................................................... 10

PCI Express technology ................................................................................................................... 11

HP Smart Array controllers and supported drive technology ................................................................ 11

Optional mezzanine cards .............................................................................................................. 11

Networking technologies .................................................................................................................... 11

Virtual Connect .............................................................................................................................. 12

Data security technology with the Trusted Platform Module ..................................................................... 12

Conclusion ........................................................................................................................................ 13

For more information .......................................................................................................................... 14

Summary of content (14 pages)

PAGE 1
Technologies in HP ProLiant G7 c-Class server blades with AMD Opteron™ processors Technology brief, 3rd edition Introduction ......................................................................................................................................... 2 ProLiant server design principles ............................................................................................................ 2 ProLiant c-Class server blade architecture............................................................
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Introduction This paper describes the architecture and major technologies implemented in HP ProLiant G7 c-Class Server Blades based on AMD Opteron™ processors. Specifically, the paper applies to the BL465 G7 and BL685c G7 Server Blades updated with the AMD Opteron 6200 series processors. To gain the most value from this paper, you should be familiar with HP ProLiant server technology and be somewhat acquainted with BladeSystem architecture.
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In designing ProLiant G7 c-Class server blades based on AMD Opteron processors, we used enterprise-class technologies to provide maximum flexibility, scalability, performance, and control to meet many types of customer needs: • Two or four AMD Opteron 6200 Series processors • HP Thermal Logic technologies • HP advanced memory technologies • Multiple PCIe Gen 2 x8 slots for I/O cards • HP NC551i dual-port FlexFabric 10 Gb converged network adapters (CNAs) that support Ethernet, iSCSI, Flex-10, and Fibre Chan
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Figure 2: The HP BL465c G7 hot-plug drive drawer slides out for access to both disk drives. Because of their larger size, full-height server blades support up to 4 processors, up to 32 DIMM slots for DDR3 memory, 2 hot-plug drives, 2 dual-port FlexFabric 10 Gb CNAs (4 ports total), and 3 PCIe x8 Gen 2 mezzanine slots for optional I/O cards. Full-height server blades also provide twice as much I/O bandwidth to the interconnect modules as half-height server blades (Figure 3).
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Processor technologies ProLiant G7 server blades with AMD processors contain 8-core, 12-core, or 16-core AMD Opteron 6200 Series processors. All ProLiant G7 server blades with AMD Opteron processors use AMD SR5690/SP5100 chipsets to manage data throughput. AMD Opteron processors use Direct Connect architecture: An integrated memory controller replaces the front side bus. The architecture includes dedicated memory banks for each processor and point-to-point HyperTransport™ 3.
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Configuration and management technologies HP BladeSystem G7 c-Class servers provide an intelligent infrastructure through extensive integration of three management components: • BladeSystem Onboard Administrator (OA) module located in the enclosure • Integrated Lights-Out 3 (iLO 3) processor on the server blade • Interconnect module management firmware such as the HP Virtual Connect Manager Integrating these management capabilities provides powerful hardware management for remote administration, local diagn
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• Streamlined Web 2.0 interface with JavaScript Object Notation (JSON) technology to create a more dynamic interface experience. Content updates do not require a web page refresh. • Streamlined user experience with remote console direct access. It provides immediate access to the iLO Advanced remote console without having to navigate through the web interface.
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For detailed information about HP Power Capping technologies and capabilities, refer to the HP technology brief titled “HP Power Capping and HP Dynamic Power Capping for ProLiant servers” at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01549455/c01549455.pdf. HP Thermal Logic technologies We use the term Thermal Logic to refer to the unique HP mechanical design and control technologies of BladeSystem c-Class systems that let you optimize your power and thermal environment.
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Memory technologies In AMD Opteron 6200 Series architecture, the design integrates the memory controller into the processor chip to optimize memory performance and bandwidth per CPU. The memory controller reduces latency inherent in front side bus architectures by eliminating the bus contention between memory and I/O cycles. Memory bandwidth increases as you add processors to a configuration.
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• Two dual-rank DIMMs per channel result in four--way bank interleaving. • Two quad-rank DIMMs per channel result in eight-way bank interleaving. • Two dual-rank DIMMs and one quad-rank DIMM result in eight-way bank interleaving, in servers using three DIMMs per channel. Memory channel interleaving Memory channel interleaving transfers data by alternate routing through the two available memory channels.
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PCI Express technology All ProLiant G7 server blades support the PCIe 2.0 specification. PCIe 2.0 has a per-lane signaling rate of 5 Gb/s, which is double the per-lane signaling rate of PCIe 1.0. A ProLiant G7 option allows all expansion slots to run at PCIe 1.0 speed rather than at PCIe 2.0 speed. Enabling this option saves power. You can control expansion slot speed through the RBSU under the Advanced Power Configuration submenu.
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When connected to a converged enhanced Ethernet (CEE) capable switch, Fibre Channel and Ethernet I/O are separated and routed to the corresponding network. For iSCSI storage, the NC551i LOM supports full protocol offload that provides better CPU efficiency when compared to software initiators. Because of this, the server can handle increased virtualization workloads and compute-intensive applications. Accelerated iSCSI offloads the iSCSI function from the server CPU to the NIC.
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Conclusion The HP ProLiant G7 c-Class server blades with AMD Opteron 6200 series processors offer improved performance and give you more DIMM choices, including higher density DDR3 memory. HP BladeSystem c-Class architecture uses full-featured server blades in a highly dense form factor to accommodate new technologies such as serialized I/O technologies, AMD Opteron multi-core architectures, virtualization, higher power loads, and memory formats requiring more power.
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For more information Visit the URLs listed below if you need additional information. Resource description Web address HP ProLiant BL465c G7 QuickSpecs http://h18000.www1.hp.com/products/quickspecs/13654_n a/13654_na.html HP ProLiant BL685c G7 QuickSpecs http://h18004.www1.hp.com/products/quickspecs/13655_n a/13655_na.html General HP BladeSystem information http://www.hp.com/go/bladesystem/ Technology briefs about HP BladeSystem http://h18004.www1.hp.