HP ProLiant DL320s Server Maintenance and Service Guide Part Number 431240-002 June 2008 (Second Edition)
© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 16 System components ................................................
Fan assembly location.............................................................................................................................. 50 Cabling ..................................................................................................................................... 51 Cabling overview .................................................................................................................................... 51 Server cable routing .........................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
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Customer self repair 13
Customer self repair 14
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Illustrated parts catalog System components Item Description Assembly part number Spare part number Customer self repair (on page 5) 1 Upper tray — — — 2 Riser board assembly 433720-001 432163-001 Optional2 3 Heatsink 418530-001 417969-001 Optional2 Illustrated parts catalog 16
Item Description Assembly part number Spare part number Customer self repair (on page 5) 4 Processor — — — a) 2.13-GHz Intel® Xeon® processor E6400 486198-L21 490061-001 Optional2 b) 2.40-GHz Intel® Xeon® processor X3060 434382-001 432943-001 Optional2 c) 2.
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.
Removal and replacement procedures Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Power down the server (on page 21). If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Remove the server from the rack (on page 22). If you are servicing internal components, remove the server from the rack. • Remove the access panel ("Removing and replacing the access panel" on page 22).
Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: 1. Power down the server (on page 21). 2. Extend the server from the rack (on page 21). 3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. 4. Place the server on a sturdy, level surface.
CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. 3. Remove the battery pack. 4. Loosen the thumbscrews, and lift the upper tray from the server. To replace the component, reverse the removal procedure. Power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To remove the component, disconnect the power cord from the power supply and remove the component as indicated. To replace the component, reverse the removal procedure. Fan assembly To remove the component: 1. Power down the server (on page 21). 2. Extend the server from the rack (on page 21). 3. Remove the server from the rack (on page 22). 4. Remove the access panel ("Removing and replacing the access panel" on page 22). 5. Remove the power supplies ("Power supply" on page 23) 6.
7. Loosen the two thumbscrews, and lift the fan assembly out of the chassis. To replace the components, reverse the removal procedure. PCI riser board assembly To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 21). 2. Extend the server from the rack (on page 21). 3. Remove the server from the rack (on page 22). 4.
7. Loosen the thumbscrews, and lift the PCI riser board assembly out of the server. To replace the component, reverse the removal procedure. Midplane 1. Power down the server. 2. Extend the server from the rack (on page 21). 3. Remove the server from the rack (on page 22). 4. Remove the access panel ("Removing and replacing the access panel" on page 22). 5. Remove the power supplies ("Power supply" on page 23). 6. Remove the fan assembly ("Fan assembly" on page 24). 7.
9. Push the midplane board toward the back of the server to disengage it from the backplanes, and lift it from the chassis. To replace the component, reverse the removal procedure. Hard drive backplanes To remove the components: 1. Power down the server. 2. Extend the server from the rack (on page 21). 3. Remove the server from the rack (on page 22). 4. Remove all hot-plug hard drives. 5. Remove the access panel ("Removing and replacing the access panel" on page 22). 6.
8. Tilt the backplane up from the bottom, and lift it out of the chassis. To replace the components, reverse the removal procedure. Heatsink To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws. 6. Pull up on the heatsink to remove it from the server. To replace the component: IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is properly oriented. 1.
3. Replace the heatsink by tightening the four screws securing it to the system board. Processor To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.
6. Open the processor retaining clip and bracket, and remove the processor. To replace the component, reverse the removal procedure. IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is properly oriented. System board To remove the component: 1. Power down the server (on page 21). 2. Extend the server from the rack (on page 21). 3. Remove the server from the rack (on page 22). 4. Remove the access panel ("Removing and replacing the access panel" on page 22).
13. Open the processor retaining latch and the processor socket retaining bracket on the failed system board. 14. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
15. Lift the release button, and slide the system board out from the chassis. To replace the system board: 1. Slide the spare system board into the server. 2. Prepare the processor socket on the spare system board: a. Open the processor retaining latch and the processor socket retaining bracket.
b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the processor socket of the failed system board. The cover protects the socket during shipping when the failed board is returned. CAUTION: Always install the processor parallel to the system board to avoid damage to the pins.
4. On the failed system board, close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution.
IMPORTANT: Install all components with the same configuration that was used on the failed system board. 9. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Serial Number. The following warning is displayed: Warning: The serial number should ONLY be modified by qualified service personnel.
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP. NOTE: The current version of SmartStart provides the memory spare part numbers for the server. To download the latest version, see the HP website (http://www.hp.com/support). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
Server component identification Front panel LEDs and buttons Item Description Status 1 UID button/LED Blue = Identification is activated. Flashing blue = System is being remotely managed. Off = Identification is deactivated. 2 Internal health LED Green = System health is normal. Amber = System is degraded. To identify the component in a degraded state, see system board LEDs. Red = System critical. To identify the component in a critical state, see system board LEDs.
Item Description Status 3 NIC 1 link/activity LED Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, view the LEDs on the RJ-45 connector for status by referring to the rear panel LEDs ("Rear panel LEDs and buttons" on page 43). 4 NIC 2 link/activity LED Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists.
SAS and SATA hard drive LEDs Item LED description Status 1 Online/Activity status Green = Drive activity Flashing green = High activity on the drive or drive is being configured as part of an array Off = No drive activity 2 Fault/UID status Amber = Drive failure Flashing amber = Fault-process activity Blue = Unit identification is active Off = No fault-process activity SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternatin
Online/activity LED (green) Fault/UID LED (amber/blue) Flashing regularly Amber, flashing (1 Hz) regularly (1 Hz) Interpretation Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.
Item Description 3 PCI Express x8 expansion slot 2 (full-length) 4 Video connector 5 Mouse connector 6 Keyboard connector 7 Serial connector 8 iLO 2 NIC 9 PCI Express x1 expansion slot 1 (low-profile, half-length) 10 NIC controller 1 11 NIC controller 2 12 UID button/LED Rear panel LEDs and buttons Item Description LED color 1 Activity LED Green Status On or flashing = Network activity Off = No network activity 2 Link LED Green On = Linked to network Off = Not linked to netw
System board components Description Item Description 1 PCI Express x8 connector 10 Fan 3 connector 2 PCI Express x1 connector 11 Fan 4 connector 3 System maintenance switch (on page 44) 12 Main power connector 4 NMI switch ("NMI functionality" on page 45) 13 Processor socket 5 Battery 14 Auxiliary power connector 6 Front panel LED board connector 15 DIMM slot 1 (bank A) 7 Internal USB connector 16 DIMM slot 2 (bank B) 8 Fan 1 connector 17 DIMM slot 3 (bank A) 9 Fan 2 con
Position Default Function S4 Off Off = Normal operation On = Override RBSU setting and enable diskette boot * S5 Off Off = Power-on password enabled On = Power-on password disabled * S6 Off Off = Normal operation On = BIOS will clear CMOS and NVRAM * S7 Off Reserved S8 Off Reserved * "On" activates the function. When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.
System board LEDs Item LED description Status 1 Reserved — 2 Overtemperature Amber = System has reached a cautionary or critical temperature level. Off = Temperature is OK. 3 Fan 1 Amber = One or more fans in this module have failed. Off = All fans in this module are operating normally. 4 Processor Amber = Processor has failed. Off = Processor is operating normally. 5 Fan 2 Amber = One or more fans in this module have failed. Off = All fans in this module are operating normally.
Item LED description Status 10 DIMM 3 Amber = DIMM has failed. Off = DIMM is operating normally. 11 DIMM 2 Amber = DIMM has failed. Off = DIMM is operating normally. 12 DIMM 1 Amber = DIMM has failed. Off = DIMM is operating normally. 13 Power supply signal Green = System board power is normal. Off = System board power has failed. Internal USB connectors See "Internal USB functionality" for more information.
System LED and Color Internal Health LED Color Status Processor failure (amber) Red One or more of the following conditions may exist: • Processor has failed. • Processor failed over to the offline spare. • Processor is not installed in the socket. • Processor is unsupported. • ROM detects a failed processor during POST. Amber Processor is in a pre-failure condition. PPM failure (amber) Red PPM has failed. DIMM failure, slot X (amber) Red • DIMM in slot X has failed.
Battery-backed write cache LEDs Item ID Color Description 1 Green System Power LED. This LED glows steadily when the system is powered up and 12 V system power is available. This power supply is used to maintain the battery charge and provide supplementary power to the cache microcontroller. 2 Green Auxiliary Power LED. This LED glows steadily when 3.3V auxiliary voltage is detected.
LED3 pattern LED4 pattern Interpretation — One blink per second The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are temporarily unavailable until charging is complete. The recharge process takes between 15 minutes and 2 hours, depending on the initial capacity of the battery.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. Server cable routing CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or air flow can be blocked. IMPORTANT: Route the cables without blocking the airflow or other installed components. Use the cable clips installed in the chassis to manage cable routing.
Cabling 52
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Rated steady-state power 450 W Acoustic Noise* Sound power, LWAd Idle 7.2 Bels Operating 7.2 Bels Bystander sound pressure, LpAm Idle 55 dBA Operating 56 dBA *The limits apply when operated in an ambient environment temperature of +23°C ± 2° (+73.4°F ± 2°).
Technical support Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error messages • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authorized reseller: • In the United States, see
Acronyms and abbreviations BBWC battery-backed write cache BIOS Basic Input/Output System CMOS complementary metal-oxide semiconductor CSR Customer Self Repair DIMM dual inline memory module iLO 2 Integrated Lights-Out 2 IML Integrated Management Log LED light-emitting diode NIC network interface controller NMI non-maskable interrupt NVRAM non-volatile memory OS operating system Acronyms and abbreviations 56
PCI peripheral component interface PCI Express Peripheral Component Interconnect Express PCI-X peripheral component interconnect extended POST Power-On Self Test PPM processor power module PSP ProLiant Support Pack RAID redundant array of inexpensive (or independent) disks RBSU ROM-Based Setup Utility ROM read-only memory SAS serial attached SCSI SATA serial ATA SCSI small computer system interface SIM Systems Insight Manager UID unit identification Acronyms and abbreviations 57
USB universal serial bus Acronyms and abbreviations 58
Index A F access panel 22 additional information 37 ADU (Array Diagnostic Utility) 38 Array Diagnostic Utility (ADU) 38 authorized reseller 55 fan assembly 24, 50 features 39 front panel buttons 39 front panel LEDs 39, 44 B backplane, hard drive 27 battery 45 battery-backed write cache (BBWC) 49, 51 Battery-backed write cache LEDs 49 BBWC (battery-backed write cache) 49, 51 blue screen event 45 buttons, front panel 39 buttons, rear panel 43 C cabling 51 clearing NVRAM 44 CMOS (complementary metal-oxide
M management tools 37 memory dump 45 midplane assembly 26 mouse connector 42 N network interface card (NIC) 42 NIC (network interface card) 42 NIC connectors 42 NIC LEDs 39, 43 NMI switch 44, 45 O operating system crash 45 P PCI boards 25 PCI-X boards 42 phone numbers 55 power button LED 39 power LEDs, system 39 Power On/Standby button 21, 39 power supplies 23, 42 power supply LEDs 47 powering down 21 PPM failure LEDs 47 preparation procedures 21 processors 30 R rack installation 20 rack warnings 20 rea
