HP ProLiant DL320 Generation 4 Server Maintenance and Service Guide March 2006 (Second Edition) Part Number 394178-002
© Copyright 2005, 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows NT are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 15 Mechanical components..............................................
SmartStart Scripting Toolkit ....................................................................................................................... 49 HP Instant Support Enterprise Edition.......................................................................................................... 49 HP ROM-Based Setup Utility ..................................................................................................................... 49 ROMPaq utility...................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair). Servicio de garantía exclusivo de componentes La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes.
Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen. Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Customer self repair 11
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog In this section Mechanical components ......................................................................................................................... 15 System components ................................................................................................................................
2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation.
Illustrated parts catalog 17
System components Item Description Spare part number Customer self repair (on page 5) 398442-001 Mandatory1 394982-001 Optional2 System components 5 Fan assembly Power 6 450-W power supply Boards 7 Power button/LED board 378627-001 Mandatory1 8 System board — — a) System board 398437-001 Optional2 b) System board (4M processors) 415626-001 Optional2 9 SAS/SATA backplane 398438-001 Optional2 10 Processors — — a) 2.
Item 11 12 13 Description Spare part number Customer self repair (on page 5) f) 3.0-GHz Intel® Pentium® D 930 processor, 4- 410613-001 MB L2 cache* Optional2 g) 3.2-GHz Intel® Pentium® D 940 processor, 4-MB L2 cache* 410615-001 Optional2 h) 3.0-GHz Intel® Pentium® 4 630 processor, 2- 392168-001 MB L2 cache* Optional2 i) 3.4-GHz Intel® Pentium® 4 650 processor, 2- 398388-001 MB L2 cache* Optional2 j) 3.
Description Spare part number Customer self repair (on page 5) d) USB cable — Mandatory1 25 Cable management arm kit* 360105-001 Mandatory1 26 Miscellaneous plastics kit 378632-001 — a) Bezel* — Mandatory1 b) PCI card guide* — No3 c) Bezel screws* — Mandatory1 d) Air baffle — Mandatory1 e) Pull tab* — Mandatory1 Rack mounting hardware kit* 360104-001 Mandatory1 Item 27 *Not shown 1 Mandatory—Parts for which customer self repair is mandatory.
2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario.
Illustrated parts catalog 22
Removal and replacement procedures In this section Safety considerations.............................................................................................................................. 23 Preventing electrostatic discharge............................................................................................................. 23 Symbols on equipment............................................................................................................................ 24 Rack warnings .
• Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly. Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.
• • • • • The leveling jacks are extended to the floor. The full weight of the rack rests on the leveling jacks. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.racksolutions.com/hp). • Power down the server (on page 26). If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Remove the server from the rack (on page 27). If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.
Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. 4. Place the server on a sturdy, level surface.
3. Remove the hard drive. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. When adding hard drives to the server, observe the following general guidelines: • The system automatically sets all drive numbers. • If only one hard drive is used, install it in the bay with the lowest drive number.
Hard drive blanks To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Front bezel 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it from the chassis. 4. Remove the access panel.
6. Remove the media cage (on page 33). 7. Use the T-15 Torx screwdriver to loosen the two screws on each side of the front bezel. NOTE: The T-15 Torx screwdriver is shipped with the server and can be located on the rear panel. 8. Slide the bezel to the left, release the USB cover by gently lifting the plastic latch, and then detach the bezel. To replace the component, reverse the removal procedure. SAS/SATA backplane board To remove the component: 1. Power down the server (on page 26). 2.
6. Remove the SAS/SATA backplane board. To replace the component, reverse the removal procedure. Fan assembly To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the air baffle. 5. Disconnect the fan cables from the system board.
6. Remove the fan assembly. To replace the component, reverse the removal procedure. BBWC battery To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the fan assembly ("Fan assembly" on page 31). 5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables" on page 47). 6. Remove the BBWC battery. To replace the component, reverse the removal procedure.
Media cage To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the fan assembly ("Fan assembly" on page 31). 5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables" on page 47). 6.
8. Remove the optical drive. To replace the component, reverse the removal procedure. Diskette drive To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the fan assembly ("Fan assembly" on page 31). 5.
8. Remove the diskette drive. To replace the component, reverse the removal procedure. Power button/LED board To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the fan assembly (on page 31). 5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables" on page 47). 6. Remove the BBWC battery (on page 32), if necessary. 7.
To replace the component, reverse the removal procedure. PCI riser board assembly To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Disconnect any internal or external cables connected to any existing expansion boards. 5.
5. Remove the expansion board. To replace the component, reverse the removal procedure. Storage controller To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Disconnect the storage controller cable. 5. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).
6. Remove the storage controller. To replace the component, reverse the removal procedure. PCI Express riser board To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36). 5. Remove the expansion board ("Expansion boards" on page 36). 6. Remove the PCI Express riser board. To replace the component, reverse the removal procedure.
DIMMs To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 26). 3. Remove the access panel. 4. Open the DIMM slot latches. 5. Remove the DIMM. To replace the component, reverse the removal procedure. Memory options You can expand server memory by installing PC4200 DDR2 unbuffered SDRAM DIMMs. The system supports up to four ECC DDR2 SDRAM DIMMs. NOTE: By default, the server is set to Advanced ECC Support.
The following table lists some, but not all, possible configurations. For best performance, HP recommends dual-bank interleaved mode configurations.
8. Lift the power supply from the server. To replace the component, reverse the removal procedure. Processor To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.
5. Remove the heatsink. 6. Open the processor retaining clip and bracket, and remove the processor. To replace the component, reverse the removal procedure. IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is properly oriented. System board To remove the component: 1. Power down the server (on page 26). 2. Remove the server from the rack (on page 27). 3. Remove the access panel. 4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).
7. Disconnect the power supply cables from the system board ("Power supply" on page 40). 8. Disconnect the SATA hard drive cables from the system board ("Cabling" on page 45). 9. Disconnect the media cage cables from the system board ("Media cage cables" on page 47). 10. Remove the processor ("Processor" on page 41). 11. Remove the screws securing the system board. 12. Remove the system board. To replace the component, reverse the removal procedure.
Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • Do not attempt to recharge the battery.
Cabling In this section Cabling overview................................................................................................................................... 45 Embedded SATA controller cable routing .................................................................................................. 45 Optional SAS/SATA controller cable routing ............................................................................................. 46 Media cage cables.......................................
Optional SAS/SATA controller cable routing CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or air flow can be blocked.
Media cage cables Item Description 1 Diskette drive cable 2 Media cage power cable 3 Optical drive cable 4 Internal USB cable 5 Power button/LED cable Cabling 47
Diagnostic tools In this section Troubleshooting resources ....................................................................................................................... 48 SmartStart software ................................................................................................................................ 48 SmartStart Scripting Toolkit......................................................................................................................
• Preparing the system for installing "off-the-shelf" versions of leading operating system software • Installing optimized server drivers, management agents, and utilities automatically with every assisted installation • Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 51) • Installing software drivers directly from the CD.
• Language selection For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/servers/smartstart). ROMPaq utility Flash ROM enables you to upgrade the firmware (BIOS) with system or option ROMPaq utilities. To upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system. The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM revisions.
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Integrated Lights-Out 2 technology The iLO 2 subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO 2 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 2 independent of the host server and its operating system.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation. For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags). USB support HP provides both standard USB support and legacy USB support.
Array Diagnostic Utility ADU is a tool that collects information about array controllers and generates a list of detected problems. ADU can be accessed from the SmartStart CD ("SmartStart software" on page 48) or downloaded from the HP website (http://www.hp.com).
Component identification In this section Front panel components .......................................................................................................................... 54 Front panel LEDs and buttons ................................................................................................................... 55 Rear panel components...........................................................................................................................
Front panel LEDs and buttons Item Description 1 UID button/LED Status Blue = Identification is activated. Flashing blue = System is being remotely managed. Off = Identification is deactivated. 2 Internal health LED Green = System health is normal. Amber = System is degraded. To identify the component in a degraded state, refer to system board LEDs (on page 59). Red = System critical. To identify the component in a critical state, refer to system board LEDs (on page 59).
Rear panel components Item Description 1 PCI Express expansion slot, (optional PCI-X, full-length) 2 PCI Express expansion slot 1, low-profile, half-length 3 Power supply 4 UID button/LED 5 10/100/1000 NIC 2 6 10/100/1000 NIC 1 7 iLO 2 management port 8 Serial connector 9 Keyboard connector 10 Mouse connector 11 Video connector 12 USB connectors (2) Component identification 56
Rear panel LEDs and buttons Item Description Status 1 iLO 2 activity Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 2 iLO 2 link Green = Link exists. Off = No link exists. 3 10/100/1000 Green = Link exists. NIC 1 activity Flashing green = Activity exists. Off = No link exists. 4 5 10/100/1000 Green = Link exists. NIC 1 link Off = No link exists. 10/100/1000 Green = Activity exists. NIC 2 activity Flashing green = Activity exists.
System board components Item Description Item Description 1 System maintenance switch 12 Fan 2 connector 2 NMI switch 13 Fan 1 connector 3 Battery 14 Main power connector 4 Hard drive connector 1 15 Processor socket 5 Hard drive connector 2 16 Auxiliary power connector 6 Front panel LED board connector 17 DIMM slot 4 (bank B) 7 Front USB connectors (2) 18 DIMM slot 3 (bank B) 8 Fan 4 connector 19 DIMM slot 2 (bank A) 9 Optical drive connector 20 DIMM slot 1 (bank A)
Position Default Function S5 Off Off = Power-on password enabled On = Power-on password disabled * S6 Off Off = Normal operation On = BIOS will clear CMOS and NVRAM * S7 Off Reserved S8 Off Reserved * "On" activates the function. NMI switch The NMI switch allows administrators to perform a memory dump before performing a hard reset. Crash dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in operating systems, device drivers, and applications.
Item Description Status 3 PCI riser interlock Amber = PCI riser cage not seated. Off = PCI riser cage is seated. 4 Power supply signal Amber = Power supply signal cable is not connected. Off = Power supply signal cable is connected. 5 System fan module Amber = One fan in this module has failed. Red = Multiple fans in this module have failed. Off = All fans in this module are operating normally. 6 PPM Amber = PPM has failed. Off = PPM is operating normally. 7 DIMM 4 Amber = DIMM has failed.
System LED and Color Internal Health LED Color Status Amber • DIMM in slot X has reached single-bit correctable error threshold. • DIMM in slot X is in a pre-failure condition. • DIMM in slot X is an unsupported type, but valid memory exists in another bank. DIMM failure, all slots in one bank (amber) Red No valid or usable memory is installed in the system. Overtemperature (amber) Amber The Health Driver has detected a cautionary temperature level.
SATA and SAS device numbers Item Description 1 Device 1 2 Device 2 Fan assembly location Component identification 62
Specifications In this section Server specifications ............................................................................................................................... 63 Environmental specifications .................................................................................................................... 64 DDR2 SDRAM DIMM specifications.......................................................................................................... 64 1.44-MB diskette drive specifications..
Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** — Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADU Array Diagnostics Utility ASR Automatic Server Recovery BIOS Basic Input/Output System CSR Customer Self Repair DDR double data rate DIMM dual inline memory module ECC error checking and correcting iLO Integrated Lights-Out IML Integrated Management Log ISEE Instant Support Enterprise Edition Acronyms and abbreviations 66
LED light-emitting diode NIC network interface controller NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays OS operating system PCI peripheral component interface PCI Express peripheral component interconnect express PCI-X peripheral component interconnect extended PCIe peripheral component interconnect express POST Power-On Self Test PPM processor power module PSP ProLiant Support Pack RAM random access memory Acronyms and abbreviations 67
RBSU ROM-Based Setup Utility ROM read-only memory SAS serial attached SCSI SATA serial ATA SCSI small computer system interface SDRAM synchronous dynamic RAM SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus Acronyms and abbreviations 68
Index A E access panel 27 ADU (Array Diagnostic Utility) 53 Array Diagnostic Utility (ADU) 53 ASR (Automatic Server Recovery) 51, 66 Automatic Server Recovery (ASR) 51, 66 Autorun menu 48 electrostatic discharge 23 environmental specifications 64 expansion board 36, 45, 46 extending server from rack 26 external health LED 54, 55 B battery 44, 59 battery-backed write cache battery pack 32 bezel, server 29 BIOS upgrade 50 blue screen event 59 buttons 54 C cables 45, 46, 47 cabling 45, 46, 47 cautions 25
M S management tools 48 media cage 33, 47 memory 39, 40 memory dump 59 memory, interleaving 40 safety considerations 23 SATA backplane 30 scripted installation 49 serial connector 58 serial label pull tab 29 SmartStart autorun menu 48 SmartStart Scripting Toolkit 49 SmartStart, overview 48 spare part numbers 15, 18 specifications 63, 64, 65 specifications, environmental 64 specifications, server 63 static electricity 23 storage controller 37, 46 support packs 48 Survey Utility 52 symbols on equipment 24
