HP ProLiant DL360 Generation 5 Server Maintenance and Service Guide Part Number 406389-403 September 2008 (Twelfth Edition)
© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 16 Mechanical components.............................................
Cabling overview .................................................................................................................................... 63 Array controller cabling ........................................................................................................................... 63 HP Smart Array E200i Controller cabling ......................................................................................... 63 HP Smart Array P400i Controller cabling ..................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1 Access panel 412209-001 Mandatory1 2 Plastics kit 412208-001 Mandatory1 a) Optical drive ejector assembly — — b) Front bezel — — c) Optical device blank * — — d) Expansion slot covers (2) * — — e) Screws, M3×0.
Item 3 Description Spare part number Customer self repair (on page 5) k) Hard drive bezel blank SFF — — l) Power supply blank — — Hard drive blank LFF 392613-001 Mandatory1 Rack mounting hardware 4 Rack mounting hardware kit * 360104-001 Mandatory1 5 Cable management arm * 360105-001 Mandatory1 *Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.
System components Item Description Spare part number Customer self repair (on page 5) 6 System fan module 412212-001 Mandatory1 7 Hot-plug power supply, 700 W 412211-001 Mandatory1 8 PCI riser board assembly 412200-001 Mandatory1 9 Processor — — a) Dual-Core, Intel® Xeon® Processor 5050 (3.00-GHz, 667MHz FSB, 2x2-MB L2 cache)† 409423-001 Optional2 b) Dual-Core, Intel® Xeon® Processor 5060 (3.
Item Description Spare part number Customer self repair (on page 5) g) Dual-Core, Intel® Xeon® Processor 5140 (2.33-GHz, 1333MHz FSB, 2x2-MB L2 cache)*† 416797-001 Optional2 h) Dual-Core, Intel® Xeon® Processor 5148 (2.33-GHz, 1333MHz FSB, LV, 771 LG*† 431716-001 Optional2 i) Dual-Core, Intel® Xeon® Processor 5150 (2.66-GHz, 1333MHz FSB, 2x2-MB L2 cache)*† 416798-001 Optional2 j) Dual-Core, Intel® Xeon® Processor 5160 (3.
Item Description Spare part number Customer self repair (on page 5) cc) Quad-Core, Intel® Xeon® Processor X5470 (3.33-GHz, 1333-MHz FSB, 4x2-MB L2 cache), 120-W*† 497545-001 Optional2 dd) Quad-Core, Intel® Xeon® Processor X5470 (2.
Item Description Spare part number Customer self repair (on page 5) 21 HP Smart Array P400i Controller battery pack 398648-001 Optional2 22 HP Smart Array E200i Controller memory module, 64-MB* 412800-001 Optional2 23 HP Smart Array E200i Controller memory module, 128-MB* 413486-001 Optional2 24 HP Smart Array P400i Controller memory module, 256-MB* 405836-001 Optional2 25 HP Smart Array P400i Controller memory module, 512-MB* 405835-001 Optional2 Miscellaneous 26 SAS cable* 408763
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario.
Illustrated parts catalog 24
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.
Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 27). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. 1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. 3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on the front and rear panels of the server. 4. Press the Power On/Standby button to place the server in standby mode.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated. To replace the component, reverse the removal procedure. Hot-plug SAS or SATA hard drives CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated.
Front bezel 1. Power down the server (on page 27). 2. Extend the server from the rack (on page 27). 3. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 29) and hard drive blanks (on page 28). 4. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it from the chassis. 5. Use the T-10 Torx screwdriver to remove the screws located on the top and sides of the front bezel. 6.
Hard drive bezel blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Remove hard drives 1 and 2 ("Hot-plug SAS or SATA hard drives" on page 29). 2. Remove the hard drive bezel blank. To replace the component, reverse the removal procedure. Multibay blank or device To remove the component: 1. Power down the server (on page 27).
To replace the component, reverse the removal procedure. Multibay device ejector To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove any device in the multibay ("Multibay blank or device" on page 31). 4. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 29) and hard drive blanks (on page 28). 5.
8. Remove the multibay device ejector. To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part. CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies.
3. Remove the power supply. To replace the component, reverse the removal procedure. Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. PCI riser board assembly CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly.
1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the PCI riser board assembly: a. Disconnect external cables connected to any existing expansion boards. b. Loosen the four PCI riser board assembly thumbscrews. c. 5. Lift the assembly to unseat the PCI riser boards and remove the assembly.
5. Remove any expansion board installed in the assembly. To replace the component, reverse the removal procedure. PCI Express riser board To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 34). 5.
To replace the component, reverse the removal procedure. Power supply air baffle To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the air baffle. To replace the component, reverse the removal procedure. Processor air baffle To remove the component: 1.
4. Remove the air baffle. To replace the component, reverse the removal procedure. Fan modules The server has three fan modules ("Fan locations" on page 81). To remove a fan module: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). NOTE: The connectors of an installed fan module are tightly seated in the server.
b. Remove fan module 1. 5. To remove fan module 2 or 3: a. Remove the processor air baffle ("Processor air baffle" on page 37). b. Remove fan module 2 or 3. To replace the component, reverse the removal procedure. IMPORTANT: After installing the fan module, firmly press the top of the module connectors to ensure the connectors are seated properly. Multibay backplane assembly To remove the component: 1. Power down the server (on page 27).
2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the processor air baffle ("Processor air baffle" on page 37). 5. Remove fan module 3 ("Fan modules" on page 38). 6. Disconnect the cable from the multibay backplane. 7. Remove any device in the multibay ("Multibay blank or device" on page 31). 8.
8. o HP Smart Array E200i Controller battery tray o HP Smart Array P400i Controller battery tray Remove the battery pack ("Battery pack" on page 41). To replace the component, reverse the removal procedure. Battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: 1. Power down the server (on page 27).
2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the processor air baffle ("Processor air baffle" on page 37). 5. Remove the power supply air baffle ("Power supply air baffle" on page 37). 6. Remove fan module 2 ("Fan modules" on page 38). 7. Remove the battery tray ("Battery tray" on page 40). 8. Remove the battery pack: 9.
SAS backplane To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove all SAS or SATA hard drives ("Hot-plug SAS or SATA hard drives" on page 29). 5. Remove any device in the multibay ("Multibay blank or device" on page 31). 6.
13. Remove the backplane. To replace the component, reverse the removal procedure. Systems Insight Display The Systems Insight Display is an assembly that includes the front panel LEDs, Power On/Standby button, and a cable. To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4.
11. Remove the T-15 Torx screw that secures the Systems Insight Display. 12. Remove the Systems Insight Display. To replace the component, reverse the removal procedure. Integrated HP Smart Array E200i Controller or HP Smart Array P400i Controller To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3.
5. Disconnect all cables from the integrated array controller. 6. Disconnect the backplane power cable from the system board. 7. Turn the quarter-turn fasteners counter-clockwise. 8. Remove the integrated array controller. To replace the component, reverse the removal procedure. HP Smart Array E200i Controller memory module To remove the component: 1. Power down the server (on page 27). 2.
4. Remove the power supply air baffle ("Power supply air baffle" on page 37). 5. Remove the existing memory module. To replace the component, reverse the removal procedure. HP Smart Array P400i Controller memory module To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4.
To replace the component, reverse the removal procedure. FBDIMMs To remove the component: 1. Power down the server (on page 27). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove the server from the rack" on page 28). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the FBDIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 27). 2.
6. Open the heatsink retaining latches. 7. Remove the heatsink. To replace the heatsink: 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply new grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
3. Install the heatsink. 4. Install the processor air baffle ("Processor air baffle" on page 37). 5. Install the power supply air baffle ("Power supply air baffle" on page 37). 6. Install the access panel ("Access panel" on page 28). Processor The server supports single- and dual-processor operation. With two processors installed, the server supports boot functions through the processor installed in processor socket 1.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. IMPORTANT: If upgrading processor speed, update the system ROM before installing the processor. To remove a processor: 1. Update the system ROM. Locate and download the latest ROM version from the HP website (http://h18023.www1.hp.com/support/files/server/us/romflash.html). Follow the instructions on the website to update the system ROM. 2. Power down the server (on page 27). 3.
8. Remove the heatsink. 9. Open the processor retaining latch and the processor socket retaining bracket.
10. Using your fingers, remove the failed processor. To replace a processor: IMPORTANT: Be sure the processor remains inside the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket.
3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6.
7. Install the heatsink. 8. Install the processor air baffle ("Processor air baffle" on page 37). 9. Install the power supply air baffle ("Power supply air baffle" on page 37). 10. Install the access panel ("Access panel" on page 28). System battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
6. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System board To remove the component: 1. Power down the server (on page 27). 2.
12. Open the processor retaining latch and the processor socket retaining bracket on the failed system board. 13. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
14. Remove the failed system board. To replace the system board: 1. Install the spare system board in the server before installing the processor. 2. Prepare the processor socket on the spare system board: a. Open the processor retaining latch and the processor socket retaining bracket.
b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the processor socket of the failed system board. The cover protects the socket during shipping when the failed board is returned. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. 7.
IMPORTANT: Install all components with the same configuration that was used on the failed system board. 9. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Serial Number. The following warning is displayed: Warning: The serial number should ONLY be modified by qualified service personnel.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
HP Smart Array P400i Controller cabling CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation. Be sure to route the cables around the access panel mounting pin bracket so as not to interfere with access panel installation. PCI Smart Array controller cabling CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation.
Battery pack cabling • HP Smart Array E200i Controller battery pack cabling Cabling 65
• HP Smart Array P400i Controller battery pack cabling Multibay backplane cabling Cabling 66
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 69) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that may not be supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer.
Open Services Event Manager OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, analysis, and notification. The tool gathers event data from SNMP traps or information provided over an HTTP interface and notifies an administrator or HP through SMTP and ISEE. For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/).
Component identification Front panel components Item Description 1 Hard drive bay 5 (optional)* 2 Hard drive bay 6 (optional)* 3 Multibay drive bay 4 USB connector 5 HP Systems Insight Display 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 Hard drive bay 1 *An optional controller is required when the server is configured with six hard drives.
Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Green = System is on. Amber = System is shut down, but power is still applied. Off = Power cord is not attached, power supply failure has occurred, no power supplies are installed, facility power is not available, or disconnected power button cable. 2 UID button/LED Blue = Identification is activated. Flashing blue = System is being remotely managed. Off = Identification is deactivated.
Item Description Status 6 NIC 2 link/activity LED Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on the RJ-45 connector for status by referring to the rear panel LEDs ("Rear panel LEDs and buttons" on page 74).
Rear panel LEDs and buttons Item Description Status 1 iLO 2 NIC activity LED Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 2 3 iLO 2 NIC link LED Green = Link exists. 10/100/1000 Green = Activity exists. NIC 1 activity LED Flashing green = Activity exists. Off = No link exists. Off = No activity exists. 4 5 10/100/1000 Green = Link exists. NIC 1 link LED Off = No link exists. 10/100/1000 Green = Activity exists.
System board components Item Description 1 System maintenance switch (SW1) 2 NMI switch 3 FBDIMM slots (1-8) 4 Processor socket 2 5 Processor socket 1 6 Multibay drive connector 7 Power button connector 8 Fan module 3 connectors 9 Fan module 2 connectors 10 Fan module 1 connectors 11 SAS hard drive backplane power connector 12 Integrated Smart Array controller connector 13 Power supply connector 1 14 Power supply connector 2 15 Internal USB connector 16 System battery 17
System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = Normal On = ROM treats system configuration as invalid.
To view the LEDs, access the HP Systems Insight Display.
The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may report server status differently than the health LEDs because the software tracks more system attributes. HP Systems Insight Display LED and color Internal health LED color Processor failure, socket X Red (amber) Status One or more of the following conditions may exist: • Processor in socket X has failed. • Processor X is required yet not installed in the socket. • Processor X is unsupported.
SAS and SATA device numbers • Four hard drive configuration • Six hard drive configuration Component identification 79
SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing irregularly Amber, flashing regularly (1 Hz) The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible. Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/). FBDIMM specifications CAUTION: Be sure to install FBDIMMs in the proper configuration. Refer to the Documentation CD.
Specification Value Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA; Photo CD (single/multiple-session), CD-XA ready; CDi ready Capacity 550 MB (mode 1, 12 cm) 640 MB (mode 2, 12 cm) Block size 2368, 2352 b
Specification Value Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specifications Specification Value Disk formats DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session) Capacity 4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.
Specification Value Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.
Acronyms and abbreviations ABEND abnormal end ADU Array Diagnostics Utility ASR Automatic Server Recovery BBWC battery-backed write cache FBDIMM fully buffered DIMM iLO 2 Integrated Lights-Out 2 IML Integrated Management Log NIC network interface controller NMI non-maskable interrupt NVRAM non-volatile memory OSEM Open Services Event Manager PCI Express Peripheral Component Interconnect Express Acronyms and abbreviations 87
PCI-X peripheral component interconnect extended PPM processor power module PSP ProLiant Support Pack RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SIM Systems Insight Manager UID unit identification USB universal serial bus WEBES Web-Based Enterprise Service Acronyms and abbreviations 88
Index A E AC power supply 73, 75 access panel 28 additional information 67 ADU (Array Diagnostic Utility) 67 air baffle 27, 37 array controller, cabling 63 Array Diagnostic Utility (ADU) 67 ASR (Automatic Server Recovery) 69 Automatic Server Recovery (ASR) 69 electrostatic discharge 25 environmental requirements 82 environmental specifications 82 expansion boards 35 extending server from rack 27 external health LED 71, 72 B backplane, SAS 43 battery 56, 76 battery-backed write cache battery pack 40 batt
K keyboard connector 73 L LED, external health 72 LED, internal health 72 LED, power on 72 LED, system power 72 LED, UID 72, 74 LEDs 71, 80 LEDs, hard drive 80 LEDs, NIC 72, 74 LEDs, power supply 74 M management tools 67 mechanical components 16 memory dump 76 memory slot LEDs 76, 77 mezzanine boards, removing 45 mouse connector 73 multibay backplane assembly 39 multibay backplane, cabling 66 multibay blank, removing 31 multibay device ejector, removing 33 multibay/SAS backplane, removing 39 N NIC LEDs 7
V video connector 71, 74 W warnings 26 Index 91
