HP ProLiant DL360 G7 Server Maintenance and Service Guide Part Number 608339-003 September 2010 (Third Edition)
© Copyright 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ............................................................................................................................ 5 Illustrated parts catalog ............................................................................................................... 16 Mechanical components ..........................................
Cabling overview ....................................................................................................................................... 58 Hard drive backplane cabling ..................................................................................................................... 58 BBWC battery pack or FBWC capacitor pack cabling ................................................................................... 59 DVD-ROM and DVD-RW drive cabling .....................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP.
Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1 Access panel 532146-001 Mandatory1 2 Hardware and plastics kit 532392-001 Mandatory1 a) Air baffle — — b) Power supply blank — — c) Fan blank — — d) Dual bezel blank — — e) Hard drive bezel blank (2) — — 3 Hard drive blank 392613-001 Mandatory1 4 Hard drive cage* 532391-001 Mandatory1 Rack mounting hardware Illustrated parts catalog 16
Item Description Spare part number Customer self repair (on page 5) 5 Rack mounting hardware kit* 533877-001 Mandatory1 6 Cable management arm* 360105-001 Mandatory1 *Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
System components Item Description Spare part number Customer self repair (on page 5) 7 Fan module 532149-001 Mandatory1 8 Hot-plug power supplies — — a) 460 W, 92% 511777-001 Mandatory1 b) 460 W, 94%* 599381-001 Mandatory1 c) 750 W, 92%* 511778-001 Mandatory1 d) 750 W, 94%* 599383-001 Mandatory1 e) 1200 W, 90%* 498152-001 Mandatory1 f) 1200 W -48V dc* 451816-001 Mandatory1 9 PCI riser board assembly 493802-001 Mandatory1 10 Processor — — a) 2.
Item 11 Description Spare part number Customer self repair (on page 5) f) 2.26-GHz Intel® Xeon® processor L5640* ** 594890-001 Optional2 g) 2.66-GHz Intel® Xeon® processor E5640* ** 594885-001 Optional2 h) 2.66-GHz Intel® Xeon® processor X5650* ** 594884-001 Optional2 i) 2.80-GHz Intel® Xeon® processor X5660* ** 594883-001 Optional2 j) 2.
Item Description Spare part number Customer self repair (on page 5) a) 72-GB, SAS, 15,000-rpm* 418398-001 Mandatory1 b) 72-GB, SAS, 15,000-rpm, 6G* 512743-001 Mandatory1 c) 146-GB, SAS, 10,000-rpm* 418399-001 Mandatory1 d) 146-GB, SAS, 10,000-rpm, 6G* 507283-001 Mandatory1 e) 146-GB, SAS, 15,000-rpm* 504334-001 Mandatory1 f) 146-GB, SAS, 15,000-rpm, 6G* 512744-001 Mandatory1 g) 300-GB, SAS, 10,000-rpm* 493083-001 Mandatory1 h) 300-GB, SAS, 10,000-rpm, 6G* 507284-001 Mandatory1 i)
Item 26 Description Spare part number Customer self repair (on page 5) c) PCI power cable — — d) Power button and Systems Insight Display button cable — — e) SATA DVD-ROM drive cable — — 631834-001 Mandatory1 Cables a) MINI-SAS to SATA cable, 18 in.* *Not shown **All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption. 1 Mandatory—Parts for which customer self repair is mandatory.
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario.
Illustrated parts catalog 24
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (on page 76) (provided inside the server) • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 62) Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 26).
5. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button. 6. Disconnect the power cords. The system is now without power. Extend the server from the rack NOTE: If the optional cable management arm option is installed, you can extend the server without powering down the server or disconnecting peripheral cables and power cords. These steps are only necessary with the standard cable management solution. 1. Power down the server (on page 25). 2.
• Avoid hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly.
WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it.
1. Remove hard drives 1 and 2. 2. Remove the hard drive bezel blank. To replace the component, reverse the removal procedure. Dual bezel blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated. To replace the component, reverse the removal procedure.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated. To replace the component, slide the component into the bay until it clicks. SAS and SATA hard drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1.
Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part. CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies.
5. Remove the hot-plug power supply. WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the power cord to the power supply until the power supply is installed. To replace the component: 1. Slide the hot-plug power supply into the power supply bay. 2. Connect the power cord to the power supply. 3. Install the cable management arm, if removed. 4. Route the power cord through the cable management arm or power cord anchor.
4. Remove the hard drive cage. To replace the component, reverse the removal procedure. DVD tray To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6.
7. Remove the DVD tray. 8. Remove the screw from the rear of the DVD tray. 9. Remove the DVD-ROM or DVD-RW drive from the DVD tray. To replace the component, reverse the removal procedure. DVD-ROM or DVD-RW drive To remove the component: 1. Power down the server (on page 25).
2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6. Disconnect the SATA DVD cable from the rear of the DVD tray and the system board ("DVD-ROM and DVD-RW drive cabling" on page 60). 7. Remove the DVD tray ("DVD tray" on page 33). 8.
4. Remove the fan module. To replace the component: 1. Install the fan module. 2. Install the access panel ("Access panel" on page 28). 3. Slide the server into the rack. 4. Power up the server. Fan blank Install fan 2 only when processor 2 is installed. When only one processor is installed, always install the fan blank. To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28).
4. Remove the fan blank. To replace the component, reverse the removal procedure. BBWC battery pack or FBWC capacitor pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4.
To replace the component, reverse the removal procedure. Air baffle To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle. To replace the component, reverse the removal procedure.
c. 7. Lift the assembly to unseat the PCI riser boards, and then remove the assembly. Remove all expansion boards ("Expansion boards" on page 39). To replace the component, reverse the removal procedure. Expansion boards To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4.
PCIe riser board To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6. Remove the PCI riser board assembly ("PCI riser board assembly" on page 38). 7.
8. Remove the full-length PCI-X riser board from the riser board assembly. To replace the component, reverse the removal procedure. Cache module To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6.
Optional hard drive backplane assembly (top) To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. Remove the hard drives from hard drive bays 5, 6, 7, and 8 ("SAS and SATA hard drive" on page 30). 5. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 6. Remove the air baffle ("Air baffle" on page 38). 7.
6. Remove the air baffle ("Air baffle" on page 38). 7. Remove all fan modules ("Fan module" on page 35). 8. Remove the fan blank ("Fan blank" on page 36). 9. Disconnect the hard drive data cable and the hard drive power cable from the optional hard drive backplane and the system board ("Hard drive backplane cabling" on page 58). 10. Remove the optional hard drive backplane ("Optional hard drive backplane assembly (top)" on page 42). 11.
7. Remove the HP Systems Insight Display and LED assembly. To replace the component, reverse the removal procedure. DIMMs To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6. Remove the DIMM.
To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 26). 3. Remove the access panel ("Access panel" on page 28). 4. If installed, remove the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 5. Remove the air baffle ("Air baffle" on page 38). 6. Remove the heatsink. To replace the heatsink: 1.
3. Install the heatsink. 4. Install the air baffle ("Air baffle" on page 38). 5. If removed, install the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 6. Install the access panel ("Access panel" on page 28). 7. Slide the server into the rack. Processor The server supports single- and dual-processor operation. Fan 2 is required only when processor 2 is installed in the server. When only one processor is installed, always install the fan blank.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor. To remove a processor: 1. Update the system ROM. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM. 2. Power down the server (on page 25). 3. Extend the server from the rack (on page 26). 4.
9. Using your fingers, remove the failed processor. To replace a processor: IMPORTANT: Be sure the processor remains inside the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket.
3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution.
7. Install the heatsink. 8. Install the air baffle ("Air baffle" on page 38). 9. If removed, install the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 10. Install the access panel ("Access panel" on page 28). 11. Slide the server into the rack. 12. Power up the server. System battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock.
7. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System board To remove the component: 1. Power down the server (on page 25). 2. Remove the server from the rack (on page 26). 3.
13. Remove the optional hard drive backplane ("Optional hard drive backplane assembly (top)" on page 42). 14. Remove the hard drive backplane ("Standard hard drive backplane assembly (bottom)" on page 42). 15. Remove all DIMMs ("DIMMs" on page 44). 16. Remove the heatsink ("Heatsink" on page 45). 17. Open the processor retaining latch and the processor socket retaining bracket. CAUTION: To avoid damage to the processor: • Handle the processor only by the edges.
CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket. CAUTION: To avoid damage to the processor: • Handle the processor only by the edges. • Do not touch the bottom of the processor, especially the contact area. 19. Remove the failed system board. To replace the system board: 1.
b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the processor socket of the failed system board. 4. Install the processor on the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. 8. Install the heatsink ("Heatsink" on page 45).
12. Install the air baffle ("Air baffle" on page 38). 13. If removed, install the BBWC battery pack or the FBWC capacitor pack ("BBWC battery pack or FBWC capacitor pack" on page 37). 14. Install the access panel ("Access panel" on page 28). 15. Slide the server into the rack. 16. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Optional hard drive backplane BBWC battery pack or FBWC capacitor pack cabling Cabling 59
DVD-ROM and DVD-RW drive cabling Power button and Systems Insight Display cabling Cabling 60
PCI power cabling Cabling 61
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation. For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).
ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.
Component identification Front panel components Item Description 1 Hard drive bay 5 (optional)* 2 Hard drive bay 6 (optional)* 3 DVD tray/hard drive bays 7 and 8 (optional)* 4 HP Systems Insight Display 5 Front USB connector 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 Hard drive bay 1 *An optional hard drive backplane is required when the server is configured with eight hard drives.
Front panel LEDs and buttons Item Description Status 1 UID LED/button Blue = Identification is activated. Flashing blue = System is being managed remotely. Off = Identification is deactivated. 2 Health LED Green = System health is normal. Amber = System health is degraded. To identify the component in a degraded state, see "Systems Insight Display LEDs (on page 71)". Red = System health is critical. To identify the component in a critical state, see "Systems Insight Display LEDs (on page 71)".
Rear panel components Item Description 1 Slot 1 PCIe2 x8 (8, 4, 2, 1) 2 Slot 2 PCIe2 x16 (16, 8, 4, 2, 1), 75W +EXT 75W* 3 Power supply bay 1 (populated) 4 Power supply bay 2 5 iLO 3 connector 6 Serial connector 7 Video connector 8 NIC 4 connector 9 NIC 3 connector 10 NIC 2 connector 11 NIC 1 connector 12 USB connectors (2) *This expansion slot provides 75 W of power to an adapter, with an additional 75 W of power supplied by external power.
Rear panel LEDs and buttons Item Description Status 1 10/100/1000 Green = Activity exists. NIC activity LED Flashing green = Activity exists. Off = No activity exists. 2 3 10/100/1000 Green = Link exists. NIC link LED Off = No link exists. iLO 3 NIC activity LED Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 4 iLO 3 NIC link LED Green = Link exists. Off = No link exists. 5 UID button/LED Blue = Identification is activated.
System board components Item Description 1 NMI jumper 2 System maintenance switch 3 10Gb sideband connector 4 SATA DVD-ROM drive connector 5 SAS cache module connector 6 Power button connector 7 Hard drive data connector 1 (drives 1-4) 8 Hard drive data connector 2 (drives 5-8) 9 Processor 1 DIMM slots (9) 10 Fan module 4 connector 11 Processor socket 1 (populated) 12 Fan module 3 connector 13 Fan module 2 connector 14 Processor socket 2 15 Fan module 1 connector 16 Process
Item Description 23 Power supply connector 2 24 PCI power connector 25 TPM connector 26 PCIe riser board connectors (2) DIMM slots DIMM slots are numbered sequentially (1 through 9) for each processor. The supported AMP modes use the letter assignments for population guidelines. System maintenance switch Position Default Function S1 Off Off = iLO 3 security is enabled. On = iLO 3 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked.
Position Default Function S8 — Reserved S9 — Reserved S10 — Reserved When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM. CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. NMI jumper The NMI jumper allows administrators to perform a memory dump before performing a hard reset.
Item Description Status combinations (on page 72)." 2 NIC LEDs Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. For status, see "Rear panel LEDS and buttons (on page 68).
Systems Insight Display LED and color Health LED System power LED Status Fan (amber) Red Green Two or more fans have failed or been removed. Power supply (amber) Red Amber • Only one power supply is installed and that power supply is in standby. • • Power supply fault • Redundant power supply is installed and only one power supply is functional. • AC power cord is not plugged into redundant power supply.
• Eight-hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Fan modules • One-processor configuration Component identification 74
When only one processor is installed, be sure the fan blank is always installed to ensure proper cooling. • Two-processor configuration Install fan 2 only when processor 2 is installed. When only one processor is installed, always install the fan blank.
T-10/T-15 Torx screwdriver The server includes a T-10/T-15 Torx screwdriver that ships on the air baffle. Use the screwdriver to loosen screws or thumbscrews, as needed, during procedures.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
• HP 750 W CS Platinum Power Supply (94%) specifications (on page 79) • HP 1200 W CS HE Power Supply (90%) specifications (on page 80) • HP 1200 W CS -48Vdc Power Supply specifications (on page 80) HP 460 W CS HE Power Supply (92%) specifications Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 5.5 A at 100 VAC 2.
460 W at 200V to 240V AC input Maximum peak power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input HP 750 W CS HE Power Supply (92%) specifications Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 8.9 A at 100 VAC 4.
Rated steady-state power 750 W at 100V to 120V AC input 750 W at 200V to 240V AC input Maximum peak power 750 W at 100V to 120V AC input 750 W at 200V to 240V AC input HP 1200 W CS HE Power Supply (90%) specifications Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 9.7 A at 100 VAC 7.
Rated input power 1380 W at -36V DC input 1365 W at -72V DC input 1350 W at -48V DC, nominal input BTUs per hour 4713 at -36V DC input 4662 at -72V DC input 4610 at -48V DC, nominal input Power supply output Rated steady-state power 1200 W Rated peak power 1200 W CAUTION: This equipment is designed to permit the connection of the earthed conductor of the DC supply circuit to the earthing conductor at the equipment. See installation instructions.
Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).
Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache CSR Customer Self Repair iLO 3 Integrated Lights-Out 3 IML Integrated Management Log NMI non-maskable interrupt NVRAM non-volatile memory PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended PSP ProLiant Support Pack Acronyms and abbreviations 83
RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SIM Systems Insight Manager UID unit identification USB universal serial bus Acronyms and abbreviations 84
Index A AC power supply 77, 78, 79 access panel 16, 27 additional information 61 air baffle 16, 24, 37 ASR (Automatic Server Recovery) 62 Automatic Server Recovery (ASR) 62 B battery 50, 68 battery-backed write cache battery pack 36 battery-backed write cache cabling 58 battery-backed write cache enabler cabling 58 BBWC (battery-backed write cache) 40 BBWC battery pack 36 BBWC cabling 58 buttons 64, 65, 67 C cables 57 cabling 57 cabling, battery pack 58 cabling, BBWC 58 cabling, server 57 cache module 40
hard drive blanks 16, 27, 28 hard drive cage 16, 31 hard drive data cable 41 hard drive data connector 68 hard drive LEDs 73 hard drive power connector 68 hard drives 29, 64, 72, 73 hard drives, determining status of 73 hardware kit 16 health driver 62 health LEDs 65, 73 heatsink 44 hot-plug power supply calculations 81 HP Enterprise Configurator 81 HP Insight Diagnostics 24, 61, 62 HP Insight Diagnostics survey functionality 62 HP Insight Remote Support software 63 HP Systems Insight Display 42 HP Systems
rear panel buttons 66, 67 rear panel components 66 rear panel LEDs 67 removal and replacement procedures 24 removing server from rack 25 replacement procedures 24 required tools 24 requirements, environmental 76 requirements, power 81 ROM-Based Setup Utility (RBSU) 61 S safety considerations 25 safety information 25 SAS device numbers 72 SAS hard drive LEDs 73 SATA drives 72 SATA DVD drive connector 68 SATA DVD-ROM drive cable 33 SATA hard drive LEDs 73 SD card slot 68 serial connector 66 server specificat
