HP ProLiant DL360p Gen8 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
© Copyright 2012, 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ............................................................................................................................ 5 Illustrated parts catalog ............................................................................................................... 15 Mechanical components ..........................................
Hard drive backplane cabling ..................................................................................................................... 67 FBWC capacitor pack cabling..................................................................................................................... 68 DVD-ROM and DVD-RW drive cabling ......................................................................................................... 69 Chipset SATA cable option ..............................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1 Access panel — — a) Caged heatsink access panel 671351-001 Mandatory1 b) Screw-down heatsink access panel* 743499-001 Mandatory1 Miscellaneous hardware kit 671354-001 Mandatory1 a) Power supply blank — — b) Power cord clip* — — c) Fan blank — — Hard drive blank — — a) SFF hard drive blank, 6.35 cm (2.5 in) 670033-001 Mandatory1 b) LFF hard drive blank, 8.
Item 7 8 Description Spare part number Customer self repair (on page 5) a) 8 SFF hard drive cage* ** 667868-001 Mandatory1 b) 10 SFF hard drive cage** 692479-001 Mandatory1 c) 4 LFF hard drive cage* ** 667869-001 Mandatory1 Rack mounting hardware — — Rack mounting hardware kit* — — a) 8 or 10 SFF ball bearing kit 675042-001 Mandatory1 b) 4 LFF ball bearing kit 675041-001 Mandatory1 c) Friction rail kit 675040-001 Mandatory1 d) SFF easy install rail kit 744111-001 Mandatory1
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden.
System components Illustrated parts catalog 18
Item Description Spare part number Customer self repair (on page 5) 9 Hot-plug power supplies — — a) 460 W, 92% 511777-001 Mandatory1 b) 460 W, Platinum Plus, 94%* 660184-001 Mandatory1 c) 500 W, 277 V AC, 94%* 638549-001 Mandatory1 d) 750 W, 277 V AC, 94%* 674890-001 Mandatory1 e) 750 W, Titanium 96%* 700287-001 Mandatory1 f) 750 W, 92%* 511778-001 Mandatory1 g) 750 W, Platinum Plus, 94%* 660183-001 Mandatory1 h) 750 W 48V DC, 92%* 639173-001 Mandatory1 i) 1200 W, Platinum P
Item 14 Description Spare part number Customer self repair (on page 5) m) 2.50-GHz Intel Xeon processor E5-2640, 95W* ** † 670527-001 Optional2 n) 2.0-GHz Intel Xeon processor E5-2640v2, 95W* ** † 730239-001 Optional2 o) 3.30-GHz Intel Xeon processor E5-2643, 130W* ** † 670538-001 Optional2 p) 3.3-GHz Intel Xeon processor E5-2643v2, 130W* ** † 730248-001 Optional2 q) 1.80-GHz Intel Xeon processor E5-2650L, 70W* ** † 670534-001 Optional2 r) 1.
Item 15 16 17 18 Description Spare part number Customer self repair (on page 5) n) 8-GB, PC3-14900R-13, dual-rank x4* 715273-001 Mandatory1 o) 8-GB, PC3-14900R-13, quad-rank x4* 735303-001 Mandatory1 p) 8-GB, PC3L-12800R-11, quad-rank x4* 735302-001 Mandatory1 q) 8-GB, PC3-12800R-1, single-rank x4* 664691-001 Mandatory1 r) 8-GB, PC3L-10600R-9, dual-rank x4* 664690-001 Mandatory1 s) 8-GB, PC3L-10600E-9, dual-rank x8* 664696-001 Mandatory1 t) 16-GB, PC3-12800R-11, dual-rank x4* 68403
Item Description Spare part number Customer self repair (on page 5) j) 400-GB, SATA, MLC SSD, 6.35 cm (2.5 in)* 653967-001 Mandatory1 k) 400-GB, SATA, MLC SSD, 8.89 cm (3.5 in)* 653970-001 Mandatory1 l) 400-GB, SAS, MLC SSD, 6.35 cm (2.5 in)* 653963-001 Mandatory1 m) 400-GB, SAS, SLC SSD, 6.35 cm (2.5 in)* 653962-001 Mandatory1 n) 450-GB, SAS, 6.35 cm (2.5 in)* 653956-001 Mandatory1 o) 450-GB, SAS, 8.89 cm (3.5 in)* 653951-001 Mandatory1 p) 500-GB, SAS, 6.35 cm (2.
Item Description Spare part number Customer self repair (on page 5) 25 Hard drive data cable or Mini-SAS cable, 45 cm (18 in)* 667874-001 Mandatory1 26 Hard drive data cable or Mini-SAS cable, 64 cm (25 in)* 667875-001 Mandatory1 27 Power to hard drive backplane cable* 667873-001 Mandatory1 28 Front video adapter* 671353-001 Optional2 29 SATA DVD-ROM drive cable* 667879-001 Optional2 30 Chipset SATA cable* 671353-001 Optional2 31 Mini-SAS straight cable, 83.
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 73) Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 26).
This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown. • Use a virtual power button selection through HP iLO. This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode. Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.
o 8 SFF configuration The display can be rotated up to 90 degrees.
o 10 SFF configuration The display can be rotated up to 90 degrees. Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly. Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.
WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it.
Remove the drive blank. To replace the component, slide the component into the bay until it clicks. Hot-plug drive CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Determine the status of the drive from the hot-plug drive LED definitions (on page 87). 2. Back up all server data on the drive. 3. Remove the drive.
Power supply blank Remove the blank. To replace the component, reverse the removal procedure. AC power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Access the product rear panel. 4.
To replace the component, reverse the removal procedure. 48V DC power supply option One of the following optional HP input cables with pre-fastened ring tongues may be purchased from HP or an authorized reseller: • A5S97A—1.3-m (7.55-ft) 48V DC Power Cable Kit • A5S98A—2.5-m (3.94-ft) 48V DC Power Cable Kit If you are not using an optional HP input cable, use an HP-approved 10 or 12 AWG green and yellow ground cable, no shorter than 150 cm (59.06 in), and 10 or 12 AWG power cables.
3. Remove the safety cover. 4. Remove the power ring tongues from the terminal block.
5. Remove the ground (earthed) wire from the ground screw and washer. 6. Attach the screws to the terminal block. IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5 mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).
7. Remove the power supply from the power supply bay. 8. If you are not immediately replacing the power supply, install the safety cover. To replace the component: 1. If you are not using an optional HP input cable or the ring tongues you crimped previously, with the ground cable disconnected from the 48V power source, crimp the ring tongues to the power and ground cables coming from the 48V source. IMPORTANT: The power supply uses two power ring tongues and one ground ring tongue.
2. Remove the safety cover from the terminal block on the front of the power supply. 3. Remove the screws from the terminal block. IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5 mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).
4. Attach the ground (earthed) wire to the ground screw and washer and tighten to 1.47 N m (13 lb-in) of torque. The ground wire must be connected before the positive or negative lead wires. 5. Attach the power ring tongues to the terminal block, following the polarity label below the terminal block, and then tighten the screws to 1.47 N m (13 lb-in) of torque.
6. Replace the safety cover. 7. Insert the power supply into the power supply bay until it clicks into place. 8. Route the power cord. Use best practices when routing power cords and other cables. A cable management arm is available to help with routing. To obtain a cable management arm, contact an HP authorized reseller. 9. Make sure the 48V DC power source is off or the PDU breaker is in the off position, and then connect the power cord to the 48V DC power source or PDU. 10.
Drive cage assembly The hard drive cage assembly includes the Systems Insight Display ("Systems Insight Display LEDs" on page 84), front panel LEDs and buttons (on page 78), drive backplane, and cables. To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove all drives ("Hot-plug drive" on page 31). 5.
4. Remove the access panel ("Access panel" on page 30). 5. If installed, remove the FBWC capacitor pack ("FBWC capacitor pack" on page 45). 6. For SFF drives, do the following: a. Disconnect the SATA DVD cable from the system board to fully remove the DVD drive from the bay ("DVD-ROM and DVD-RW drive cabling" on page 69). b. Remove the DVD drive from the server. The server may look different than the one shown in the following illustration, depending on the server model. c. 7.
b. Disconnect the SATA DVD cable from the rear of the DVD drive ("DVD-ROM and DVD-RW drive cabling" on page 69). To replace the component, reverse the removal procedure. Fan module The server has eight fans. Install fans 1 and 2 only when processor 2 is installed. When only one processor is installed, install the fan blanks in bays 1 and 2 ("Fan modules" on page 87). To remove the component: 1. Extend the server from the rack (on page 26). 2. Remove the access panel ("Access panel" on page 30).
The illustration shows fans 1 and 2 removed for a single-processor configuration. To replace the component: 1. Install the fan module. 2. Install the access panel ("Access panel" on page 30). 3. Slide the server into the rack. 4. Power up the server. Fan blank Install fans 1 and 2 only when processor 2 is installed. When only one processor is installed, install the fan blanks in bays 1 and 2 ("Fan modules" on page 87). To remove the component: 1. Power down the server (on page 25).
2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. Remove the fan blanks. To replace the component, reverse the removal procedure.
3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. If installed, remove the FBWC capacitor pack ("FBWC capacitor pack" on page 45). 6. Remove the PCI riser cage ("PCI riser cage" on page 50). 7. Remove the cache module. To replace the component, reverse the removal procedure. IMPORTANT: A cache module is required for a 10 SFF drive cage. Drives installed in a 10 SFF configuration do not function without a cache module.
The server may look different than the one shown in the following illustration, depending on the server model. To replace the component, reverse the removal procedure. Recovering data from the flash-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 28). 1.
Front video adapter Depending on the model purchased, the server may look different than shown. The 10 SFF drive configuration does not support the front video adapter. Remove the component as indicated. CAUTION: Be sure to connect the video adapter to the video connector, and not to the USB connector. To replace the component, reverse the removal procedure. The 10 SFF drive configuration does not support the front video adapter.
7. Remove the existing FlexibleLOM. To replace the component: 1. Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew. 2. Install the access panel ("Access panel" on page 30). 3. Slide the server into the rack. 4. Connect the LAN segment cables. 5. Connect each power cord to the server. 6. Connect each power cord to the power source. 7. Power up the server.
Rack bezel Remove the component as indicated. To replace the component, reverse the removal procedure. Air baffle To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. Remove the SATA cable if it is clipped to the air baffle. 6. Remove the air baffle.
The server may look different than the one shown in the following illustration, depending on the server model. To replace the component, reverse the removal procedure. PCI riser cage To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage. 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b.
The server may look different than the one shown in the following illustration, depending on the server model. To replace the component, reverse the removal procedure. Expansion boards To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5.
PCIe riser board To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. Remove the PCI riser cage ("PCI riser cage" on page 50). 6. Remove any installed expansion boards ("Expansion boards" on page 51). 7. Remove the PCIe riser board.
6. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. CAUTION: To avoid thermal shutdown, all fans must be installed in a dual processor configuration.
o Caged heatsink o Screw-down heatsink Removal and replacement procedures 54
To replace the component: 1. Remove the thermal interface protective cover from the heatsink. 2. Install the heatsink, ensuring the alignment bracket aligns on the front of the heatsink.
o Screw-down heatsink 3. Install the access panel ("Access panel" on page 30). 4. Slide the server into the rack. 5. Connect each power cord to the server. 6. Connect each power cord to the power source. 7. Power up the server. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. Remove the heatsink ("Heatsink" on page 53). 6. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 7. Remove the processor from the processor retaining bracket.
To replace the component: 1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 2. Close the processor retaining bracket.
3. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 4. Remove the thermal interface protective cover from the heatsink. 5.
o Caged heatsink o Screw-down heatsink 6. Install the access panel ("Access panel" on page 30). 7. Slide the server into the rack. 8. Connect each power cord to the server. 9. Connect each power cord to the power source.
10. Power up the server. System battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System board To remove the component: IMPORTANT: Be sure you are using the correct spare part. The HP ProLiant DL360p Gen8 Server ships with one of two different system boards that each use specific processors and heatsinks. To identify the proper system board spare part number, see the white label on the system board that shipped with the server. 1.
The server may look different than the one shown in the following illustration, depending on the server model. To replace the component: 1. Align the system board on the tray, and tighten the thumbscrew to secure it. The server may look different than the one shown in the following illustration, depending on the server model.
2. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 3. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
4. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 5.
10. Install the access panel ("Access panel" on page 30). 11. Slide the server into the rack. 12. Connect each power cord to the server. 13. Connect each power cord to the power source. 14. Power up the server. IMPORTANT: Install all components with the same configuration that was used on the failed system board. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• LFF FBWC capacitor pack cabling The second (left) capacitor pack cable connects to an optional Smart Array expansion board.
DVD-ROM and DVD-RW drive cabling The server may look different than the one shown in the following illustration, depending on the server model. Chipset SATA cable option With the chipset SATA cable option, the chipset SATA controller can be used with a single SATA hard drive that is installed in one hard drive bay of the SFF or LFF hard drive cage. • • When using the chipset SATA configuration, the following conditions apply: o The 10 SFF drive configuration does not support the chipset SATA option.
To install the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 26). 4. Remove the access panel ("Access panel" on page 30). 5. Disconnect any SAS cables from the hard drive cage and either the embedded SAS controller or an optional SAS controller. Do not disconnect the power cable.
6. Disconnect the SATA cable from the optical drive and the SATA connector on the system board. The optical bay is disabled with the chipset SATA cable option. 7. Connect the chipset SATA cable: a. Connect the chipset SATA cable connector to the chipset SATA controller port on the system board. The chipset SATA connector on the SATA cable is narrower than the chipset SATA controller port header on the system board. b.
8. Clip the cable to the power supply air baffle when routing it along the edge of the system board. 9. Coil the cables behind the hard drive backplane to minimize airflow impact. 10. Install the access panel ("Access panel" on page 30). 11. Install the server into the rack. 12. Remove any installed hard drives ("Hot-plug drive" on page 31). 13. Install a SATA hard drive in hard drive bay 1. 14. Install hard drive blanks in any empty hard drive bays. 15. Connect each power cord to the server.
Diagnostic tools Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 73) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Component identification Front panel components • 8 SFF Item Description 1 SAS/SATA/SSD drive bay 1 2 SAS/SATA/SSD drive bay 2 3 SAS/SATA/SSD drive bay 3 4 SAS/SATA/SSD drive bay 4 5 SAS/SATA/SSD drive bay 5 6 SAS/SATA/SSD drive bay 6 7 SAS/SATA/SSD drive bay 7 8 Systems Insight Display 9 DVD-ROM drive (optional) 10 SAS/SATA/SSD drive bay 8 11 Front video connector (front video port adapter required) 12 USB connectors (2) 13 Serial number tab Component identification 76
• 4 LFF Item Description 1 SAS/SATA/SSD drive bay 1 2 DVD-ROM drive (optional) 3 SAS/SATA/SSD drive bay 2 4 Serial number tab 5 SAS/SATA/SSD drive bay 3 6 Systems Insight Display 7 SAS/SATA/SSD drive bay 4 8 Front video connector (front video port adapter required) 9 USB connectors (2) • 10 SFF Item Description 1 SAS/SATA/SSD drive bay 1 2 SAS/SATA/SSD drive bay 2 3 SAS/SATA/SSD drive bay 3 4 SAS/SATA/SSD drive bay 4 5 SAS/SATA/SSD drive bay 5 6 SAS/SATA/SSD drive bay 6
Item Description 11 Systems Insight Display 12 USB connector Front panel LEDs and buttons • 8 SFF or 4 LFF Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 2 Power On/Standby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* 3 Health LED Solid gree
• 10 SFF Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 2 Power On/Standby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* 3 Health LED Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-fla
Item Description 1 Slot 2 PCIe 3.0 x16 (full height/half length) 2 FlexibleLOM ports (Shown: 4x1Gb / Optional: 2x10Gb) 3 Video connector 4 Serial connector 5 Slot 1 PCIe 3.0 x8 (low profile) 6 iLO management port 7 USB connectors (4) 8 Power supply bay 2 9 Power supply bay 1 Rear panel LEDs and buttons Item Description Status 1L HP iLO/standard NIC activity LED Solid green = Activity exists. Flashing green = Activity exists. Off = No activity exists.
Item Description Status • • • • 4 AC power unavailable Power supply failed Power supply in standby mode Power supply exceeded current limit Power supply 1 LED Solid green = Normal Off = One or more of the following conditions exists: • • • • AC power unavailable Power supply failed Power supply in standby mode Power supply exceeded current limit System board components Item Description 1 TPM connector 2 PCIe x8 riser connector 3 PCIe x16 riser connector 4 FlexibleLOM 5 SAS cache module c
Item Description 8 SAS connector B (Drives 5–8) 9 SAS connector A (drives 1–4) 10 NMI jumper 11 System maintenance switch 12 Processor 1 13 Fan module 8 connector 14 Processor 1 DIMM slots 15 Fan module 7 connector 16 Fan module 6 connector 17 Fan module 5 connector 18 Processor 1 DIMM slots 19 Fan module 4 connector 20 Processor 2 DIMM slots 21 Fan module 3 connector 22 Fan module 2 connector 23 Fan module 1 connector 24 Processor 2 DIMM slots 25 Processor 2 26 Drive
System maintenance switch Position Default Function S1 Off Off = HP iLO security is enabled. On = HP iLO security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = No function On = ROM reads system configuration as invalid.
Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout. The display provides status for all internal LEDs and enables diagnosis with the access panel installed. To view the LEDs, access the HP Systems Insight Display (on page 26).
Systems Insight Display LED combinations When the health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED indicate system status. Systems Insight Display Health LED LED and color Processor (amber) Red System power LED Status Amber One or more of the following conditions may exist: • • • • Processor in socket X has failed.
Device numbers • 4 LFF configuration • 8 SFF configuration • 10 SFF configuration IMPORTANT: A cache module is required for a 10 SFF drive cage. Drives installed in a 10 SFF configuration do not function without a cache module. For more information, see the server user guide.
Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
When only one processor is installed, be sure the fan blanks are always installed in bays 1 and 2 to ensure proper cooling. • Two-processor configuration Install fans 1 and 2 only when processor 2 is installed. When only one processor is installed, always install the fan blanks.
Storage and expansion diagram Component identification 89
Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) — Operating 10% to 90% 28°C (82.4°F), maximum wet bulb temperature Non-operating 5% to 95% 38.7°C (101.7°F), maximum wet bulb temperature * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
• HP 750W Common Slot Gold Hot Plug Power Supply (92% efficiency) (on page 93) • HP 750W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) (on page 94) • HP 750W Common Slot -48VDC Hot Plug Power Supply (94% efficiency) (on page 94) • HP 1200W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) (on page 95) For detailed power supply specifications, see the quickspecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/14209_div/14209_div.html).
Rated steady-state power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input Maximum peak power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input HP 500W Common Slot 277VAC Hot Plug Power Supply (94% efficiency) Specification Value Input requirements — Rated input voltage 200 V to 277 V AC Rated input frequency 50 Hz–60 Hz Rated input current 3.0 A at 200 V AC 2.
HP 750W Common Slot Titanium Hot Plug Power Supply (96% efficiency) Specification Value Input requirements — Rated input voltage 200 to 240 V AC Rated input frequency 50 Hz to 60 Hz Rated input current 4.1 A at 200 V AC 3.
HP 750W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 8.5 A at 100 VAC 4.
If this connection is made, all of the following must be met: • This equipment must be connected directly to the DC supply system earthing electrode conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply system earthing electrode conductor is connected.
Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the HP Power Advisor website (http://www.hp.com/go/hppoweradvisor).
Acronyms and abbreviations DDR double data rate DMI Desktop Management Interface FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor LOM LAN on Motherboard NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test QPI QuickPath Interconnect Acronyms and abbreviations 97
RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor TPM Trusted Platform Module UID unit identification USB universal serial bus Acronyms and abbreviations 98
Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
Index A E AC power supply 32, 91, 92, 93, 94, 95 access panel 30 air baffle 15, 25, 49 electrostatic discharge 28 environmental specifications 90 expansion boards 51 extending server from rack 26 B F battery 61 buttons 25, 76, 78, 80 C cables 67 cabling 67 cabling, server 67 cache module 44 capacitor pack 45 cautions 29 chipset SATA cable 69 components 15, 76 components, identification components, system board connectors 76 CSR (customer self repair) customer self repair (CSR) 15, 76 83 5, 15 5, 15
IML (Integrated Management Log) 74 Insight Diagnostics 73, 74 Integrated Management Log (IML) 74 internal cables 67 internal USB functionality 75 L LED, power on 78 LED, system power 78 LED, UID 78, 80 LEDs 85, 87 LEDs, front panel 87 LEDs, hard drive 87 LEDs, NIC 78, 80 LEDs, power supply 80 LEDs, SAS hard drive 87 LEDs, unit identification (UID) 80 M management tools 73 mechanical components 15 memory slot LEDs 84 N NIC connectors 79 NMI header 83 O overtemperature LED 84 P part numbers 15, 18 PCI ri
U UID button 80 UID LED 80 USB (universal serial bus) 75 USB connector 76, 79 USB support 75 utilities 73 utilities, deployment 74 V video connector 76, 79 W warnings 29 Index 102
