HP ProLiant DL365 Server Maintenance and Service Guide Part Number 418289-005 March 2008 (Fifth Edition)
© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service............................................................................................................................ 5 Illustrated parts catalog ............................................................................................................... 16 Mechanical components ..........................................
PCI Smart Array controller cabling ..................................................................................................... 59 Battery pack cabling......................................................................................................................... 60 Diagnostic tools .......................................................................................................................... 62 Troubleshooting resources .........................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair). Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1 Access panel 431360-001 Mandatory1 2 Miscellaneous hardware kit 431359-001 Mandatory1 a) Optical device blank* — — b) Air baffle — — c) HP Smart Array E200i battery tray — — d) HP Smart Array P400i battery tray — — e) Hard drive bezel blank — — f) Power supply blank — — 3 Hard drive blank 392613-001 Mandatory1 4 Front bezel — — a) Standard front bezel
Item Description Spare part number Customer self repair (on page 5) Rack mounting hardware 5 Rack mounting hardware kit* 360104-001 Mandatory1 6 Cable management arm* 360105-001 Mandatory1 *Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant.
System components Item Description Spare part number Customer self repair (on page 5) 7 System fan module 412212-001 Mandatory1 8 Hot-plug power supply, 700-W 412211-001 Mandatory1 9 PCIe riser board assembly 412200-001 Mandatory1 10 Processor — — a) 1.8-GHz, 95-W AMD Opteron™ 419473-001 Optional2 b) 2.4-GHz, 95-W AMD Opteron™* 419478-001 Optional2 c) 2.6-GHz, 95-W AMD Opteron™* 419480-001 Optional2 d) 2.8-GHz, 95-W AMD Opteron™* 439749-001 Optional2 e) 1.
Item Description Spare part number Customer self repair (on page 5) k) 3.
Item Description Spare part number Customer self repair (on page 5) Miscellaneous 27 SAS cable* 408763-001 Mandatory1 28 Smart Array battery cable* 409124-001 Mandatory1 29 AC power cord* 142258-001 Mandatory1 30 Battery, 3.3-V, lithium* 234556-001 Mandatory1 *Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. 3 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.
Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 25). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. 1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. 3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on the front and rear panels of the server. 4. Press the Power On/Standby button to place the server in standby mode.
Hot-plug SAS or SATA hard drives CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated. To replace the component, reverse the removal procedure. Front bezel 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 27) and hard drive blanks ("Hard drive blanks" on page 26).
6. Remove the T-10 Torx screws located on the sides of the bezel. 7. Gently push on the two tabs located at the top of the bezel 8. Rotate the bezel away from the server and remove the bezel. To replace the component, reverse the removal procedure. Hard drive bezel blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1.
2. Remove the hard drive bezel blank. To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part. CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies.
3. Remove the power supply. To replace the component, reverse the removal procedure. Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the component: 1. Power down the server if the standard cable management solution is installed ("Power down the server" on page 25).
To remove the component: 1. Power down the server (on page 25). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove the server from the rack" on page 26). 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Remove the fan module. To replace the component, reverse the removal procedure.
o HP Smart Array E200i battery tray o HP Smart Array P400i battery tray To replace the component, reverse the removal procedure. Battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: 1. Power down the server (on page 25). 2.
3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Remove fan module 2 ("Fan module" on page 31). 6. Remove the battery tray ("Battery tray" on page 32). 7. Remove the battery pack. o HP Smart Array E200i battery pack o HP Smart Array P400i battery pack To replace the component, reverse the removal procedure. Multibay blank or device To remove the component: 1. Power down the server (on page 25).
NOTE: Access to the ejector button is intentionally restricted. To eject the optical device, push the ejector button with a small flat object such as a key or pen. 2. Eject the device or blank. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Multibay backplane assembly To remove the component: 1. Power down the server (on page 25). 2.
9. Remove the multibay backplane assembly. 10. Remove the multibay backplane board from the assembly. To replace the component, reverse the removal procedure. SAS backplane To remove the component: 1. Power down the server (on page 25). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove the server from the rack" on page 26). 3. Remove the access panel ("Access panel" on page 30). 4.
10. Disconnect the power and data cables from the SAS backplane. 11. Remove the three T-15 Torx screws from the backplane. 12. Remove the backplane. To replace the component, reverse the removal procedure. Systems Insight Display The Systems Insight Display is an assembly that includes the front panel LEDs, Power On/Standby button, and a cable. To remove the component: 1. Power down the server (on page 25). 2.
4. Remove the front bezel ("Front bezel" on page 27). 5. Remove the air baffle ("Air baffle" on page 31). 6. Remove fan module 3 ("Fan module" on page 31). 7. Remove the multibay backplane assembly ("Multibay backplane assembly" on page 35). 8. Disconnect the Systems Insight Display cable. 9. Remove the T-15 Torx screw that secures the Systems Insight Display. 10. Remove the Systems Insight Display. To replace the component, reverse the removal procedure.
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 25). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 25, "Remove the server from the rack" on page 26). 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Remove the PCI riser board assembly: a.
6. Remove any expansion board installed in the assembly. To replace the component, reverse the removal procedure. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. PCI Express riser board To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 25). 3.
8. Remove the full-length PCI Express riser board from the riser board assembly. To replace the component, reverse the removal procedure. Integrated HP Smart Array E200i Controller or HP Smart Array P400i Controller To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Disconnect all cables from the integrated array controller.
6. Disconnect the backplane power cable from the system board. 7. Turn the quarter-turn fasteners and lift the integrated array controller away from the system board. To replace the component, reverse the removal procedure. DIMMs To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Open the DIMM slot latches.
6. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 25). 2. Extend the server from the rack (on page 25). 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle" on page 31). 5. Open the heatsink retaining latches. 6. Remove the heatsink.
1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply new grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. 3. Install the heatsink. 4. Install the air baffle ("Air baffle" on page 31). 5.
The server uses embedded PPMs as DC-to-DC converters to provide the proper power to each processor. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server. CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes.
6. Remove the heatsink. 7. Open the processor retaining latch and the processor socket retaining bracket.
8. Using your fingers, remove the failed processor. IMPORTANT: Be sure the replacement processor remains inside the processor installation tool. 9. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 10. Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket.
11. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
12. Close the processor retaining latch and the processor socket retaining bracket. 13. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 14. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution.
15. Install the heatsink. 16. Install the air baffle ("Air baffle" on page 31). 17. Install the access panel ("Access panel" on page 30). 18. Slide the server into the rack. 19. Power up the server. System battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
CAUTION: To help avoid damage to the processor and system board, do not install the processor without using the processor installation tool. CAUTION: Removal of the processor or heatsink renders the thermal layer between the processor and heatsink useless. A new heatsink must be ordered and installed before reinstalling the processor. IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.
12. For each installed processor, open the processor retaining latch and the processor socket retaining bracket on the failed system board. 13. For each installed processor, use your fingers to remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
14. Remove the failed system board. To replace the system board: 1. Install the spare system board in the server before installing the processor. 2. Prepare the processor socket on the spare system board. a. Remove the processor socket protective cover.
b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cover onto the processor socket of the failed system board. 4. Install the processor on the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease from the processor and heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. 8.
10. Install all power supplies ("Hot-plug power supply" on page 29). 11. Install the access panel ("Access panel" on page 30). 12. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Serial Number.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
HP Smart Array P400i Controller cabling CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation. Be sure to route the cables around the DIMM connectors so as not to interfere with DIMM installation. PCI Smart Array controller cabling CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation.
Battery pack cabling • HP Smart Array E200i Controller battery pack cabling Cabling 60
• HP Smart Array P400i Controller battery pack cabling Cabling 61
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 64) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that may not be supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer.
Open Services Event Manager OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, analysis, and notification. The tool gathers event data from SNMP traps or information provided over an HTTP interface and notifies an administrator or HP through SMTP and ISEE. For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/).
Component identification Front panel components Item Description 1 Hard drive bay 5 (optional)* 2 Hard drive bay 6 (optional)* 3 Multibay drive bay 4 HP Systems Insight Display 5 USB connector 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 Hard drive bay 1 11 Serial pull tab *An optional controller is required when the server is configured with six hard drives.
Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Green = System is on. Amber = System is shut down, but power is still applied. Off = Power cord is not attached, power supply failure has occurred, no power supplies are installed, facility power is not available, or disconnected power button cable. 2 UID button/LED Blue = Identification is activated. Flashing blue = System is being remotely managed. Off = Identification is deactivated.
Item Description Status 6 NIC 2 link/activity LED Green = Network link exists. Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on the RJ-45 connector for status by referring to the rear panel LEDs ("Rear panel LEDs and buttons" on page 69).
Rear panel LEDs and buttons Item Description Status 1 iLO 2 NIC activity LED Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 2 3 iLO 2 NIC link LED Green = Link exists. 10/100/1000 Green = Activity exists. NIC 1 activity LED Flashing green = Activity exists. Off = No link exists. Off = No activity exists. 4 5 10/100/1000 Green = Link exists. NIC 1 link LED Off = No link exists. 10/100/1000 Green = Activity exists.
System board components Item Description 1 System battery 2 NMI jumper 3 System maintenance switch (SW1) 4 Internal USB connector 5 Multibay connector 6 Power switch connector 7 DIMM slots (1-4) 8 Fan module 3 connectors 9 Fan module 2 connectors 10 DIMM slots (5-8) 11 Fan module 1 connectors 12 SFF hard drive backplane power connector 13 Integrated Smart Array controller connector 14 Power supply connector 1 15 Power supply connector 2 16 Processor socket 2 17 Processor
System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = Normal On = ROM treats system configuration as invalid.
To view the LEDs, access the HP Systems Insight Display. LED Status Off Normal Amber Failure For additional information about these LEDs, see "HP Systems Insight Display LEDs and internal health LED combinations (on page 72)." NOTE: The HP Systems Insight Display LEDs represent the system board layout. HP Systems Insight Display LEDs and internal health LED combinations When the internal health LED on the front panel illuminates either amber or red, the server is experiencing a health event.
HP Systems Insight Display LED and color Internal health LED color Status PPM failure (amber) Red Integrated PPM has failed. DIMM failure, slot X (amber) Red One or more of the following conditions may exist: Amber • DIMM in slot X has failed. • DIMM in slot X is an unsupported type, and no valid memory exists in another bank. One or more of the following conditions may exist: • DIMM in slot X has reached single-bit correctable error threshold.
• Six hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Component identification 74
SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application. On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application.
Fan locations Item Description 1 Fan module 1 2 Fan module 2 3 Fan module 3 Component identification 76
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/). DDR2 SDRAM DIMM specifications CAUTION: Be sure to install DIMMs in the proper configuration. Refer to the Documentation CD.
Specification Value Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA; Photo CD (single/multiple-session), CD-XA ready; CDi ready Capacity 550 MB (mode 1, 12 cm) 640 MB (mode 2, 12 cm) Block size 2368, 2352 bytes (mode 0) 2352, 2340, 2336, 2048 bytes (mode
Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specifications Specification Value Disk formats DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session) Capacity 4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.
Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.
Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate IML Integrated Management Log NIC network interface controller NVRAM non-volatile memory OSEM Open Services Event Manager PCI Express Peripheral Component Interconnect Express PCI-X peripheral component interconnect extended PPM processor power module PSP ProLiant Support Pack Acronyms and abbreviations 82
RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SFF small form-factor SIM Systems Insight Manager UID unit identification USB universal serial bus Acronyms and abbreviations 83
Index A E access panel 30 additional information 62 ADU (Array Diagnostic Utility) 62 air baffle 25, 31 array controller, cabling 58, 59 array controller, removing 41 Array Diagnostic Utility (ADU) 62 ASR (Automatic Server Recovery) 64 Automatic Server Recovery (ASR) 64 electrostatic discharge 23 environmental requirements 77 environmental specifications 77 expansion boards 39 extending server from rack 25 external health LED 67 B backplane, SAS 35 battery tray 32 battery-backed write cache battery pack
LEDs LEDs, LEDs, LEDs, LEDs, 66, 75 hard drive 74, 75 NIC 67, 69 power button/LED board 67 unit identification (UID) 67 M management tools 62 mechanical components 16 multibay backplane assembly 35 multibay blank, removing 34 multibay/SAS backplane, removing 35 N NIC LEDs 67 P PCI array controllers, cabling 58 PCI Express riser boards 40 PCI riser board assembly 38 power LEDs, system 67 Power On/Standby button 25, 67 power requirements 78 power supplies 29, 78 power supply blank 30 powering down 25 PPM
