HP ProLiant DL385 Generation 2 Server Maintenance and Service Guide Part Number 411572-006 March 2008 (Sixth Edition)
© Copyright 2004, 2007, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows NT are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog ............................................................................................................... 17 Mechanical components.............................................
Expansion slot covers............................................................................................................................... 63 Expansion slot covers (1 and 2)....................................................................................................... 63 Expansion slot covers (3, 4, and 5).................................................................................................. 64 Expansion slot cover retainer (slots 1 and 2) .......................................
PCI riser cage LED ................................................................................................................................... 99 Battery pack LEDs.................................................................................................................................. 100 Hot-plug fans (6-fan configuration)........................................................................................................... 102 Hot-plug fans (12-fan configuration).......................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair). Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Customer self repair 16
Illustrated parts catalog Mechanical components Item Description Assembly part number Spare part number Customer self repair (on page 6) 1 Access panel 394037-001 407744-001 Mandatory1 2 Front bezel 394028-003 407745-001 Mandatory1 Illustrated parts catalog 17
Item Description Assembly part number Spare part number Customer self repair (on page 6) 3 Hard drive blank 376383-001 392613-001 Mandatory1 4 Media drive blank 377569-001 409006-001 Mandatory1 5 Power supply cage assembly 394020-001 408785-001 Mandatory1 6 Power supply blank 394436-001 409417-001 Mandatory1 7 Air baffle — — — a) Air baffle, 12-fan model 404847-001 430441-001 Mandatory1 b) Air baffle, 6-fan model* 440933-001 442957-001 Mandatory1 Processor fan bracket
*Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". 3 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
System components Item Description Assembly part number Spare part number Customer self repair (on page 6) System components 16 Hot-plug fan, 60-mm 394035-001 407747-001 Mandatory1 17 Hot-plug power supply, 1000-W 380622-001 403781-001 Mandatory1 18 PCI riser cage — — — a) PCI riser cage, with non-hot-plug PCIe (standard) 412878-001 408786-001 Optional2 Illustrated parts catalog 21
Item 19 20 Description Assembly part number Spare part number Customer self repair (on page 6) b) PCI riser cage, with non-hot-plug PCI-X/PCIe (optional)* 412878-002 408788-001 Optional2 c) PCI riser cage, with non-hot-plug PCIe (optional)* 412878-003 430442-001 Optional2 Processor — — — a) 1.8-GHz, dual-core AMD Opteron™ Model 2210 HE, 68-W ** 410714-004 434949-001 Optional2 b) 1.8-GHz, dual-core AMD Opteron™ Model 2210, 95-W* ** 410713-005 419473-001 Optional2 c) 2.
Item Description Assembly part number Spare part number Customer self repair (on page 6) 30 CD-RW/DVD-ROM drive, slimline, 24X (optional)* 383696-002 399959-001 Mandatory1 31 DVD+R/RW drive, slimline, 8X* 395911-001 399402-001 Mandatory1 DIMMs — — — a) 512-MB, registered PC2-5300, single-rank DIMM* 405474-051 430449-001 Mandatory1 b) 1-GB, registered PC2-5300, single-rank DIMM* 405475-051 430450-001 Mandatory1 c) 2-GB, registered PC2-5300, dual-rank DIMM* 405476-051 432668-001
Item Description Assembly part number Spare part number Customer self repair (on page 6) 45 Smart Array E200 Controller cache module, 128-MB* 409248-001 413486-001 Optional2 46 Smart Array P400 Controller* 012760-001 405831-001 Optional2 47 Smart Array P400 Controller cache module, 256-MB* 012764-004 405836-001 Optional2 48 Smart Array P400 Controller cache module, 512-MB* 012764-003 405835-001 Optional2 49 Smart Array P400 Controller battery pack module* 381573-001 398648-001 O
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. 3 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria.
Illustrated parts catalog 26
Removal and replacement procedures Required tools You need the following items for some procedures: • T-15 Torx screwdriver (provided inside the server) • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 86) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
3. After performing the installation or maintenance procedure, slide the server back into the rack: a. Press the server rail-release latches and slide the server fully into rack. WARNING: To reduce the risk of personal injury, be careful when pressing the server railrelease latches and sliding the server into the rack. The sliding rails could pinch your fingers. b. Slide the server fully into the rack.
1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. NOTE: If the operating system automatically places the server in Standby mode, omit the next step. 3. Press the Power On/Standby button to place the server in Standby mode. When the server activates Standby power mode, the system power LED changes to amber. IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear panels.
NOTE: To access some components, you may need to remove the cable management arm. To access the product rear panel components, open the cable management arm: 1. Power down the server (on page 29). 2. Swing open the cable management arm. 3. Remove the cables from the cable trough. 4. Remove the cable management arm. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the component as indicated. To replace the blank, slide the blank into the bay until it locks into place. Hot-plug SAS hard drive To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1.
To replace the component, reverse the removal procedure. Power supply blank To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Access the product rear panel (on page 30). 2. Remove the power supply blank. WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.
3. Remove the hot-plug power supply. WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the power cord to the power supply until the power supply is installed. To replace the component: 1. Slide the hot-plug power supply into the power supply bay. 2. Connect the power cord to the power supply. 3. Install the cable management arm, if removed ("Access the product rear panel" on page 30). 4.
4. Loosen the two thumbscrews on either side of the power cord. 5. Disconnect the power cord from the power supply. 6. Remove the power supply. WARNING: To reduce the risk of electric shock, fire, and damage to the equipment, this product must be installed in accordance with the following guidelines: • This power supply is intended only for installation in HP servers located in a restricted access location. • This power supply is not intended for direct connection to the DC supply branch circuit.
WARNING: To reduce the risk of injury from electric shock hazards, do not open power supplies. Refer all maintenance, upgrades, and servicing to qualified personnel. CAUTION: Do not run the server with one AC power supply and one DC power supply installed. CAUTION: Electrostatic discharge (ESD) can damage electronic components. Be sure that you are properly grounded (earthed) before beginning any installation procedure.
2. Remove the component as indicated: To replace the component, slide the component into the bay until it is fully seated. Hot-plug fan The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server. The server shuts down in the following temperature-related scenarios: • At POST: o The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level.
To remove the component: 1. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 2. Remove the access panel ("Access panel" on page 31). 3. Remove the fan. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To replace the component, reverse the removal procedure.
6. Remove the power supply cage assembly. To replace the component, reverse the removal procedure.
5. Remove the cache module. To replace the component, reverse the removal procedure. CAUTION: To prevent damage to the cache module during installation, be sure the cache module is fully inserted before pressing down. Removing the battery pack To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31).
To replace the component, reverse the removal procedure. Recovering data from the battery-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the BBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 27). 1. 2. Perform one of the following: o Set up a recovery server station using an identical server model.
CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. 4. Remove the battery pack from the air baffle ("Removing the battery pack" on page 40). 5. Remove all hard drive cables from the air baffle. 6. Remove the air baffle. To replace the component, reverse the removal procedure. Processor fan bracket These procedures apply to both the 6- and 12-fan configurations.
5. Remove the processor fan bracket ("Processor fan bracket" on page 42). 6. Remove all hot-plug fans from the processor fan bracket ("Hot-plug fan" on page 37). To replace the component, reverse the removal steps and press down on the top of each fan to be sure it is seated properly. Front bezel To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3.
6. Remove the five T-15 Torx screws and detach the front bezel. To replace the component, reverse the removal procedure. Systems Insight Display To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). IMPORTANT: For this procedure, you do not need to remove the hot-plug fans from the processor fan bracket.
7. Remove the Systems Insight Display. To replace the component, reverse the removal procedure. Fan board To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). IMPORTANT: For this procedure, you do not need to remove the hot-plug fans from the processor fan bracket.
7. Remove the fan board. To replace the component, reverse the removal procedure. Processor fan bracket plate To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41).
7. Remove the processor fan bracket plate. To replace the component, reverse the removal procedure. Media drive ejector assembly To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41).
8. Remove the ejector assembly. To replace the component, reverse the removal procedure. PPM To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). NOTE: The appearance of compatible PPMs may vary.
5. Remove the PPM. IMPORTANT: PPM slots must be populated when processors are installed. If PPM slots are not populated, the server halts during POST or does not boot. To replace the component, reverse the removal procedure. PPM retainer To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). 5. Remove the PPMs ("PPM" on page 48).
6. Remove the PPM retainer. To replace the component, reverse the removal procedure. Heatsink To remove the heatsink: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). 5. Open the heatsink retaining bracket.
6. Remove the heatsink. To replace the heatsink: 1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2.
3. Install the heatsink. 4. Close and lock the heatsink retaining latches. 5. Install the air baffle. 6. Install the access panel ("Access panel" on page 31). 7. Install the server into the rack. 8. Power up the server. Processor CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server.
IMPORTANT: Processor socket 1 and PPM slot 1 must be populated at all times or the server does not function properly. IMPORTANT: Always install a PPM when you install a processor. The system fails to boot if the corresponding PPM is missing. To remove a processor: 1. Power down the server (on page 29). 2. Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the air baffle ("Air baffle" on page 41). 5. Open the heatsink retaining bracket.
7. Open the processor retaining latch and the processor socket retaining bracket. 8. Using your fingers, remove the failed processor. To replace a processor: CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. IMPORTANT: Be sure the processor remains inside the processor installation tool.
1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket.
3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracket and the processor retaining latch. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: 7. Install the heatsink.
8. Close and lock the heatsink retaining latches. 9. Install the air baffle. 10. Install the access panel ("Access panel" on page 31). 11. Install the server into the rack. 12. Power up the server. DIMMs To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4.
5. Remove the DIMM. To replace the component, reverse the removal procedure. Memory options You can expand server memory by installing PC2-5300 Registered DDR2 SDRAM DIMMs. The server supports up to 32 GB of memory using eight 4-GB DIMMs (four DIMMs per processor). NOTE: The Advanced Memory Protection option in RBSU provides additional memory protection beyond Advanced ECC. By default, the server is set to Advanced ECC Support. For more information, refer to "HP ROM-Based Setup Utility (on page 85).
• Install DIMMs with the same speed. • Install memory in pairs (banks) beginning with banks farthest away from each populated processor (banks A and C). • The server supports multiple memory modes, based on DIMM population. Use RBSU ("HP ROMBased Setup Utility" on page 85) to select a mode (System will default to Advanced ECC). • Observe the following special conditions when installing memory with a second processor: o Processor 2 can be installed without memory.
6. Remove the power supply backplane. To replace the component, reverse the removal procedure. Hard drive backplane To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4. Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 32). 5. Remove the hard drive backplane.
Hard drive backplane retainer To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4. Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 32). 5. Remove the hard drive backplane ("Hard drive backplane" on page 61). 6. Remove the hard drive backplane retainer.
7. Remove the PCI riser cage. To replace the component, reverse the removal procedure. Expansion slot covers Expansion slot covers (1 and 2) CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3.
To replace the component, reverse the removal procedure. Expansion slot covers (3, 4, and 5) To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31).
5. Remove the expansion slot cover retainer. To replace the component, reverse the removal procedure. Expansion boards Expansion board (slots 1 and 2) To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 3. Remove the access panel ("Access panel" on page 31). 4. Disconnect any internal or external cables connected to the expansion board.
5. Remove the expansion board. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To replace the component, reverse the removal procedure. Removing expansion board (slots 3, 4, and 5) To remove the component: 1. Power down the server (on page 29). 2.
6. Remove the expansion board. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To replace the component, reverse the removal procedure. Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock.
5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System board To remove the component: 1. Power down the server (on page 29). 2.
11. Remove the processor fan bracket ("Processor fan bracket" on page 42). 12. Remove the hot-plug fans from the I/O fan bracket ("Hot-plug fan" on page 37). 13. Remove all DIMMs ("DIMMs" on page 58). 14. Open the heatsink retaining bracket. 15. Remove the heatsink.
16. Open the processor retaining latch and the processor socket retaining bracket. 17. Using your fingers, remove the failed processor. CAUTION: To avoid damage to the system board: • Do not touch the socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when removing the processor from the socket. CAUTION: To avoid damage to the processor: • Handle the processor only by the edges.
20. Identify the eight alignment keys and keyhole locations. 21. Loosen the system board thumbscrew. 22. Remove the failed system board. 23. Remove the I/O fan bracket ("I/O fan bracket" on page 75). To migrate the processor to the spare system board: 1. Install the spare system board. CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board. 2.
a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cover onto the processor socket of the failed system board. 4. Install the processor on the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
7. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: 8. Install the heatsink ("Heatsink" on page 50). 9. Install all components removed from the failed system board. 10. Install the access panel ("Access panel" on page 31). 11. Install the power supplies. 12. Power up the server. IMPORTANT: Install all components with the same configuration that was used on the failed system board.
I/O fan bracket These procedures apply to both the 6- and 12-fan configurations. If necessary, configuration-specific illustrations are provided. To remove the component: 1. Power down the server (on page 29). 2. Remove all power supplies ("Hot-plug power supply" on page 33). 3. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 30). 4. Remove the access panel ("Access panel" on page 31). 5.
For ease of removal, invert the system board. To replace the component: 1.
o 12-fan configuration 2. Secure the I/O fan bracket to the system board. 3. Install the system board. 4. Install the PPMs. 5. Install the processors. 6. Install the DIMMs. 7. Install all hot-plug fans in the I/O fan bracket. 8. Install the processor fan bracket. 9. Install the air baffle. 10. Install the battery pack. 11. Install the expansion boards in slot 1 and 2. 12. Install the PCI riser cage. 13. Install the power supply backplane.
14. Install the power supply cage assembly. 15. Install the access panel ("Access panel" on page 31). 16. Install the server into the rack. 17. Install the power supplies. 18. Power up the server.
Cabling SAS hard drive cabling PCI SAS cabling to an HP Smart Array P400i Controller PCI SAS cabling to an optional expansion board controller Cabling 79
Fan board cabling Battery cabling for BBWC Cabling 80
Systems Insight Display cabling Hard drive backplane power cabling Cabling 81
Media drive bay cabling PCIe x16 riser board power cabling Cabling 82
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
If you do not use the utility, ORCA will default to the standard configuration. For more information regarding array controller configuration, refer to the controller user guide. For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD. HP ProLiant Essentials Rapid Deployment Pack The RDP software is the preferred method for rapid, high-volume server deployments.
• Installing software drivers directly from the CD. With systems that have internet connection, the SmartStart Autorun Menu provides access to a complete list of ProLiant system software. • Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase Utility SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website (http://h18013.www1.hp.
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).
Component identification Front panel components Item Description 1 Media drive bay (IDE/diskette multibay) 2 Video connector 3 USB connectors (2) 4 Systems Insight Display 5 Hard drive bays 6 Quick release levers (2) Component identification 88
Front panel LEDs and buttons Item Description Status 1 UID LED button Blue = Activated Flashing = System being remotely managed Off = Deactivated 2 Internal health LED Green = Normal Amber = System degraded. To identify component in degraded state, refer to Systems Insight Display LEDs. Red = System critical. To identify component in critical state, refer to Systems Insight Display LEDs. 3 External health LED (power supply) Green = Normal Amber = Power redundancy failure.
Rear panel components Item Description Color 1 Expansion slot 1 — 2 Expansion slot 2 — 3 Expansion slot 3 — 4 Expansion slot 4 — 5 Expansion slot 5 — 6 T-10/T-15 Torx screwdriver — 7 External option blank — 8 NIC 2 connector — 9 NIC 1 connector — 10 Power supply bay 2 — 11 Power cord connector Black 12 Power supply bay 1 (populated) — 13 iLO 2 connector — 14 Video connector Blue 15 USB connectors (2) Black 16 Serial connector — 17 Mouse connector Green
All slots are non-hot-plug. PCI riser board expansion slot definitions Slot PCIe riser board Mixed PCIe/PCI-X riser board PCIe x16 riser board 5 x8 64-bit/133-MHz — 4 x8 64-bit/133-MHz x16 3 x4 x8 x4 All slots are non-hot-plug.
System board System board components (6-fan configuration) Item Description 1 Fan board connector 2 DIMM slots (1-4) 3 Power supply backplane connector 4 PCIe slot 1 5 PCIe slot 2 6 System battery 7 System maintenance switch 8 Diagnostic LEDs 9 NMI jumper 10 Internal USB connector* 11 PPM 2 (for second processor) 12 PCI riser cage connector 13 Fan 2 connector 14 Fan 1 connector 15 DIMM slots (5-8) 16 Multibay interface connector 17 Processor socket 2 18 Processor socket
System board components (12-fan configuration) Item Description 1 Fan board connector 2 DIMM slots (1-4) 3 Power supply backplane connector 4 PCIe slot 1 5 PCIe slot 2 6 System battery 7 System maintenance switch 8 Diagnostic LEDs 9 NMI jumper 10 Internal USB connector* 11 PPM 2 (for second processor) 12 PCI riser cage connector 13 Fan 4 connector 14 Fan 2 connector 15 Fan 3 connector 16 Fan 1 connector 17 DIMM slots (5-8) 18 Multibay interface connector 19 Processor
DIMM slots Item Description 1 DIMM slot 1A 2 DIMM slot 2A 3 DIMM slot 3B 4 DIMM slot 4B 5 DIMM slot 5C 6 DIMM slot 6C 7 DIMM slot 7D 8 DIMM slot 8D System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified.
Position Default Function S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = Normal On = ROM treats system configuration as invalid. S7 Off Reserved S8 Off Reserved When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM. CAUTION: Clearing CMOS and/or NVRAM deletes configuration information.
Systems Insight Display LEDs Status Amber= Failure Off = Normal IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required. Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing each DIMM in a bank with a known working DIMM. NOTE: The HP Systems Insight Display LEDs represent the system board layout.
Systems Insight Display LED and color Internal Health LED color Status Processor failure, socket X (amber) Red One or more of the following conditions may exist: PPM failure (amber) • Processor in socket X has failed. • Processor X is not installed in the socket. • Processor X is unsupported. • ROM detects a failed processor during POST. Amber Processor in socket X is in a pre-failure condition. Red One or more of the following conditions may exist: • PPM for processor 2 has failed.
Systems Insight Display LED and color Internal Health LED color Status Power supply X (amber) Red Power supply X has failed. PCI riser cage interlock (amber) — PCI riser cage is unseated.
SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternating amber and The drive has failed, or a predictive failure alert has been blue received for this drive; it also has been selected by a management application. On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application. On Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive.
Status On = AC power connected Off = AC power disconnected Battery pack LEDs Item ID Color Description 1 Green System Power LED. This LED glows steadily when the system is powered up and 12 V system power is available. This power supply is used to maintain the battery charge and provide supplementary power to the cache microcontroller.
Item ID Color Description 2 Green Auxiliary Power LED. This LED glows steadily when 3.3V auxiliary voltage is detected. The auxiliary voltage is used to preserve BBWC data and is available any time that the system power cords are connected to a power supply. 3 Amber Battery Health LED. To interpret the illumination patterns of this LED, see the following table. 4 Green BBWC Status LED. To interpret the illumination patterns of this LED, see the following table.
Hot-plug fans (6-fan configuration) For server models that support six fans, the fan configuration operates in redundant mode when all six fans are installed. Hot-plug fans (12-fan configuration) For server models that support 12 fans, the fan configuration operates in redundant mode when all 12 fans are installed.
Fan board components Item Description 1 Fan connectors (8)* 2 Systems Insight Display connector 3 Power On/Standby button/system power LED 4 UID LED button 5 USB connectors (2) 6 Video connector 7 Fan board system connector *Only the 12-fan configuration supports all connectors.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -30°C to 50°C (-22°F to 122°F) Storage -30°C to 60°C (-22°F to 140°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
BTUs per hour 3344 at 100V to 120V AC input 3277 at 200V to 240V AC input Power supply output Rated steady-state power 800 W at 100V AC input 850 W at 120V AC input 1000 W at 200V to 240V AC input Maximum peak power 800 W at 100V AC input 850 W at 120V AC input 1000 W at 200V to 240V AC input Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.
Specification Value Low density 720 KB Drives supported 1 Drive height One-third height Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (mod
Specification Value Diameter 12 cm, 8 cm (4.70 in, 3.15 in) Thickness 1.2 mm (0.05 in) Track pitch 1.6 µm (6.3 × 10-7 in) Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.
Specification Value Diameter 12 cm, 8 cm (4.70 in, 3.15 in) Thickness 1.2 mm (0.05 in) Track pitch 0.74 µm (3.15 × 10-7 in) DVD-ROM 1.6 µm (6.3 × 10-7 in) CD-ROM Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.
Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System CMOS complementary metal-oxide semiconductor DDR double data rate DIMM dual inline memory module IDE integrated device electronics iLO 2 Integrated Lights-Out 2 IML Integrated Management Log LED light-emitting diode NMI non-maskable interrupt Acronyms and abbreviations 109
NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI peripheral component interface PCI Express Peripheral Component Interconnect Express PCI-X peripheral component interconnect extended PCIe peripheral component interconnect express POST Power-On Self Test PPM processor power module RBSU ROM-Based Setup Utility RDP Rapid Deployment Pack SAS serial attached SCSI SATA serial ATA SDRAM synchronous dynamic RAM SNMP Simple Network Management Protocol Acronyms and abbreviations 11
UID unit identification USB universal serial bus Acronyms and abbreviations 111
Index A D access panel 31 air baffle 28, 41 Altiris Deployment Solution 85 Altiris eXpress Deployment Server 85 ASR (Automatic Server Recovery) 83 Automatic Server Recovery (ASR) 83 Autorun menu 85 deployment software 85 diagnostic tools 83, 85, 86 diagnostics utility 86 DIMMs 58, 59, 60, 94, 105 diskette drive 36, 105 diskette image creation 85 drive LEDs 98, 99 DVD-ROM drive 47, 107 B battery 67, 95 battery pack LEDs 100 battery-backed write cache (BBWC) 39, 100 battery-backed write cache battery pack
HP ProLiant Essentials Foundation Pack 83 HP ProLiant Essentials Rapid Deployment Pack 85 HP Systems Insight Manager, overview 83 I I/O fan bracket 75 iLO (Integrated Lights-Out) 84 iLO connector 90 IML (Integrated Management Log) 84 Insight Diagnostics 86 Integrated Lights-Out (iLO) 84 Integrated Management Log (IML) 84 internal health LED 89, 96 K keyboard connector 90 L LED, external health 89 LED, internal health 89 LED, PCI riser cage 99 LED, system power 89 LEDs 88 LEDs, battery pack 100 LEDs, fron
specifications, DIMM 105 specifications, diskette drive 105 specifications, DVD-ROM drive 107 specifications, environmental 104 specifications, hard drive 108 specifications, server 104, 105 static electricity 27 status lights, battery pack 100 switches 94, 95 system board 92, 93 system board components 92, 93 system components 21 system maintenance switch 94, 95 system power LED 89, 100 Systems Insight Display 88 Systems Insight Display cabling 81 Systems Insight Manager 83 T telco racks 28, 30 tools 83 T
