HP ProLiant AMD-based 300-series G7 servers

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HP ProLiant AMD-based 300–series G7

servers

Technology brief

Abstract.............................................................................................................................................. 2

Introduction......................................................................................................................................... 2

HP servers and balanced architecture .................................................................................................... 2

Processor technology............................................................................................................................ 3

Direct Connect architecture 2.0 ......................................................................................................... 4

HyperTransport technology ............................................................................................................... 4

HT Assist......................................................................................................................................... 5

Memory technologies ........................................................................................................................... 5

DDR3 DIMM choices ........................................................................................................................ 5

Memory management technologies .................................................................................................... 6

X8 error correction ........................................................................................................................... 7

I/O technologies ................................................................................................................................. 7

PCI Express technology..................................................................................................................... 8

HP Smart Array and SAS/SATA technology ........................................................................................ 8

Power and thermal technologies .......................................................................................................... 11

Efficient power delivery................................................................................................................... 11

Improved thermal sensors and fan control ......................................................................................... 12

HP Dynamic Power Capping ........................................................................................................... 13

Managing processor technologies.................................................................................................... 14

Systems management and monitoring .................................................................................................. 16

HP Integrated Lights-Out 3............................................................................................................... 16

HP Insight Control Environment ........................................................................................................ 16

HP Insight Dynamics ....................................................................................................................... 16

Security ............................................................................................................................................ 17

OS support ....................................................................................................................................... 17

Summary .......................................................................................................................................... 17

For more information.......................................................................................................................... 18

Call to action .................................................................................................................................... 19

Summary of content (19 pages)

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HP ProLiant AMD-based 300–series G7 servers Technology brief Abstract.............................................................................................................................................. 2 Introduction......................................................................................................................................... 2 HP servers and balanced architecture ....................................................................................................
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Abstract This technology brief describes the key technologies implemented in HP ProLiant 300-series G7 servers based on AMD™ processors. As of this writing, the AMD-based 300--series G7 server platforms are limited to the ProLiant DL385. For detailed information about this server, refer to the QuickSpec link listed at the end of this technology brief.
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Processor technology The HP AMD-based 300-series G7 servers use the AMD Opteron 6100 series eight- and twelve-core processors allowing up to 24 cores in a two-processor platform. These processors are based on AMD's 45 nanometer process and have a core standard wattage of 75W Average CPU Power. In addition, these processors use Direct Connect™ architecture 2.0, HyperTransport™ 3.0, HT Assist™, and 8x ECC error correction.
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Direct Connect architecture 2.0 Unlike front-side bus architecture, Direct Connect integrates the memory controller into the processor and directly connects CPUs to the I/O subsystem and other processors (Figure 2). Direct Connect architecture uses direct HyperTransport links between CPUs, between CPU and I/O, and between CPU and memory.
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speed and transfer rate increased from 800 MHz (1.6 MT/s 3 ) to a maximum of 3.2 GHz (6.4 GT/s) in each direction. The G34 socket infrastructure features four, 16-bit HT3 links operating at up to 6.4 GT/s per link. Of the four HT3 links, three are shared processor to processor links and one link on processor one is used for I/O communication. HT Assist HT Assist reduces cache coherence traffic on the HT links.
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There are three types of standard voltage DDR3 available for ProLiant 300 series G7 servers: • PC3-8500R- DDR3 (RDIMM, ECC compliant)—1333 or 1066 MT/s data rate depending on memory configuration. • PC3-10600R DDR3 (RDIMM, ECC compliant)—1333 or 1066 MT/s data rate depending on memory configuration. • PC3-10600E DDR3 (UDIMM, ECC compliant)—1333 MT/s data rate Low-voltage DDR3 Customers can take advantage of the HP low voltage (LV) DDR3 memory option. LV memory can operate at 1.
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AMD-based 300-series G7 servers support all three memory interleaving technologies. Even though these technologies are independent of each other, they can operate simultaneously. Memory bank interleaving With memory bank interleaving engaged, data is routed alternately to memory banks through the common memory channel connecting the DIMM banks and the integrated memory controller.
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expansion cards to the system. SAS is a serial communication protocol for direct-attached storage devices such as SAS and SATA hard drives. PCI Express technology All ProLiant G7 servers support the PCIe 2.0 specification. PCIe 2.0 has a per-lane signaling rate of 5 Gb/s―double the per-lane signaling rate of PCIe 1.0. PCIe 2.0 is completely backward compatible with PCIe 1.0. A PCIe 2.0 device can be used in a PCIe 1.0 slot and a PCIe 1.0 device can be used in a PCIe 2.0 slot.
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For more information on the HP SAS Expander Card, go to http://h18004.www1.hp.com/products/servers/proliantstorage/arraycontrollers/sasexpander/index.html. SAS-2 SAS-2 and PCIe 2.0 are among the technologies responsible for a significant increase in performance over past generations of Smart Array controllers. The second-generation SAS (SAS-2) link speed 6 of 6.0 Gb/s is double the SAS-1 transfer rate. Operation at SAS-2 link speeds requires SAS-2 compliant hard drives.
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The FBWC DDR2 mini-DIMM cache module is specifically designed for the present generation of PCIe2.0, SAS-based Smart Array controllers based on the PMC PM8011 SAS SRC 8x6G RAID on a chip (RoC). The primary FBWC components consist of the cache module, Super-caps with integrated charger, and RoC located on the system board. At the time of this writing, the FBWC cache is supported on the Smart Array P410, P410i, P411, P212, P812, and P712m.
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NOTE: At a minimum, a 256 MB cache and battery kit is required to enable the SAAP license key. SAAP is not available on Zero Memory Configurations. Solid state drives HP has introduced the second generation of solid state drives (SSD) for ProLiant servers. These solid state drives are 3Gb/s SATA interface in both 60GB and 120GB capacities.
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Table 2. HP power supply efficiency and Climate Savers rating Power supply Efficiency Rating 460W AC up to 92% efficiency Climate Savers Gold 750W AC up to 92% efficiency Climate Savers Gold 1200W AC up to 94% efficiency Climate Savers Platinum 1200W 48VDC up to 90% efficiency Climate Savers Silver Use the HP Power Advisor to help determine which power supplies will best meet your needs: www.hp.com/go/hppoweradvisor.
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include enough sensors to construct an accurate view of the thermal landscape within the server, allowing the sensors and the fan control algorithm to determine if fan speeds need to be increased. HP Dynamic Power Capping Because Dynamic Power Capping lets you keep server power consumption below a power threshold in real time, you can use it as a tool for planning and managing both electrical provisioning and cooling requirements in the data center.
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Figure 4. Rapid response of Dynamic Power Capping avoids circuit breaker trips Managing processor technologies HP leverages several of the power management technologies built into AMD Opteron 6100 series processor. This suite of technologies includes AMD PowerNow™ Technology, enhanced Advanced Platform Management Link (APML), and AMD Power Cap Manager™.
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Cool Speed ™ Cool Speed technology protects processor integrity by reducing power-states when the processor reaches an established temperature limit. This technology allows a server to continue operating if the processor thermal environment exceeds safe operational limits. It is important for managers to understand that Cool Speed is an automated processor feature. Within a rack environment, some server platforms may initiate this process while other servers do not.
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Systems management and monitoring HP offers management tools to program and control all aspects of the dynamic server environment. The HP iLO 3 management processor provides remote management with other core-embedded management functions to simplify setup, health monitoring, power and thermal control, and remote administration. The HP Insight Control Environment management suite provides a foundation for deploying, managing, optimizing, and controlling the entire server environment from any location.
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• Continuous capacity and power planning • Balanced physical and virtual resources • Cost-effective availability • Consistent infrastructure provisioning For more information about HP Insight Dynamics, go to www.hp.com/go/insightdynamics Security The Trusted Platform Module™ (TPM) and Microsoft® BitLocker® technology are supported in all ProLiant 300-series G7 servers by means of the Trusted Platform Module option kit. The Trusted Platform Module v1.
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For more information For additional information, refer to the resources listed below. Resource description Web address Dynamic Power Capping TCO and Best Practices White Paper www2.hp.com/v2/GetPDF.aspx/4AA2-3107ENW.pdf HP Insight Control Environment www.hp.com/go/ice HP Network Adapters for ProLiant DL and ML Servers http://media.hpvitc.veplatform.com/content/HP_Network_Ada pters_for_ProLiant_DL_Family_data_sheet_1237839147.pdf HP ProLiant DL385 G7 Server QuickSpecs http://h18004.www1.hp.
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Call to action Send comments about this paper to TechCom@HP.com Follow us on Twitter: http://www.twitter.com/HPISSTechComm © Copyright 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.