HP ProLiant DL785 Server Maintenance and Service Guide Generation 5 and Generation 6 Maintenance and Service Guide HP Part Number: AH233-9002A_ed7 Published: January 2010 Edition: 7
© Copyright 2008–2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows NT are U.S.
Table of Contents 1 Customer self repair.......................................................................................................7 Réparation par le client (CSR)................................................................................................................7 Riparazione da parte del cliente.............................................................................................................8 Customer Self Repair............................................................
Re-entering the server serial number and product ID....................................................................48 System battery.......................................................................................................................................48 I/O backplane assembly........................................................................................................................49 Midplane board...............................................................................
8 Technical support.........................................................................................................83 Before you contact HP...........................................................................................................................83 HP contact information.........................................................................................................................83 A Acronyms and abbreviations...............................................................
1 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory Parts for which customer self repair is mandatory.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse.
• Zwingend Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrtund Arbeitskosten für diesen Service berechnet. • Optional Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt.
normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
• Obrigatória Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. • Opcional Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Customer self repair
2 Illustrated Parts Catalog In this section • “Mechanical components” (page 13) • “System components” (page 16) Mechanical components IMPORTANT: The list of part numbers is current and correct as of the publication of the document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/, to ensure you have the latest part numbers associated with this server.
Item 7 Description Assembly part number Spare part number Customer self repair (Chapter 1 (page 7)) Filler, memory air AH233-3417A blocker (DIMM filler)* 491911-001 Mandatory1 Mezzanine filler* AH233-2117E 491102-001 Optional2 Mezzanine filler bezel* AH233-3402A 492133-001 Mandatory1 Blank, power supply 440204-001 449433-001 Mandatory1 Tool, Torx, T-15* 107473-001 199630-001 Mandatory1 * Not shown 1 Mandatory—Parts for which customer self repair is mandatory.
3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria.
System components 16 Illustrated Parts Catalog
IMPORTANT: The list of part numbers is current and correct as of the publication of the document. Part numbers change often. Check the HP Partsurfer website, http://partsurfer.hp.com/, to ensure you have the latest part numbers associated with this server.
Item 12 Assembly part number Spare part number Customer self repair (Chapter 1 (page 7)) AMD Opteron 8356 2.3 GHz 75W replacement kit (G5) 448208-001 448405-001 Optional2 AMD Opteron 8354 2.2 GHz 75W replacement kit (G5) 448208-002 448404-001 Optional2 AMD Opteron 8384 2.7 GHz 75W replacement kit (G5) 509498-001 508593-001 Optional2 AMD Opteron 8380 2.5 GHz 75W replacement kit (G5) 500540-001 500517-001 Optional2 AMD Opteron 8378 2.
Item Spare part number Customer self repair (Chapter 1 (page 7)) 72 GB 10k SAS single port hard drive 375861-B21 404785-001 Mandatory1 72 GB 15k single port SAS hard drive 418373-008 432321-001 Mandatory1 72 GB 10k dual port SAS hard drive 375863-004 376597-001 Mandatory1 72 GB 15k dual port SAS hard drive 418373-004 418398-001 Mandatory1 146 GB 10k single port SAS hard drive 375863-012 432320-001 Mandatory1 146 GB 10k dual port SAS hard drive 375863-010 418399-001 Mandatory1 Descrip
2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation.
1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3 Removal and replacement procedures In this section • “Required tools” (page 23) • “Safety considerations” (page 23) • “Preparation procedures” (page 24) • “Media module (SID assembly)” (page 28) • “Front Bezel” (page 29) • “Mezzanine filler” (page 29) • “Mezzanine filler bezel” (page 29) • “Mezzanine board” (page 29) • “Processor memory cell” (page 29) • “Processor memory cell bezel” (page 30) • “Processor memory cell airflow baffle” (page 30) • “Processors” (page 30) • “DIMMs” (page 36) • “SAS hard drive
To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly.
Power down the server IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. To power down the server: 1. Shut down the OS as directed by the OS documentation. 2. Press the Power On/Standby button to place the server in standby mode. When the server enters standby power mode, the system power LED changes to amber. 3. Disconnect the power cords. The system is now without power.
NOTE: The release latches will lock into place when the rails are fully extended. WARNING! To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers. 3. After performing the installation or maintenance procedure, slide the server into the rack by pressing the server rail-release latches.
5. Place the server on a sturdy, level surface. Removing the access panel WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the access panel: 1.
4. After installing hardware options, replace the access panel. Be sure that the panel is securely locked into place before powering up the server. Media module (SID assembly) To remove the media module: 1. Power down the server (“Power down the server” (page 25)). 2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). 3. Remove the access panel (“Removing the access panel” (page 27)). 4.
NOTE: The release latch does not need to be pressed to reinsert the media module. Front Bezel To remove the front bezel: 1. Power down the server (“Power down the server” (page 25)). 2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). 3. Remove processor memory cell 1 (“Processor memory cell” (page 29)). 4. Remove the serial number tag. 5.
1. 2. 3. Power down the server (“Power down the server” (page 25)). Press the release button. Open the lever. 4. Grasp the lever and slide the processor memory cell from the enclosure. Place a hand under the component to support it as you remove it from the enclosure. CAUTION: Always place the processor memory cell on a flat, level, antistatic surface when working with the component. To replace the processor memory cell reverse the procedure.
CAUTION: The cell filler is required to be place in cells 3 – 6 in a four-processor configuration. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 23)). CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: All supported AMD Opteron quad-core processors 3.
5. 6. 32 Remove the heatsink. Open the processor retaining latch and the processor socket retaining bracket.
7. 8. Using your fingers, remove the failed processor. If the processor has separated from the installation tool, carefully reinsert the processor in the tool. IMPORTANT: tool. 9. Be sure the replacement processor remains inside the processor installation Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket.
11. Close the processor retaining latch and the processor socket retaining bracket.
12. Clean the old thermal grease from the heatsink with an alcohol swab. Allow the alcohol to evaporate before continuing. 13. Apply all the new grease to the top of the processor in one of the following patterns to ensure even distribution. 14. Install the heatsink. 15. Close the heatsink retaining bracket. 16. Replace the processor memory airflow baffle.
17. Install the processor memory cell into the server. 18. Power up the server. DIMMs Each processor memory cell can hold two to eight DIMMs, At least one pair of DIMMs must be installed in slots 1A and 2A on each processor memory cell to operate the server.
SAS hard drive blank To remove a SAS hard drive blank: 1. Squeeze the tabs on the front of the filler to release it from the slot in the drive bay. 2. Pull gently until the filler slides out of the chassis. SAS hard drives CAUTION: Always power down the server if the boot partition resides on the drive you are replacing or if you are replacing the only drive in the server.
To replace the component, reverse the removal procedure. DVD, CD drive or blank To remove a DVD, CD drive or blank: 1. Power down the server (“Power down the server” (page 25)). 2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). 3. Remove the access panel (“Removing the access panel” (page 27)). 4. Remove the media module (“Media module (SID assembly)” (page 28)). 5.
3. Remove the power supply. To replace the component, reverse the removal procedure. Hot-plug fans The server supports redundant hot-plug fans, each with two individual fans rotors, in a 5+1 configuration to provide proper airflow to the server. The airflow strategy contains two thermal zones with three fan units in the bottom zone (accessed from the server rear), and three fan units in the upper zone (accessed internally). See “Fan locations” (page 75).
2. 3. 4. Pull on the fan tray release bar, pull the fan housing unit straight out from the rear of the chassis until it stops, and tilt the tray down to expose the fan housing unit. Insert your thumb and forefinger into the openings on the top of the fan and squeeze until the fan releases from the socket. Pull the fan straight up and out of the chassis. IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan failures, the server shuts down to avoid thermal damage. 5.
5. Pull the fan straight up and out of the chassis. IMPORTANT: Remove and replace only one fan at a time. If the system detects two fan failures, the server shuts down to avoid thermal damage. 6. Install a new hot-plug fan. CAUTION: To prevent server components from overheating, replace a fan within 20 seconds. Failure to observe this caution results in the server automatically shutting down to prevent an overtemperature condition. NOTE: 7.
To replace the component, reverse the removal procedure.
PCIe I/O backplane Item Description 8 PCI Express x4 non-hot-plug expansion slot 4 9 PCI Express x4 non-hot-plug expansion slot 3 10 PCI Express x4 non-hot-plug expansion slot 2 11 PCI Express x8 non-hot-plug expansion slot 1 Combo PCIe/HTx I/O backplane Item Description 1 Blank slot 2 HyperTransport non-hot-plug expansion slot 9 3 Blank slot 4 HyperTransport non-hot-plug expansion slot 8 5 PCI Express x4 non-hot-plug expansion slot 7 6 PCI Express x4 non-hot-plug expansion slot 6 7
2. 3. 4. 5. Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). Remove the access panel (“Removing the access panel” (page 27)). Disconnect any internal or external cables attached to the expansion board. Push and hold the spring loaded latch to the side of the server, and lift up on the hinge. 6. 7. Unlock the retaining clip (for full-length expansion boards). Remove the board from the server.
CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. Removing the cache module CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached. 1. 2. 3. 4.
3. Remove the access panel (“Removing the access panel” (page 27)). CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message displays when the server is powered up, indicating that the battery pack is temporarily disabled. No action is necessary. The internal circuitry automatically recharges the batteries and enables the battery pack. This process can take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.
To replace the component, reverse the removal procedure. SPI (core I/O) board The System Peripheral Interconnect (SPI) board implements all the logic to support the internal devices and the standard connectivity of the product. The board includes a RAID5 SAS controller which supports up to eight of the sixteen embedded SAS disk drives. CAUTION: Only authorized technicians trained by HP should attempt to remove the SPI board.
1. 2. 3. 4. 5. Power down the server (“Power down the server” (page 25)). Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). Remove the access panel (“Removing the access panel” (page 27)). Locate the battery on the SPI board (“SPI board components” (page 72)). Remove the battery. To replace the component, reverse the removal procedure. Run the RBSU to configure the server after replacing the battery.
8. Pull the I/O backplane assembly out of the chassis. To replace the component, reverse the removal procedure. Midplane board CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 23)). TIP: HP recommends troubleshooting the system using port 85 codes before replacing the midplane board. See “Troubleshooting the system using port 85 codes” (page 57) for a list of codes and troubleshooting procedures.
CAUTION: When removing the midplane board do not allow the lower connectors to touch the chassis. Allowing the midplane board connectors to touch the chassis can damage the board. 10. Tilt the board to avoid contact between the lower connectors and the chassis, and pull the board out through the front of the server. To replace the component, reverse the removal procedure.
4 Diagnostic tools In this section • “SmartStart software” (page 53) • “SmartStart Scripting Toolkit” (page 53) • “HP Instant Support Enterprise Edition” (page 54) • “Option ROM Configuration for Arrays” (page 54) • “HP ROM-Based Setup Utility” (page 54) • “ROMPaq utility” (page 55) • “System Online ROM flash component utility” (page 55) • “Integrated Management Log” (page 55) • “Integrated Lights-Out 2 technology” (page 55) • “Automatic Server Recovery” (page 56) • “HP Systems Insight Manager” (page 56) •
server configuration process. This automated server configuration process cuts time from each server deployed, making it possible to scale server deployments to high volumes in a rapid manner. For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website (http://www.hp.com/servers/sstoolkit). HP Instant Support Enterprise Edition ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a feature of HP support.
ROMPaq utility The ROMPaq utility enables you to upgrade the system firmware (BIOS) or Lights-Out 100 firmware. To upgrade the firmware, insert a ROMPaq diskette into the diskette drive or ROMPaq USB Key into an available USB port and boot the system. The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM revisions. For more information about the ROMPaq utility, refer to the HP website (http://www.hp.com/ go/support).
access to any authorized network client, sends alerts, and provides other server management functions. Using iLO 2, you can: • Remotely power up, power down, or reboot the host server. • Send alerts from iLO 2 regardless of the state of the host server. • Access advanced troubleshooting features through the iLO 2 interface. • Diagnose iLO 2 using HP SIM through a web browser and SNMP alerting.
by default in the system ROM. HP hardware supports USB version 1.1 or 2.0, depending on the version of the hardware. Legacy USB support provides USB functionality in environments where USB support is normally not available. Specifically, HP provides legacy USB functionality for: • POST • RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support For more information on ProLiant USB support, refer to the HP website (http://h18004.www1.hp.
3. 4. 5. 6. Reseat the remaining processors, rebooting after each installation to identify any failed processors. Replace the processor in socket 1. Replace the processor board, if applicable. Replace the midplane board. IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial number through RBSU, see “Re-entering the server serial number and product ID” (page 48). Memory-related port 85 codes Memory-related port 85 codes display in the format 4xh.
2. Bring the server to base configuration by removing all components that are not required by the server to complete POST. This process can include removing all: • “Expansion boards” (page 42) • “Processors” (page 30) IMPORTANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and the cell filler populated with the minimum number of processors and DIMMs at all times or the server does not function properly. • • • 3. 4. 5. 6.
5 Component identification In this section • “Front panel components” (page 61) • “Front panel LEDs and buttons” (page 63) • “System Insight Display LEDs” (page 64) • “SAS and SATA hard drive LEDs” (page 66) • “SAS and SATA hard drive LED combinations” (page 66) • “Processor memory cell components” (page 67) • “Rear panel components” (page 68) • “Rear panel LEDs and buttons” (page 69) • “Power supply LED” (page 70) • “Internal components” (page 70) • “SPI board components” (page 72) • “System maintenance sw
Item Description 8 Hard drive bay 3 right 9 Hard drive bay 4 right 10 Hard drive bay 5 right 11 Hard drive bay 6 right 12 Hard drive bay 7 right 13 Hard drive bay 8 right not shown Hard drive bay 1 left (optional) not shown Hard drive bay 2 left (optional) not shown Hard drive bay 3 left (optional) not shown Hard drive bay 4 left (optional) not shown Hard drive bay 5 left (optional) not shown Hard drive bay 6 left (optional) not shown Hard drive bay 7 left (optional) not shown Hard drive bay 8
Front panel LEDs and buttons Item Description Color Status 1 UID button and LED Off UID button is not activated Solid blue UID button is activated for server identification Flashing blue Server is being remotely managed Off Normal (system is off or in standby mode) Solid green Normal (system is powered on) Flashing amber Redundant power supply failure (system power supply is no longer redundant) Flashing red Critical power supply failure Off Normal (system is off or in standby mode) S
Item Description Color Status 5 NIC 2 LED Off NIC not used NOTE: Rear panel NIC can show link or activity while in standby mode. 6 Power button and LED Solid green Linked to the network Flashing green Linked with activity on the network Off No ac power to the system Solid amber System has ac power and is in standby mode Solid green System has ac power and is powered on System Insight Display LEDs The front panel health LEDs indicate only the current hardware status.
system attributes. The System Insight Display LEDs identify components experiencing an error, event, or failure. CAUTION: Do not block airflow by pushing the SID flush against the server while it is in the down position. IMPORTANT: When removing the access panel to view the Systems Insight Display LEDs, leave the server powered on. The Systems Insight Display LEDs are cleared when the server is powered off.
LED Component PROCESSOR/MEMORY BOARD X Processor PROC X PROCESSOR/MEMORY BOARD X Processor DIMM board BOARD X SAS and SATA hard drive LEDs Item Description Color Status 1 Fault/UID LED Amber Drive failure Flashing amber Fault-process activity Blue Unit identification is active Off No fault-process activity Green Drive activity Flashing green High activity on the drive or the drive is being configured as part of an array Off No drive activity 2 Online/activity LED SAS and SATA hard
Online/activity LED Fault/UID LED (green) (amber/blue) Interpretation On Off The drive is online, but is not currently active. Flashing (1 Hz) Flashing amber (1Hz) Flashing (1 Hz) Off Flashing irregularly Flashing amber (1Hz) The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible. Flashing irregularly Off The drive is active and is operating normally.
Item Description 6 DIMM slot 6C 7 DIMM slot 7D 8 DIMM slot 8D 9 Processor socket Rear panel components 68 Item Description 1 NIC connector 1 2 Keyboard connector 3 USB connector 4 Video connector 5 Serial connector 6 iLO 2 connector 7 Mouse connector 8 NIC connector 2 9 Power supply 1 10 Power supply 2 11 Power supply 3 12 Redundant power supply 4 (optional) 13 Redundant power supply 5 (optional) 14 Redundant power supply 6 (optional) 15 PCI Express or HTx expansio
Item Description 18 Fan 5 19 Fan 6 Rear panel LEDs and buttons Item Description LED Color Status 1 UID Solid blue Activated Flashing blue Server remotely managed Off Deactivated Green Linked to network Off Not linked to network Green (solid or flashing) Network activity Off No network activity 2 3 LAN Link LED LAN Activity LED Rear panel LEDs and buttons 69
Power supply LED Color Status Off No ac power Blinking green ac power; standby power on Solid green Full power on; normal operation Blinking amber Power supply failure Internal components 70 Item Description 1 Media module 2 Fan 3 3 Fan 2 Component identification
Item Description 4 Fan 1 5 System maintenance switch SW6 6 System maintenance switch SW1 7 SPI Board 8 PCI Express x8 non-hot-plug expansion slot 11 9 PCI Express x16 non-hot-plug expansion slot 10 10 PCI Express x8 non-hot-plug expansion slot 9 11 PCI Express x16 non-hot-plug expansion slot 8 12 PCI Express x4 non-hot-plug expansion slot 7 13 PCI Express x4 non-hot-plug expansion slot 6 14 PCI Express x16 non-hot-plug expansion slot 5 15 PCI Express x4 non-hot-plug expansion slot 4
Combo PCIe/HTx I/O backplane Item Description 3 Blank slot 4 HyperTransport non-hot-plug expansion slot 8 5 PCI Express x4 non-hot-plug expansion slot 7 6 PCI Express x4 non-hot-plug expansion slot 6 7 PCI Express x16 non-hot-plug expansion slot 5 8 PCI Express x4 non-hot-plug expansion slot 4 9 PCI Express x4 non-hot-plug expansion slot 3 10 PCI Express x4 non-hot-plug expansion slot 2 11 PCI Express x8 non-hot-plug expansion slot 1 SPI board components SPI (core I/O) board Item Descr
Position Description Switch Function 2 Configuration lock Off System configuration can be changed On System configuration is locked 3 Reserved — Reserved 4 Reserved — Reserved 5 Password protection override Off Password is enabled On Password is disabled Off Switch has no function On ROM reads system configuration as invalid 6 Reset configuration 7 POST LED switch 1 8 POST LED switch 2 See Table 5-1 (page 73) for details.
System maintenance switch (SW1) CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all supported AMD Opteron six-core processors require the system maintenance switch, located on the I/O backplane, (SW1) position 5 to be in the On position. HP recommends updating to the latest version of firmware. Earlier firmware versions might not validate the required switch setting for these processors.
Table 5-2 Battery health and BBWC status LED patterns (continued) LED 3 pattern LED 4 pattern Interpretation Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are temporarily unavailable until charging is complete. The recharge process takes between 15 minutes and two hours, depending on the initial capacity of the battery.
Item Description 1 Fan 1 2 Fan 2 3 Fan 3 4 Fan 4 5 Fan 5 6 Fan 6 Component identification
6 Cabling In this section • “Cabling overview” (page 77) • “BBWC cabling” (page 77) • “SAS and SATA hard drive cabling” (page 78) • “SAS expander cabling” (page 78) • “High power graphics card cabling” (page 80) Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.
SAS and SATA hard drive cabling CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped. SAS expander cabling To install a SAS expander: 1. 2. 3. 4. 5. 78 Cabling Power down the server (“Power down the server” (page 25)). Extend or remove the server from the rack (“Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26)). Remove the access panel (“Removing the access panel” (page 27)).
6. 7. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2 (“Expansion boards” (page 42)). Route and connect the cables from the SAS expander to the SAS backplanes.
TIP: For best cable management route the cable to SAS backplane 1 under the power cable at the power supply backplane and the cable to SAS backplane 2 under other cables in the center cable routing channel. High power graphics card cabling IMPORTANT: Install high powered graphics cards in PCIe 16x slots for optimum performance. The server can power a maximum of four auxiliary high powered graphics card power connections.
7 Specifications In this section • “Environmental specification” (page 81) • “Server specifications” (page 81) Environmental specification Specification Value Temperature range Operating 10°C to 35°C (50°F to 95°F)1 Non-operating -30°C to 60°C (-22°F to 140°F)2 Maximum wet bulb temperature 28°C (82.4°F) 3 Relative humidity (noncondensing) Operating 10% to 90% relative humidity (Rh), 28°C (82.4°F) maximum wet bulb temperature, non-condensing. Non-operating 5% to 95% relative humidity (Rh), 38.
Specification Value Rated input frequency 47- 63 Hz 47- 63 Hz Rated input current 24A at100 V ac 14A at 200 V ac Rated input power 2400 W 2800 W BTUs per hour 8189 9554 Power supply output Low line High line3 Power supply output 800 W per P.S.U. at 3 P.S.U. active 1200 W per P.S.U. at 3 P.S.U. active Acoustic Noise4 Idle LWAd 7.6 B LpAm 58 dBa Operating LWAd 7.
8 Technical support In this section • “Before you contact HP” (page 83) • “HP contact information” (page 83) Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Applicable error messages • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authori
A Acronyms and abbreviations ABEND ACU ADU AMD ASR BBWR BIOS CSA CSR DIMM DOS ESD HTx IEC iLO 2 IML ISEE KVM NEMA NFPA NIC NiMH NVRAM ORCA OS PCI-X PCIe PDU POST PPM PSP RAID RBSU RDP RILOE II ROM SAS SCSI SFF SID SIM SNMP abnormal end Array Configuration Utility Array Diagnostics Utility Advanced Micro Devices Automatic Server Recovery battery-backed write cache Basic Input/Output System Canadian Standards Association Customer Self Repair dual inline memory module disk operating system electrostatic disch
TMRA UID UPS USB VCA 86 recommended ambient operating temperature unit identification uninterruptible power system universal serial bus Version Control Agent Acronyms and abbreviations
Index A access panel, 27 ASR (see Automatic Server Recovery (ASR)) Automatic Server Recovery (ASR), 56 B battery-backed write cache battery pack, 45 data recovery, 47 battery-backed write cache (BBWC), 44 BBWC (see battery-backed write cache) LED (see LED, battery pack) blanks DVD or CD, 38 hard drive, 37 power supply, 38 C cabling, 77–80 BBWC, 77 hard drive, 78 high power graphics card, 80 SAS expander, 78–80 components front, 61 internal, 70–72 mechanical, 13 processor memory cell, 67 rear, 68 system, 1
R rack extending server from, 25 removing server from, 26 RBSU (HP ROM-Based Setup Utility), 54 removal and replacement procedures, 23 required tools, 23 ROM updating, 55 ROMPaq Utility, 55 S safety considerations, 23 SAS backplane, 44 hard drives, 37 serial number, 48 SID (see System Insight Display) SmartStart Scripting Toolkit, 53 SmartStart software, 53 specifications environmental, 81 server, 81 SPI board, 72 system battery, 48 System Insight Display, 64 system maintenance switch SW1, 74 SW6, 72 Syste
*AH233-9002A_ed7* Printed in the US
