Technologies in HP ProLiant G6 c-Class server blades with AMD Opteron™ processors

More information about HP Thermal Logic technologies is available
on the HP website:
www.hp.com/go/thermallogic.
Processor socket technology
The latest AMD Opteron processor packages use a processor socket technology called Land Grid
Array (LGA). The processor package designs have no pins. Instead, the processor package has pads
of gold-plated copper that touch processor socket pins on the motherboard.
Technicians must be careful when installing processors to avoid damaging the delicate processor
socket pins. Because pin damage could require replacing the motherboard, HP engineers developed
a special installation tool to simplify processor installation and reduce the possibility of damaging the
socket pins (Figure 5).
Figure 5. Diagram showing how the processor installation to
ol simplifies installation
Memory technologies
In AMD Opteron architecture, DIMMs must be installed in pairs. The memory controller integrated into
the processor chip allows for multiple memory requests in parallel, thereby increasing the effective
memory bandwidth and reducing memory latency. Because each processor contains its own memory
controller, the aggregate bandwidth for system-accessible memory is scalable in multi-processor
systems.
The AMD Opteron processor supports dual-channel memory. Two 64-bit-wide memory channels
operate in parallel to provide a 128-bit interface. IT administrators can configure the two memory
channels to run as two independent channels for optimal performance.
By default, memory operates in a linear configuration, which provides optimum performance for
Microsoft® Windows® operating systems and for many applications, such as Microsoft SQL Server.
Linear memory is allocated and de-allocated at the thread level, and access is defined on all nodes
sequentially. Sequential addresses are assigned to all memory locations starting on node 0, then to all
locations on node 1, and so on until memory locations on all nodes have been assigned.
6