HP ProLiant ML310e Gen8 Server Maintenance and Service Guide Abstract This document is for an experienced service technician. It is helpful if you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................................................................................ 6 Illustrated parts catalog ............................................................................................................... 16 Mechanical components ..........................................
HP Trusted Platform Module......................................................................................................................... 60 Troubleshooting .......................................................................................................................... 61 Troubleshooting resources ........................................................................................................................... 61 Diagnostic tools ...............................................
Before you contact HP ................................................................................................................................ 85 HP contact information ................................................................................................................................ 85 Acronyms and abbreviations ........................................................................................................ 86 Documentation feedback ............................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6) 1 Access panel 686751-001 Mandatory1 2 RPS cage 686665-001 Mandatory1 3 Four-bay LFF drive cage 686745-001 Mandatory1 4 SFF drive blank 670033-001 Mandatory1 5 LFF drive blank 675039-001 Mandatory1 6 Air baffle 686752-001 Mandatory1 Mandatory—Parts for which customer self repair is mandatory.
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation.
Illustrated parts catalog 18
System components Item Description Spare part number Customer self repair (on page 6) 7 Optical drives — — a) SATA DVD-ROM drive 624591-001 Mandatory1 b) SATA DVD-RW drive* 624592-001 Mandatory1 8 Front I/O module 691939-001 Mandatory1 9 Eight-bay SFF hot-plug drive cage assembly 686753-001 Mandatory1 10 Eight-bay SFF hot-plug drive backplane 686759-001 Mandatory1 11 Four-bay LFF hot-plug drive backplane 686756-001 Mandatory1 12 Four-bay LFF non-hot-plug drive bracket 686746
Item Description Spare part number Customer self repair (on page 6) d) 3 TB, 6G hard drive* 628183-001 Mandatory1 Non-hot-plug drives, SAS — — a) 450 GB, 6G hard drive* 517353-001 Mandatory1 b) 600 GB, 6G hard drive* 517355-001 Mandatory1 Hot-plug drives, SATA — — a) 100 GB, 3G MLC solid state drive* 653968-001 Mandatory1 b) 200 GB, 3G MLC solid state drive* 653969-001 Mandatory1 c) 400 GB, 3G MLC solid state drive* 653970-001 Mandatory1 e) 500 GB, 6G hard drive* 658103-001 Man
Item Description Spare part number Customer self repair (on page 6) j) 900 GB, 6G hard drive* 653971-001 Mandatory1 k) 1 TB, 6G hard drive* 653954-001 Mandatory1 14 Front system fan (80 x 38 mm) 686749-001 Mandatory1 15 686757-001 Optional2 — — 686687-001 Optional2 665119-001 Optional2 703516-001 Optional2 686686-001 Optional2 701538-001 Optional2 686685-001 Optional2 701537-001 Optional2 686684-001 Optional2 686683-001 Optional2 686682-001 Optional2 17 System board a
Item Description Spare part number Customer self repair (on page 6) 26 Mini-SAS to SATA cable assembly (for LFF drive cage)* 686747-001 Mandatory1 *Not shown Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (on page 75) • Flathead screwdriver • HP Insight Diagnostics (on page 62) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
Preparation procedures To access some components and perform certain service procedures, perform one or more of the following procedures: • Unlock the tower bezel (on page 26). • Remove the tower bezel (on page 26). • Power down the server (on page 27). Before removing the server from a rack or a non-hot-plug component from the server, power down the server. • Remove the access panel ("Access panel" on page 31).
2. Pull the bezel away from the front chassis. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 2. Do one of the following: o In a non-hot-plug drive configuration, remove the drive carrier. To replace the drive carrier, slide the component into the bay until it clicks. o In a hot-plug drive configuration, remove the drive blank.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Back up all server data on the drive. 2. Power down the server (on page 27). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 5. Remove the drive. 6.
2. Determine the status of the drive from the drive LED definitions (on page 73). 3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the drive. To replace the component, reverse the removal procedure. Hot-plug power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 27).
CAUTION: The default and redundant power supplies in the server must have the same output power capacity. Verify that all power supplies have the same part number and label color. The system becomes unstable and might shut down when it detects mismatched power supplies. To replace the component, reverse the removal procedure.
Air baffle To remove the component: CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4.
5. Disconnect the SATA and power cables from the optical drive. 6. Remove the optical drive. To replace the component, reverse the removal procedure. Drive cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 31). 5.
o Four-bay LFF drive cage o Eight-bay SFF drive cage To replace the component, reverse the removal procedure. To convert the four-bay non-hot-plug drive cage to a hot-plug model, remove the cage bracket, and then install the hot-plug backplane option before installing the cage back to the server ("Drive cage bracket or backplane" on page 34). Drive cage bracket or backplane To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a.
b. Disconnect each power cord from the server. 3. Remove the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. If the drives are to be connected to a storage controller card, remove the air baffle ("Air baffle" on page 32). 6. Remove all installed drives ("Storage drive" on page 28). 7. Disconnect the drive cage cables: a. Disconnect the Mini-SAS cable from the system board or from the storage controller option. b.
o In a non-hot-plug drive cage, loosen the bracket thumbscrew, and then remove the bracket assembly from the drive cage. o In a hot-plug drive cage, loosen the backplane thumbscrew, and then remove the backplane assembly from the drive cage. To replace the component, reverse the removal procedure. Front I/O module To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the air baffle ("Air baffle" on page 32). 6. Disconnect the front USB and LED cables from the system board ("Front panel cabling" on page 76). 7. Remove the front I/O module. To replace the component, reverse the removal procedure. Front system fan To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a.
7. Press the release latch, and then remove the fan module. To replace the component, reverse the removal procedure. DIMMs General DIMM slot population guidelines • The server has four memory slots. • The server supports two channels with two DIMM slots per channel. o Memory channel 1 consists of the two DIMMs that are closest to the processor. o Memory channel 2 consists of the two DIMMs that are farthest from the processor. • White DIMM slot indicates the first slot of a channel (2-A, 4-B).
Removing a DIMM 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the air baffle ("Air baffle" on page 32). 6. Open the DIMM slot latches. 7. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1.
c. Remove the heatsink from the processor backplate. To replace the component: 1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the thermal interface protective cover from the heatsink. CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. 3. Install the heatsink: a. Position the heatsink using the guide pin on the processor backplate. b.
c. Finish the installation by completely tightening the screws in the same sequence. 4. Install the air baffle ("Air baffle" on page 32). 5. Install the access panel. 6. Lock the tower bezel. 7. Connect each power cord to the server. 8. Connect each power cord to the power source. 9. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
5. Remove the air baffle ("Air baffle" on page 32). 6. Remove the heatsink ("Heatsink" on page 39). CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board. 7. Open the processor locking lever, and then open the processor retaining bracket. 8. Grasp the processor by the edges, and then lift it out of the socket.
1. Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 2. Close the processor retaining bracket, and then secure the processor locking lever. 3.
CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. 5. Install the heatsink: a. Position the heatsink using the guide pin on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c. Finish the installation by completely tightening the screws in the same sequence. 6. Install the air baffle. 7. Install the access panel. 8. Lock the tower bezel. 9.
7. Remove the expansion slot cover retainer. 8. If removing a full-length expansion board, remove the board retainer securing it. 9. Remove the expansion board. To replace the component, reverse the removal procedure.
2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the air baffle ("Air baffle" on page 32). CAUTION: When connecting or disconnecting the capacitor pack cable, the connectors on the cache module and cable are susceptible to damage.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4.
8. Remove the capacitor pack. To replace the component, reverse the removal procedure. Recovering data from the flash-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 24). 1. Perform one of the following: o Set up a recovery server station using an identical server model.
System battery If the server no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Rear system fan To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the air baffle ("Air baffle" on page 32). 6. Remove any existing expansion board that blocks access to the rear system fan connector. 7. Disconnect the fan cable. 8.
7. Remove the iLO module from the chassis. To replace the component, reverse the removal procedure. Enabling the dedicated iLO management port The onboard NIC 1/shared iLO connector is set as the default system iLO port. To enable the installed dedicated iLO module: 1. During the server startup sequence after module installation, to access iLO RBSU, press the F8 key. 2. Select the Network menu. 3. Click the Network Interface Adapter field. 4. To change the setting to ON, press the spacebar. 5.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. 5. Disconnect the power supply cables from the drive cage and the system board. 6. Remove the power supply. To replace the component, reverse the removal procedure. RPS backplane module To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b.
8. Remove the RPS backplane module. To replace the component, reverse the removal procedure. RPS cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the air baffle ("Air baffle" on page 32). 6.
11. Remove the power supply cage. To replace the component, reverse the removal procedure. System board CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags. To remove the system board: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
c. Remove the heatsink from the processor backplate. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. 9. Open the processor locking lever, and then open the processor retaining bracket. 10. Grasp the processor by the edges, and then lift it out of the socket. 11. Remove all DIMMs ("Removing a DIMM" on page 39). 12. Remove all expansion boards ("Expansion board" on page 44). 13.
b. Lift the system board out of the chassis. To replace the system board: 1. Install the system board. 2. Connect all cables disconnected from the failed system board. 3. Install the DIMMs. 4. If removed, install the dedicated iLO management port. 5. Install the expansion boards. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.
6. Open the processor locking lever, and then open the processor retaining bracket. 7. Remove the processor socket cover. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket.
8. Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 9. Close the processor retaining bracket, and then secure the processor locking lever. 10.
CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. 12. Install the heatsink: a. Position the heatsink using the guide pin on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c. Finish the installation by completely tightening the screws in the same sequence.
19. Lock the tower bezel. 20. Connect each power cord to the server. 21. Connect each power cord to the power source. 22. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running.
SAP Solution Manager to manage their environment, HP recommends installing the latest HP Insight Remote Support Advanced software. This software provides comprehensive remote monitoring and proactive service support for nearly all HP servers, storage, network, and SAN environments, plus selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight Manager.
USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Component identification Front panel components Item Description 1 Optical drive (optional) 2 Media drive bay 3 USB connectors 4 Power On/Standby button and system power LED 5 Drive bays (inside) Component identification 65
Front panel LEDs and buttons Item Description Status 1 UID LED button Blue = Identification is activated Flashing blue = System is being managed remotely Off = Identification is deactivated 2 Health LED Green = Normal (system on) Flashing amber = System health is degraded Flashing red = System health is critical Off = Normal (system off) 3 NIC status LED Green = Linked to network Flashing green = Network activity Off = No network link 4 Power On/Standby button and system power LED Green = Nor
Rear panel components Item Description 1 Non-hot-plug power supply 2 Slot 4 PCIe x16 (8, 4, 1)* 3 Slot 3 PCIe x8 (8, 4, 1)* 4 Slot 2 PCIe x8 (4, 1)* 5 Slot 1 PCIe x4 (1)* 6 Expansion slot cover retainer 7 Serial connector 8 Video connector 9 Dedicated iLO management port (optional) 10 NIC 1/shared iLO management connector 11 NIC connector 2 12 USB connectors * For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page 70).
Rear panel LEDs and buttons Item Description Status 1 NIC link LED Green = Link exists Off = No link exists 2 NIC status LED Green = Activity exists Flashing green = Activity exists Off = No activity exists 3 UID LED button Blue = Identification is activated Flashing blue = System is being managed remotely Off = Identification is deactivated 4 Power supply LED (for hot-plug HP Green = Normal CS power supplies only)* Off = One or more of the following conditions exists: • • • • Power Power Po
System board components Item Description 1 RPS connector 2 Processor socket 3 System battery 4 24-pin power supply connector 5 Mini-SAS connector 6 SATA connectors 7 Internal USB cable connector 8 Internal USB connector 9 SD card slot 10 Front USB connector 2 11 Front USB connector 1 12 Front panel LED connector 13 Fan connector 2 14 Reserved 15 Ambient thermal sensor connector 16 NMI header 17 System maintenance switch 18 Slot 1 PCIe x4 (1)* 19 Slot 2 PCIe x8 (4, 1)*
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page 70)." DIMM slot locations DIMM slots are numbered sequentially (1 through 4) for the processor. The supported AMP modes use the letter assignments for population guidelines. PCIe expansion slot definitions The transfer rate of the PCIe expansion slots 3 and 4 depends on the processor model installed. The slots can either run in PCIe2 (5 GT/s) or PCIe3 (8 GT/s) rate.
Switch Default Function 2 Off Off = System configuration can be changed On = System configuration is locked 5 Off Off = Power-on password is enabled On = Power-on password is disabled 6 Off Off = No function On = ROM reads configuration as invalid 3, 4, 7, 8, 9, 10, 11, 12 — Reserved When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.
Drive numbering • Four-bay LFF drive model • Eight-bay SFF drive model Component identification 72
Drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
FBWC module LED definitions The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. 1 - Amber 2 - Green 3 - Green Interpretation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller.
Fan locations Item Description 1 Rear system fan (fan 1, for processor cooling) 2 Front system fan (fan 2, for expansion board cooling) T-10/T-15 Torx screwdriver The server includes a T-10/T-15 Torx screwdriver located on the side of the media drive cage. Use the screwdriver to loosen screws during hardware configuration procedures.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
System fan cabling Item Description 1 Rear system fan cable 2 Front system fan cable Storage cabling Four-bay LFF drive cabling Non-hot-plug, SATA drive support only Cabling 77
Item Description 1 Power cable 2 Data cable Non-hot-plug, SATA and SAS drive support Item Description 1 Power cable 2 Data cable Hot-plug, SATA drive support Item Description 1 Power cable Cabling 78
Item Description 2 Mini-SAS cable Hot-plug, SATA and SAS drive support Item Description 1 Power cable 2 Mini-SAS cable Eight-bay SFF drive cabling This drive configuration supports hot-plug SATA and SAS drives.
Item Description 2 Mini-SAS cable 3 Mini-SAS cable Media drive cabling • Media drives in a nonredundant power configuration Item Description 1 Upper media drive power cable 2 Lower media drive SATA cable 3 Upper media drive SATA cable 4 Lower media drive power cable Cabling 80
• Media drive in a redundant power configuration Item Description 1 Upper media drive SATA cable 2 Upper media drive power cable Power supply cabling Nonredundant power supply cabling Item Description 1 24-pin power supply cable 2 4-pin power supply cable Cabling 81
Redundant power supply cabling Item Description 1 24-pin power supply cable 2 26-pin RPS cable 3 4-pin power supply cable (with the 8-pin to 4-pin adapter cable connected) Capacitor pack cabling Cabling 82
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Nonoperating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) Operating, maximum wet bulb 10% to 90% temperature of 28°C (82.4°F) Nonoperating, maximum wet 5% to 95% bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
HP 350 W 4U Factory Integrated Power Supply Specification Value Input requirements — Rated input voltage 100 V AC to 240 V AC Rated input frequency 47 Hz to 63 Hz Rated input current 6A Rated input power 440 W at 100 V AC input 440 W at 200 V AC input Efficiency No less than 82% at 100% load No less than 85% at 50% load No less than 82% at 20% load Power supply output — Rated steady-state power 350 W at 100 V AC input 350 W at 200 V AC input Maximum peak power 400 W at 100 V AC input 400
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDR double data rate FBWC flash-backed write cache HP CS HP Common Slot (power supply) HP SIM HP Systems Insight Manager iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor MLC multilevel cell Acronyms and abbreviations 86
NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe peripheral component interconnect express POST Power-On Self Test RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor SLC single-level cell SPP HP Service Pack for ProLiant TPM Trusted Platform Module Acronyms and abbreviations 87
UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus Acronyms and abbreviations 88
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Index A access panel 31 air baffle 31 ASR (Automatic Server Recovery) 64 authorized reseller 85 Automatic Server Recovery (ASR) 64 B bezel, tower 26 blanks 27 board components 69 buttons 65 C error messages 61 F fan module locations 75 fans 37, 50 FBWC cabling 82 FBWC module LEDs 74 features 65 flash-backed write cache procedures 45, 48 front I/O module 36 front panel buttons 66 front panel cabling 76 front panel components 65 front panel LEDs 66 G cables 76 cabling 76, 77, 78, 79, 80, 81, 82 cache mo
LEDs, LEDs, LEDs, LEDs, rear panel 68 SAS hard drive 73 troubleshooting 61 unit identification (UID) 66 M management tools 62 mechanical components 16 media drive bay cabling 80 N NMI header 71 O optical drive 32, 65 P part numbers 16 PCI expansion slots 70 phone numbers 85 power down procedure 27 power requirements 84 power supply 30, 51, 53, 84 power supply cabling 81 power supply specifications 83, 84 powering down 27 problem diagnosis 61 processors 41 R RBSU (ROM-Based Setup Utility) 63 rear compo