HP ProLiant ML310e Gen8 v2 Server Maintenance and Service Guide Abstract This document is for an experienced service technician. It is helpful if you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
© Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................................................................................ 6 Illustrated parts catalog ............................................................................................................... 16 Mechanical components ..........................................
Diagnostic tools .......................................................................................................................... 61 HP Insight Diagnostics ................................................................................................................................ 61 HP Insight Diagnostics survey functionality .......................................................................................... 61 HP Insight Remote Support software .........................................
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Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6) 1 RPS cage 686665-001 Mandatory1 2 Front bezel 732343-001 Mandatory1 3 Drive cage — — Four-bay LFF drive cage 686745-001 Mandatory1 Eight-bay SFF drive cage* 686753-001 Mandatory1 4 SFF drive blank 670033-001 Mandatory1 5 LFF drive blank 675039-001 Mandatory1 Illustrated parts catalog 16
Item Description Spare part number Customer self repair (on page 6) 6 Non-hot-plug drive carrier† 691585-001 Mandatory1 7 Air baffle 686752-001 Mandatory1 8 Access panel 726768-001 Mandatory1 †When no drive is installed in the non-hot-plug drive carrier, it serves as a blank for a non-hot-plug drive configuration. 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant.
System components Item Description Spare part number Customer self repair (on page 6) 9 HP 350 W 4U Integrated Power Supply 686761-001 Mandatory1 10 511777-001 Mandatory1 11 HP 460 W CS Gold Hot Plug Power Supply (92% efficiency) RPS backplane module 686744-001 Mandatory1 12 Optical drive — — a) SATA DVD-ROM drive 624591-001 Mandatory1 b) SATA DVD-RW drive* 624592-001 Mandatory1 736861-001 Mandatory1 14 LFF non-hot-plug drive bracket with cable assembly SFF hot-plug drive backpl
Item 17 Description Spare part number Customer self repair (on page 6) Non-hot-plug drives, SAS — — a) 450 GB, 6G hard drive* 517353-001 Mandatory1 b) 600 GB, 6G hard drive* 517355-001 Mandatory1 Hot-plug drives, SATA — — a) 100 GB, 3G MLC solid state drive* 653968-001 Mandatory1 b) 200 GB, 3G MLC solid state drive* 653969-001 Mandatory1 c) 400 GB, 3G MLC solid state drive* 653970-001 Mandatory1 d) 500 GB, 6G hard drive* 658103-001 Mandatory1 e) 1 TB, 6G hard drive* 657739-001
Item Description Spare part number Customer self repair (on page 6) 18 Front system fan (80 mm x 38 mm) 686749-001 Mandatory1 19 726766-001 Optional2 — — 726769-001 Optional2 741663-001 Optional2 741661-001 Optional2 725282-001 Optional2 725283-001 Optional2 741662-001 Optional2 725284-001 Optional2 725285-001 Optional2 21 System board assembly (includes alcohol pad and thermal compound) Processors (includes alcohol pad and thermal compound) a) 1.
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. 3 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • Flathead screwdriver • HP Insight Diagnostics (on page 61) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
Preparation procedures To access some components and perform certain service procedures, perform one or more of the following procedures: • Unlock the tower bezel (on page 26). • Remove the tower bezel (on page 26). • Power down the server (on page 27). Before removing the server from a rack or a non-hot-plug component from the server, power down the server. Unlock the tower bezel The tower bezel must be unlocked and opened to access the drive cage and media bays.
3. Pull the bezel away from the front chassis. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power.
Access panel To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Power down the server (on page 27). 2. Remove all power: a.
1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle. To replace the component, reverse the removal procedure.
o In a non-hot-plug drive configuration, remove the drive carrier. To replace the component, reverse the removal procedure. o In a hot-plug drive configuration, remove the drive blank. To replace the LFF drive blank, slide the component into the bay until it clicks. To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated.
b. Disconnect each power cord from the server. 4. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 5. Remove the drive. 6. Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Back up all server data on the drive. 2.
4. Remove the drive. To replace the component, reverse the removal procedure. Hot-plug power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 27). WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. 2. Remove the power cord from the power supply. 3.
CAUTION: In a redundant power supply configuration, both power supply modules in the server must have the same output power capacity. Verify that all power supplies have the same part number and label color. The system becomes unstable and might shut down when it detects mismatched power supplies. To replace the component, reverse the removal procedure.
a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. If the drives are connected to a storage controller card, remove the air baffle. 6. Remove all installed drives ("Storage drive" on page 30). 7. Disconnect the drive cage cables: a. Disconnect the Mini-SAS cable from the system board or from the storage controller option. b.
To replace the component, reverse the removal procedure. To convert the four-bay non-hot-plug drive cage to a hot-plug model, remove the cage bracket, and then install the hot-plug backplane option before installing the cage back to the server ("Drive cage bracket or backplane" on page 35). Drive cage bracket or backplane To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
o For a non-hot-plug drive cage, loosen the bracket thumbscrew, and then remove the bracket assembly from the drive cage. o For a hot-plug drive cage, loosen the backplane thumbscrew, and then remove the backplane assembly from the drive cage. To replace the component, reverse the removal procedure. Front I/O module To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). 6. Disconnect the front USB and LED cables from the system board. 7. Remove the front I/O module. To replace the component, reverse the removal procedure. Front system fan To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b.
7. Press and hold the release latch, and then remove the fan module. To replace the component, reverse the removal procedure. Rear system fan To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). 6.
8. Press and hold the fan latch, and then remove the fan. To replace the component, reverse the removal procedure. Removing a DIMM 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). 6. Open the DIMM slot latches.
7. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). 6. Remove the heatsink: a.
c. Remove the heatsink from the processor backplate. To replace the component: 1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the thermal interface protective cover from the heatsink. CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. 3. Install the heatsink: a. Position the heatsink using the guide pin on the processor backplate. b.
c. Finish the installation by completely tightening the screws in the same sequence. 4. Install the air baffle. 5. Install the access panel. 6. Lock the tower bezel. 7. Connect each power cord to the server. 8. Connect each power cord to the power source. 9. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
6. Remove the heatsink ("Heatsink" on page 40). CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board. 7. Open the processor locking lever, and then open the processor retaining bracket. 8. Grasp the processor by the edges, and then lift it out of the socket.
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 2. Close the processor retaining bracket, and then secure the processor locking lever. 3. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 4.
c. Finish the installation by completely tightening the screws in the same sequence. 6. Install the air baffle. 7. Install the access panel. 8. Lock the tower bezel. 9. Connect each power cord to the server. 10. Connect each power cord to the power source. 11. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Expansion board To remove the component: 1. Power down the server (on page 27). 2.
9. Remove the expansion board. To replace the component, reverse the removal procedure.
b. Disconnect each power cord from the server. 3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). CAUTION: When connecting or disconnecting the capacitor pack cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors. 6. Disconnect the capacitor pack cable from the cache module.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4.
8. Remove the capacitor pack. To replace the component, reverse the removal procedure. Recovering data from the flash-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 24). 1. Perform one of the following: o Set up a recovery server using an identical server model.
System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Integrated power supply To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 26). 4. Remove the access panel ("Access panel" on page 28). WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. 5.
4. Remove the access panel ("Access panel" on page 28). 5. Remove the EMI shield from the lower media bay. 6. Remove the optical drive from the upper media bay. 7. Disconnect the power supply cables from the drive cage and the system board. 8. Remove the RPS backplane module. To replace the component, reverse the removal procedure. RPS cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server. 3. Unlock and open the tower bezel ("Unlock the tower bezel" on page 26). 4. Remove the access panel ("Access panel" on page 28). 5. Remove the air baffle ("Air baffle" on page 28). 6. Disconnect the power supply cables from the drive cage and system board. 7. Remove the EMI shield from the lower media bay. 8. Remove the optical drive from the upper media bay. 9. Remove the hot-plug power supplies. 10. Remove the RPS backplane module. 11.
7. Disconnect the capacitor pack cable from the FBWC module. 8. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. Remove the heatsink from the processor backplate. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. 9. Open the processor locking lever, and then open the processor retaining bracket. 10.
a. Remove the system board screws. b. Lift the system board out of the chassis. To replace the system board: 1. Install the system board. 2. Install the DIMMs. 3. Install the expansion boards. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
4. Open the processor locking lever, and then open the processor retaining bracket. 5. Remove the processor socket cover. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket.
6. Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 7. Close the processor retaining bracket, and then secure the processor locking lever. 8.
CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. 10. Install the heatsink: a. Position the heatsink using the guide pin on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c. Finish the installation by completely tightening the screws in the same sequence.
18. Connect each power cord to the server. 19. Connect each power cord to the power source. 20. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Service Options. 4.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running.
HP ROM-Based Setup Utility RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following: • Configuring system devices and installed options • Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the
• DOS • Operating environments which do not provide native USB support For Windows Server 2008 R2 SP1, you must download the USB 3.0 driver from the HP website (http://www.hp.com/go/hpsc). Internal USB functionality An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data.
Component identification Front panel components Item Description 1 Optical drive (optional) 2 Media drive bay 3 Power On/Standby button and system power LED 4 USB connectors 5 Drive bays (inside) Component identification 64
Front panel LEDs and buttons Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 2 Health LED Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec) = Power fault* 3 NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 4
Rear panel components Item Description 1 Power supply 2 Kensington security slot 3 Slot 4 PCIe x16 (8, 4, 1)* 4 Slot 3 PCIe x8 (8, 4, 1)* 5 Slot 2 PCIe x8 (1)* 6 Slot 1 PCIe x4 (1)* 7 Serial connector 8 Video connector 9 Dedicated iLO port 10 USB 3.0 connectors 11 UID LED/button 12 NIC connectors * For more information on the expansion slot specifications, see "PCIe expansion slot definitions.
Rear panel LEDs and buttons Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 2 NIC status LED Solid Green = Activity exists Flashing green = Activity exists Off = No activity exists 3 NIC link LED Solid green = Link exists Off = No link exists Component identification 67
System board components Item Description 1 RPS connector 2 Processor socket 3 TPM connector 4 System battery 5 24-pin power supply connector 6 Mini-SAS connector 7 SATA connectors 8 Internal USB cable connector 9 Internal USB connector 10 Micro SD card slot 11 Front USB connector 2 12 Front USB connector 1 13 Front panel connector 14 Front system fan connector (fan 2) 15 Ambient thermal sensor connector 16 NMI header 17 System maintenance switch 18 Slot 1 PCIe2 x4 (1)*
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions." DIMM slot locations DIMM slots are numbered 1 through 4. Letters are used for AMP mode DIMM ordering.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. NMI functionality An NMI crash dump creates a crash dump log before resetting a system which is not responding. Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system.
• Eight-bay SFF drive model Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
Item LED Status Definition Off The drive is not configured by a RAID controller. FBWC module LED definitions The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. 1 - Amber 2 - Green 3 - Green Interpretation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing 0.
Fan locations Item Description 1 Rear system fan (fan 1, for processor cooling) 2 Front system fan (fan 2, for expansion board cooling) Component identification 73
Cabling Cabling overview This section provides guidelines to help make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, see the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Storage cabling Four-bay LFF drive cabling Non-hot-plug cage to system board, SATA drive support only Item Description 1 Drive cage power cable 2 Mini-SAS cable Non-hot-plug cage to controller card, SATA and SAS drive support Item Description 1 Drive cage power cable Cabling 75
Item Description 2 Mini-SAS cable Hot-plug cage to system board, SATA drive support Item Description 1 Drive cage power cable 2 Mini-SAS cable Hot-plug cage to controller card, SATA and SAS drive support Item Description 1 Drive cage power cable 2 Mini-SAS cable Cabling 76
Eight-bay SFF drive cabling This drive configuration supports hot-plug SATA and SAS drives.
Item Description 1 Optical drive power cable 2 SATA cable • Optical drive in a redundant power configuration Item Description 1 SATA cable 2 Drive cage power cable 3 Optical drive power cable Cabling 78
Power supply cabling Integrated power supply cabling Item Description 1 4-pin power supply cable 2 24-pin power supply cable Redundant power supply cabling Item Description 1 4-pin power supply cable (with the 8-pin to 4-pin adapter cable connected) 2 26-pin RPS cable Cabling 79
Item Description 3 24-pin power supply cable Capacitor pack cabling Item Description 1 Cache module 2 FBWC capacitor pack Cabling 80
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Nonoperating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) Operating, maximum wet bulb 10% to 90% temperature of 28°C (82.4°F) Nonoperating, maximum wet 5% to 95% bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
HP 350 W 4U Integrated Power Supply Specification Value Input requirements — Rated input voltage 100 V AC to 240 V AC Rated input frequency 47 Hz to 63 Hz Rated input current 6A Rated input power 440 W at 100 V AC input 440 W at 200 V AC input Efficiency No less than 82% at 100% load No less than 85% at 50% load No less than 82% at 20% load Power supply output — Rated steady-state power 350 W at 100 V AC input 350 W at 200 V AC input Maximum peak power 400 W at 100 V AC input 400 W at 200
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log (HP ProLiant Gen8 or later products) Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDR double data rate FBWC flash-backed write cache HP CS HP Common Slot (power supply) HP SIM HP Systems Insight Manager iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor MLC multilevel cell (NAND memory type used in SSDs) Acronyms and abbreviations 84
NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor SLC single level cell (NAND memory type used in SSDs) SPP HP Service Pack for ProLiant TPM Trusted Platform Module Acronyms and abbreviations 85
UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus Acronyms and abbreviations 86
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Index A access panel 28 air baffle 28 ASR (Automatic Server Recovery) 63 authorized reseller 83 Automatic Server Recovery (ASR) 63 B buttons 24, 64 C cables 74 cabling 74, 75, 77, 78, 79 cache module 46, 72 cache module, removing 46 capacitor pack 46, 47 Care Pack 61 components 16, 64 components, identification 16, 64 connectors 64 contacting HP 83 crash dump analysis 70 CSR (customer self repair) 6 customer self repair (CSR) 6, 83 D diagnostic tools 61, 63 diagnostics utility 61 DIMM slot locations 69 D
management tools 61 mechanical components 16 media drive bay cabling 77 memory dump 70 system components 19, 64 system maintenance switch 69 N technical support 6, 83 telephone numbers 83 temperature requirements 81 tools 24 tower bezel, removing 26 troubleshooting 60 Trusted Platform Module (TPM) 59 NMI header 70 O operating system crash 63, 70 P part numbers 16 PCI expansion slots 69 phone numbers 83 POST error messages 60 power down procedure 27 power supply 51 power supply cabling 78 power supply
