HP ProLiant ML350p Gen8 Server Maintenance and Service Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 15 Mechanical components..............................................
System board ......................................................................................................................................... 64 System battery ........................................................................................................................................ 72 HP Trusted Platform Module ...................................................................................................................... 73 Troubleshooting .....................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1 Front bezel 667267-001 Mandatory1 2 Second optical drive cage 670612-001 Optional2 3 Fan cage 667255-001 Optional2 4 Fan blank 667262-001 Mandatory1 5 Fan louver 667258-001 Optional2 6 PCI air baffles (2) 667280-001 Mandatory1 7 System air baffle 667256-001 Mandatory1 8 Bezel ear kit 667274-001 Mandatory1 a) Bezel ear, right — — b) Bezel ear, left* —
Item Description Spare part number Customer self repair (on page 5) c) T-10 screws (4)* — — d) T-15 screws (4)* — — e) Discovery service cable* — — f) Server baseblank covers (2)* — — 9 Tower feet 667264-001 Mandatory1 10 LFF drive blank 667279-001 Mandatory1 11 SFF drive blank 667276-001 Mandatory1 12 Drive cage blank* 667261-001 Mandatory1 13 Heatsink retaining levers* 751444-001 Mandatory1 *Not shown Mandatory—Parts for which customer self repair is mandatory.
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario.
System components Item Description Spare part number Customer self repair (on page 5) 13 Power supplies — — a) HP 460W CS Gold (92% efficiency) 511777-001 Mandatory1 b) HP 460 W CS Platinum Plus (94% efficiency)* c) HP 750 W CS Gold (92% efficiency)* 660184-001 Mandatory1 511778-001 Mandatory1 660183-001 Mandatory1 660185-001 Mandatory1 14 d) HP 750 W CS Platinum Plus (94% efficiency)* f) HP 1200 W CS Platinum Plus (94% efficiency)* Heatsink 667268-001 Optional2 15 Processors** —
Item Description Spare part number Customer self repair (on page 5) 730239-001 Optional2 730241-001 Optional2 670525-001 Optional2 670528-001 Optional2 670530-001 Optional2 730244-001 Optional2 670524-001 Optional2 670527-001 Optional2 730236-001 Optional2 730242-001 Optional2 670523-001 Optional2 730238-001 Optional2 730240-001 Optional2 670522-001 Optional2 730245-001 Optional2 730235-001 Optional2 670537-001 Optional2 670521-001 Optional2 670539-001 Optional2 730
Item Description Spare part number Customer self repair (on page 5) c) 2 GB, PC3L-12800E-11, single-rank x8 715279-001 Mandatory1 d) 4 GB, PC3L-12800E-11, dual-rank x8 715280-001 Mandatory1 e) 4 GB, PC3L-12800R-11, single-rank x4 715282-001 Mandatory1 f) 4 GB, PC3-14900E-13, dual-rank x8 715270-001 Mandatory1 g) 4 GB, PC3-14900R-13, single-rank x4 715272-001 Mandatory1 h) 4 GB, PC3L-10600R-9, single-rank x4* 664688-001 Mandatory1 i) 4 GB, PC3-12800R-11, single-rank x4* 664689-001 Mandato
Item Description Spare part number Customer self repair (on page 5) 25 SATA cable* 667265-001 Mandatory1 26 SFF drive backplane with expander* 693610-001 Optional2 27 LFF drive backplane with expander* 693611-001 Optional2 28 Fan module* 667254-002 Mandatory1 29 Bracket support holder* 667263-001 Mandatory1 a) Right holder — — b) Left holder — — Optional2 32 Two-bay power supply backplane board* 667269-001 (with 2 T-15 screws) Four-bay power supply backplane board* 667281-001
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden.
Illustrated parts catalog 23
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 75) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
• Power down the server (on page 26). If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Remove the tower bezel (on page 27). • Remove the rack bezel. • Extend the server from the rack (on page 28). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
Remove the security bezel Unlock the security bezel, press the latch on the security bezel, and then remove the security bezel. Remove the tower bezel This server has a removable bezel that must be unlocked and opened before accessing the hard drives. The bezel must be kept closed during normal server operations. 1. Using the key provided with the server, unlock the bezel with a clockwise turn. 2. Remove the tower bezel. Remove the rack bezel 1. If installed, remove the security bezel (on page 27).
3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Extend the server from the rack (on page 28). 5. Remove the access panel ("Access panel" on page 29). 6. Loosen the rack bezel thumbscrews located inside the chassis. 7. Remove the rack bezel. Extend the server from the rack IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access internal components. 1.
3. After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place. WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers.
To replace the component, reverse the removal procedure. Air baffle To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4.
3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up. o For rack models, extend the server from the rack (on page 28). 5. Remove the access panel ("Access panel" on page 29). 6. Remove the PCI air baffles. To replace the component, reverse the removal procedure. Fan blank To remove the component: 1.
6. Remove the fan blank. To replace the component, reverse the removal procedure. Fan To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. 5.
6. Remove the fan. To replace the component, reverse the removal procedure. Fan cage IMPORTANT: When installing or replacing server components, one or more fans might need to be removed. To prevent an orderly or immediate server shutdown, HP highly recommends powering down the server during these procedures. To determine if powering down is required, see the specific procedure. To remove the component: 1.
7. Remove the fan cage. To replace the component, reverse the removal procedure. Tower feet NOTE: This procedure applies to tower servers only. To remove the component: 1. Open and remove the bezel ("Remove the tower bezel" on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
4. Place the server on the side. 5. Remove the tower feet. To replace the component, reverse the removal procedure. Component box blank To remove the component: 1. For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). 2. For rack models, do the following: a. If installed, remove the security bezel (on page 27). b. Power down the server (on page 26). c. Remove all power: i. Disconnect each power cord from the power source.
ii. Disconnect each power cord from the server d. Remove the access panel ("Access panel" on page 29). e. Remove the rack bezel. 3. Remove the component box blank. To replace the component, reverse the removal procedure. Drive blank To remove the component: 1. 2. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if install, remove the security bezel (on page 27). Remove the drive blank.
WARNING: To reduce the risk of injury from electric shock, do not remove more than one drive carrier at a time. To remove the component: 1. 2. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). Remove the drive. To replace the component, reverse the removal procedure. Optical drive cage To remove the component: 1.
9. Using the T-15 screwdriver, loosen T-15 screws securing the optical drive cage. 10. Remove the optical drive cage. To replace the component, reverse the removal procedure. Optical drive To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a.
b. Disconnect each power cord from the server. 4. For tower models, do the following: a. Place the server on a flat, level surface with the access panel facing up. b. Remove the access panel ("Access panel" on page 29). 5. For rack models, do the following: a. Extend the server from the rack (on page 28). b. Remove the access panel ("Access panel" on page 29). c. Release thumbscrews and remove the rack bezel. 6. Remove the air baffle ("Air baffle" on page 30). 7. Remove the fan cage. 8.
b. Remove the access panel ("Access panel" on page 29). 5. For rack models, do the following: a. Extend the server from the rack (on page 28). b. Remove the access panel ("Access panel" on page 29). c. Release thumbscrews and remove the rack bezel. 6. Remove the air baffle ("Air baffle" on page 30). 7. Remove the fan cage. 8. Remove the front I/O module assembly. To replace the component, reverse the removal procedure. Power supply blank Remove the blank.
Power supply module CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b.
2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up. o For rack models, extend the server from the rack (on page 28). 5. Access the product rear panel. 6. Remove all power supply modules from the power supply cage ("Power supply module" on page 41).
o 8.
o Four-bay power supply backplane board To replace the component, reverse the removal procedure, if the screws are not attached to the backplane assembly, use the screws provided in the spare backplane assembly kit. Expansion board 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a.
7. Open the PCI retainer latch. 8. Remove the expansion board. NOTE: If removing an expansion board from slots 3, 6 or 8, first release the retaining lever on the system board and then remove the card from the system. To replace the component, reverse the removal procedure. Graphic card adapter To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up. o For rack models, extend the server from the rack (on page 28). 5. Remove the access panel ("Access panel" on page 29). 6. Remove the air baffle ("Air baffle" on page 30). 7.
9. Disconnect the cables from the graphic card. 10. Remove the graphic card. To replace the component, reverse the removal procedure. Cache module CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. To remove the component: 1.
2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up. o For rack models, extend the server from the rack (on page 28). 5. Remove the access panel ("Access panel" on page 29). 6. Remove the air baffle ("Air baffle" on page 30). 7.
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server is powered down, wait for 30 seconds and then check the amber LED before disconnecting the cable from the cache module. If the amber LED flashes after 30 seconds, do not disconnect the cable from the cache module.
SFF drive backplane To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. For tower models, do the following: a.
8. Remove the SFF drive cage. 9. Remove all drives from the drive cage ("Drive" on page 36). 10. Loosen the thumbscrew on the drive backplane and remove it from the cage. To replace the component, reverse the removal procedure. LFF drive backplane To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26).
a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. For tower models, do the following: a. Place the server on a flat, level surface with the access panel facing up. b. Remove the access panel ("Access panel" on page 29). 5. For rack models, do the following: a. Extend the server from the rack (on page 28). b. Remove the access panel ("Access panel" on page 29). c. Release thumbscrews and remove the rack bezel. 6.
9. Remove all drives from the drive cage ("Drive" on page 36). 10. Loosen the thumbscrew on the drive backplane and remove it from the cage. To replace the component, reverse the removal procedure. Systems Insight Display assembly CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped. To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
8. Remove the Systems Insight Display assembly. To replace the component, reverse the removal procedure. Heatsink To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4.
7. Open the heatsink retaining levers. 8. Remove the heatsink. To replace the heatsink: 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing.
2. Remove the heatsink protective cover. 3. Install the heatsink, and then close the heatsink retaining levers. 4. Install the air baffle. 5. Install the access panel. 6. Do one of the following: o For tower models, return the server to an upright position, and then install the bezel. o For rack models, slide the server back into the rack. 7. Connect each power cord to the server. 8. Connect each power cord to the power source. 9. Press the Power On/Standby button.
Heatsink Retaining Levers To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4.
8. Remove the heatsink. 9. Remove the heatsink retaining levers. To replace the component, reverse the removal procedure. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.
To remove the component: 1. Do one of the following: o For tower models, open and remove the bezel ("Remove the tower bezel" on page 27). o For rack models, if installed, remove the security bezel (on page 27). 2. Power down the server (on page 26). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up.
8. Remove the heatsink. 9. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
10. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To install a processor: 1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 2. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. CAUTION: Do not press down on the processor.
6. Install the heatsink, and then close the heatsink retaining levers. 7. Install the air baffle. 8. Install the access panel. 9. Do one of the following: o For tower models, return the server to an upright position. o For rack models, slide the server back into the rack. 10. Connect each power cord to the server. 11. Connect each power cord to the power source. 12. Press the Power On/Standby button. The server exits standby mode and applies full power to the system.
b. Disconnect each power cord from the server. 4. Do one of the following: o For tower models, place the server on a flat, level surface with the access panel facing up. o For rack models, extend the server from the rack (on page 28). 5. Remove the access panel ("Access panel" on page 29). 6. Remove the air baffle ("Air baffle" on page 30). 7. Open the DIMM slot latches.. 8. Remove the DIMM. To replace the component, reverse the removal procedure.
6. Remove the air baffle ("Air baffle" on page 30). 7. Remove the fan cage. 8. Remove all DIMMs ("DIMMs" on page 63). 9. Remove any installed PCI cards. 10. Remove the PCI card support bracket on both sides. 11. Disconnect all cables connected to the system board. 12. Open the heatsink retaining levers.
13. Remove the heatsink. 14. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
15. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
To replace the system board: 1. Install the spare system board. 2. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
3. Remove the clear processor socket cover. Retain the processor socket cover for future use. 4. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 6. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 7. Install the processor socket cover onto the processor socket of the failed system board. 8.
10. Install the heatsink, and then close the heatsink retaining levers. 11. Install the processor socket cover onto the processor socket of the failed system board. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 12. Install all components removed from the failed system board. 13. Install the access panel. 14. Do one of the following: o For tower models, return the server to an upright position.
Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6. Enter the serial number and press the Enter key. 7. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Product ID on the chassis. 8. Enter the product ID and press the Enter key. 9.
7. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.
• From within the iLO 4 user interface • From within HP Insight Diagnostics (on page 75) For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant. HP Insight Remote Support software HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement.
Component identification Front panel components • SFF Item Description 1 Media/Drive cage bay 2 SAS/SATA drives (8) 3 Serial number/iLO information pull tab* 4 Optical drive 5 USB connectors (4) *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse side shows the default iLO account information. The same information is printed on a label attached to the chassis.
• LFF Item Description 1 Media/Drive cage bay 2 SAS/SATA drive (6) 3 Serial number/iLO information pull tab* 4 Optical drive 5 USB connectors (4) *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse side shows the default iLO account information. The same information is printed on a label attached to the chassis.
Item Description Status 1 Power On/Standby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* 2 NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 3 Health LED Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec
Item Description 8 PCIe slot 4 (Processor 1) 9 UID button/LED 10 Kensington security lock 11 Serial connector 12 iLO connector 13 NIC connector 3 14 NIC connector 4 15 NIC connector 2 16 NIC connector 1 17 USB connectors (4) 18 Video connector 19 PCIe slot 5 (Processor 2) 20 PCIe slot 6 (Processor 2) 21 PCIe slot 7 (Processor 2) 22 PCIe slot 8 (Processor 2) 23 PCIe slot 9 (Processor 2) Rear panel LEDs Item Description Status 1 NIC activity LED Green or flashing green
Item Description Status 3 Power supply LED Green = Normal Off = One or more of the following conditions exists: • • • • Power Power Power Power is unavailable. supply failed. supply is in standby mode. supply exceeded current limit.
Item Description 13 Internal USB tape connector 14 Discovery service cable connector 15 System battery 16 SATA connectors 17 Internal USB connector 18 Processor 2 DIMM slots 19 TPM connector 20 System maintenance switch 21 NMI header 22 Slot 9 PCIe3 x8 (4, 1) 23 Slot 8 PCIe3 x16 ( 16, 8, 4, 1) 24 Slot 7 PCIe3 x8 (4, 1) 25 Slot 6 PCIe3 x16 (16, 8, 4, 1) 26 Slot 5 PCIe2 x8 (4, 1) 27 Processor 1 DIMM slots 28 Processor socket 1 (populated) System maintenance switch Position D
NMI functionality An NMI crash dump creates a crash dump log before resetting a system which is not responding. Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system.
Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout. Item Description Status 1 Power cap To determine Power cap status, see "Systems Insight Display LED combinations (on page 84)." 2 AMP Status Green = AMP mode enabled Amber = Failover Off = AMP mode disabled 3 DIMM LEDs Amber = DIMM error Off = Normal All other LEDs Amber = Failure Off = Normal IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.
Systems Insight Display Health LED LED and color Processor (amber) Red System power LED Status Amber One or more of the following conditions might exist: • • • • Processor in socket X has failed. Processor X is not installed in the socket. Processor X is unsupported. ROM detects a failed processor during POST Processor (amber) Amber Green Processor in socket X is in a pre-failure condition. DIMM (amber) Red Green One or more DIMMs have failed.
HP recommends that you populate drive bays starting with the lowest SAS or SATA device number. Drives are numbered from left to right in each component box. Component boxes are numbered 1 through 3, from bottom to top.
Hot-plug drive LED definitions Item LED Status 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
Item Description Configuration 1 Fan 1 Redundant (primary fan when processor 2 is installed) 2 Fan 2 Primary 3 Fan 3 Primary 4 Fan 4 Primary FBWC module LEDs (P222, P420, P420i, P421, P822) The FBWC module has three single-color LEDs (one amber and two green). The LEDs on the cache module installed on a storage controller are duplicated on the reverse side of the module to facilitate status viewing.
1 - Amber 2 - Green 3 - Green Interpretation Off Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller. Off Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging. Off Off Flashing 1 Hz The cache module is idle, and the capacitor pack is charging. Off Off On The cache module is idle, and the capacitor pack is charged.
Item Connector Description 2 J9 Drive backplane bay 1/optical drive power connector 3 J5 Drive backplane bay 2 power connector 4 J6 Drive backplane bay 3 power connector 5 J8 Graphic card power connector Component identification 90
Cabling Server data cabling Item Description 1 Optical drive connector 2 Drive cage 1, SAS connector 2 3 Drive cage 1, SAS connector 1 4 SATA connector 5 SAS connector 6 SAS connector Cabling 91
Media device data cabling Item Description 1 Optical drive connector 2 Optical drive connector 3 Optical drive connector 4 SATA connector 5 SATA connector 6 SATA connector Optical drive cabling Cabling 92
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Nonoperating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) Operating, maximum wet bulb 10% to 90% temperature of 28°C (82.4°F) Nonoperating, maximum wet 5% to 95% bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
• HP 460 W Gold Power Supply (92% efficiency) • HP 460 W Platinum Plus Power Supply (94% efficiency) • HP 750 W Gold Power Supply (92% efficiency) • HP 750 W Platinum Plus Power Supply (94% efficiency) • HP 1200 W Platinum Plus Power Supply (94% efficiency) HP 460 W Gold Power Supply (92% efficiency) Specification Value Input requirements — Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 5.5 A at 100 VAC 2.
HP 750 W Gold Power Supply (92% efficiency) Specification Value Input requirements — Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 8.9 A at 100 VAC 4.
Rated input current 10 A at 100 VAC 6.
Acronyms and abbreviations AMP Advanced Memory Protection CS HE HP Common Slot High-Efficiency (power supply) CSR Customer Self Repair FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor LRDIMM load reduced dual in-line memory module NMI nonmaskable interrupt NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe Peripheral Component Interconnect Express Acronyms and abbreviations 97
POST Power-On Self Test PSP HP ProLiant Support Pack RBSU ROM-Based Setup Utility RPS redundant power supply SAS serial attached SCSI SATA serial ATA SFF small form factor SID Systems Insight Display SIM Systems Insight Manager TPM Trusted Platform Module UID unit identification USB universal serial bus Acronyms and abbreviations 98
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Index A access panel 29 air baffle 30 B battery 72 buttons 24, 77 C cables 91 cabling 91, 92 cache module 47 components 15, 77 connectors 77 crash dump analysis 83 D data cabling 91 device bay blank 35 device numbers 85 diagnosing problems 74 diagnostic tools 75 diagnostics utility 75 DIMM slots 83 DIMMs 63 drive LEDs 87 drives, removing 36 E electrostatic discharge 24 environmental requirements 93 error messages 74 expansion board 44 extending server from rack 28 F fan blank 31 fan cage 33 fans 32, 87
optical drive cage 37 utilities 75 P W PCI air baffle 30 POST error messages 74 power LEDs, system 78 power supply blank 40 power supply specifications 93, 94, 95 powering down 26 powering up 26 problem diagnosis 74 processors 58 warnings 25 R rack bezel 26, 27 rear panel components 79 rear panel LEDs 80 S safety considerations 24 safety information 24 security bezel 27 server specifications 93 server warnings and cautions 25 specifications, server 93 static electricity 24 symbols on equipment 24 sys
