HP ProLiant ML570 Generation 4 Server Maintenance and Service Guide Part Number 406863-004 August 2007 (Fourth Edition)
© Copyright 2006, 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows NT are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog ............................................................................................................... 17 Mechanical components.............................................
Power backplane .................................................................................................................................... 62 Battery ................................................................................................................................................... 63 Cabling ..................................................................................................................................... 65 Storage device cabling guidelines .....................
1.44-MB diskette drive specifications ......................................................................................................... 94 CD-ROM drive specifications .................................................................................................................... 95 DVD-ROM drive specifications .................................................................................................................. 96 SAS and SATA hard drive specifications ...............................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair). Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
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Illustrated parts catalog Mechanical components Item Description Assembly part number Spare part number Customer self repair (on page 6) 1 Memory board cage 366257-001 — — 2 Access panel, ProLiant ML570 G3/G4 Server 366264-002 374553-001 Mandatory1 3 Processor cage 364523-001 — — 4 Center wall 366267-001 — — 5 Front fan cage 366251-001 — — Illustrated parts catalog 17
Item Description Assembly part number Spare part number Customer self repair (on page 6) 6 Plastics kit, ProLiant ML570 G3/G4 Server — 374550-001 — a) Processor baffle * 352829-001 — Mandatory1 b) Media bezel 373319-001 — Mandatory1 c) Tower bezel retaining clips * 158475-003 — Mandatory1 d) PCI latch, blue * 228194-002 — Mandatory1 e) Memory board guide * 366262-001 — Mandatory1 f) Memory board guide * 366263-001 — Mandatory1 g) Center wall latch * 366272-001 — Mandator
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation.
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System components Item Description Assembly part number Spare part number Customer self repair (on page 6) 16 Power supply, 910/1300-W 337867-501 406421-001 Mandatory1 17 Power backplane 012079-501 411798-001 No3 18 System board 012840-001 410126-001 No3 19 PPM 399859-001 404182-001 Mandatory1 20 Memory board 012845-001 410127-001 Optional2 21 Processor assembly — — — a) Dual-core 64-bit Intel® Xeon™ Processor 7041 (3.
Item Description Assembly part number Spare part number Customer self repair (on page 6) e) Dual-core 64-bit Intel® Xeon™ Processor 7130M (3.20-GHz, 8-MB L3 cache, 800-MHz FSB) * 433012-001 433597-001 Optional2 f) Dual-core 64-bit Intel® Xeon™ Processor 7140M (3.
Item Description Assembly part number Spare part number Customer self repair (on page 6) d) Power backplane cable, 22-pin 372621-001 — Optional2 Data cable kit * — 374548-001 — a) Fan cable 372616-001 — Optional2 b) Power backplane cable 372617-001 — Optional2 39 Video/USB cable assembly 404959-001 419326-001 Optional2 40 SAS cable kit * 361316-006 389952-001 Mandatory1 41 BBWC cable * 408658-001 409124-001 Mandatory1 AC power cord — — — a) 15-A, 125-V * 178968-001
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt.
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Removal and replacement procedures Required tools You need the following items for some procedures: • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
• Power down the server (on page 28). If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Extend the server from the rack (on page 28). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. WARNING: To reduce the risk of personal injury, be careful when pressing the server railrelease latches and sliding the server into the rack. The sliding rails could pinch your fingers. 5. After performing the installation or maintenance procedure, slide the server into the rack: a. Slide the server fully into the rack. b.
2. Open the bezel. 3. Remove the tower bezel. To replace the component, reverse the removal procedure. Tower cover To remove the component: 1. Power down the server (on page 28). 2. Place the server on a flat, level surface with the access panel down. 3. Remove the two T-15 Torx screws that secure the tower cover to the server.
4. Slide the tower cover toward the rear of the server and pull the cover away from the chassis. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed.
CAUTION: Always populate each media bay with either a device or a blank. Proper airflow can only be maintained when the bays are populated. Unpopulated drive bays can lead to improper cooling and thermal damage. 2. Pull the tape drive blank out of the chassis. To replace the component, reverse the removal procedure. Tape drive To remove the component: 1. Unlock and open the tower bezel (tower servers only) ("Tower bezel" on page 29). 2.
a. Lift and remove the plastic retainer guides from the front of the drive. b. Repeat for the opposite plastic clip. To replace the component, reverse the removal procedure. To install the plastic retainer guides onto the new tape drive, perform the following steps on both sides of the drive. 1. Align and insert a piece of wire into the proper mounting hole of the tape drive. 2. Slide a finger along the wire until the wire seats into the other mounting hole. Rack bezel To remove the component: 1.
o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove the tape drive ("Tape drive" on page 32) or tape drive blank (on page 31). 4. Remove the rack bezel. ("Rack bezel" on page 33) 5. Using the Torx T-15 screwdriver ("Rear panel components" on page 78), remove the three T-15 screws. 6. Press down on the tabs inside the media bay and remove the media bezel. To replace the component, reverse the removal procedure.
2. Push the optical device ejector button to eject the optical device or blank. NOTE: Access to the ejector button is intentionally restricted. Push the ejector button with a T15 Torx screwdriver or a small flat object such as a key or pen to eject the optical device. NOTE: The T-15 Torx screwdriver is shipped with some ProLiant servers and can be located on the rear panel ("Rear panel components" on page 78) or inside the server. To replace the component, slide the component into the bay until it clicks.
2. Remove the hard drive blank. To replace the component, reverse the removal procedure. Hot-plug hard drives CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 85). 2. Back up all server data contained on the hard drive. 3.
To replace the component, reverse the removal procedure. Power supply blank Remove the component as indicated. To replace the component, reverse the removal procedure. Hot-plug power supply CAUTION: If only one power supply is installed, do not remove the power supply unless the server has been powered down. Removing the only operational power supply will cause an immediate power loss. NOTE: To remove the primary hot-plug power supply, remove the shipping screw under the power supply handle.
4. Remove the power supply. To replace the component, reverse the removal procedure. Processor air baffle To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove the access panel. ("Access panel" on page 31) 4. Remove the processor air baffle. To replace the component, reverse the removal procedure.
Hot-plug fans IMPORTANT: Remove and replace one fan at a time. If the system detects two fan failures while in full redundant mode, the server will shut down to avoid thermal damage. When all redundant fans are installed, individual fans can be hot-swapped at any time. To remove the component: 1. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 2. Remove the access panel ("Access panel" on page 31). 3.
5. Remove the fan cage. 6. Remove the fans ("Hot-plug fans" on page 39). To replace the component, reverse the removal procedure. Expansion boards The server supports PCI Express and PCI-X expansion boards. For location, refer to "Rear panel components (on page 78).
2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 29). 3. Remove the access panel. ("Access panel" on page 31) 4. Disconnect any internal or external cables from the expansion board. 5. Release the front retaining clip. 6. Release the rear retaining clip and remove the expansion board. To replace the component, reverse the removal procedure.
2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove the access panel. ("Access panel" on page 31) 4. Remove the processor air baffle. ("Processor air baffle" on page 38) 5. Remove all expansion boards ("Expansion boards" on page 40). 6. Remove the center wall. 7. Remove the fans ("Hot-plug fans" on page 39). To replace the component, reverse the removal procedure.
5. Remove the PPM retaining bracket. To replace the component, reverse the removal procedure. SAS/SATA hard drive cage To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove all hard drives ("Hot-plug hard drives" on page 36) or hard drive blanks ("Hard drive blank" on page 35). 4. Remove the access panel ("Access panel" on page 31). 5.
10. Disconnect all cabling from the SAS backplane. 11. Remove the six T-15 screws and remove the SAS hard drive cage. To replace the component, reverse the removal procedure. SAS/SATA backplane To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: 3. o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28).
4. Remove the access panel ("Access panel" on page 31). 5. Remove the tape drive (on page 32) or tape drive blank (on page 31). 6. If the server is rack mounted, remove the rack bezel ("Rack bezel" on page 33). 7. Remove the media bezel ("Media bezel" on page 33). 8. Remove the processor air baffle ("Processor air baffle" on page 38). 9. Remove the center wall ("Center wall" on page 41). 10. Disconnect all cabling from the SAS backplane. 11. Remove the SAS hard drive cage.
NOTE: The ProLiant ML570 G3/G4 memory board operates at different front-side bus speeds: • In HP ProLiant ML570 Generation 4 Servers, the G3/G4 memory board operates at 800MHz. The HP ProLiant ML570 Generation 4 server only supports 800-MHz processors and the memory board operates at the speed of the supported processors. • In HP ProLiant ML570 Generation 3 Servers, the G3/G4 memory board operates at 667MHz with no performance gain over ProLiant ML570 G3 memory boards.
WARNING: To prevent personal injury from hazardous energy: • Remove watches, rings, or other metal objects. • Use tools with insulated handles. • Do not place tools or metal parts on top of batteries. Removing and installing a memory board (hot-plug) NOTE: The ProLiant ML570 G3/G4 memory board operates at different front-side bus speeds: • In HP ProLiant ML570 Generation 4 Servers, the G3/G4 memory board operates at 800MHz.
6. Remove the memory board and place it on a flat surface. NOTE: While the memory board with the failed or degraded DIMM is being removed, the system continues to read and write from the operational memory board(s). 7. Do one of the following: o Remove a DIMM.
o Install a DIMM. 8. Align the memory board with the memory slot and memory board guide clips. 9. Install the memory board and close the ejector lever. 10. Move the locking switch to the locked position. NOTE: In hot-plug procedures, all LEDs now turn off except the board status LED, which flashes green while the board is rebuilding. This process may take several minutes. 11.
Removing and installing a memory board (non-hot-plug) NOTE: The ProLiant ML570 G3/G4 memory board operates at different front-side bus speeds: • In HP ProLiant ML570 Generation 4 Servers, the G3/G4 memory board operates at 800MHz. The HP ProLiant ML570 Generation 4 server only supports 800-MHz processors and the memory board operates at the speed of the supported processors.
o Remove a DIMM. o Install a DIMM. 9. Align the memory board with the memory slot and the memory board guide clips. 10. Install the memory board into the server and close the ejector lever.
11. Move the locking switch to the locked position. 12. Configure the memory. 13. Install the access panel. 14. Do one of the following: o Install and lock the bezel. o Slide the server back into the rack. Memory board cage To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove the access panel ("Access panel" on page 31). 4.
6. Remove the memory board cage. To replace the component, reverse the removal procedure. Video/USB connector To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). 3. Remove the tape drive ("Tape drive" on page 32) or tape drive blank (on page 31). 4. If the server is rack mounted, remove the rack bezel ("Rack bezel" on page 33). 5.
12. Remove the cable from the clip on the inside wall of the chassis. 13. Use the T-15 Torx screwdriver to remove the screw from the video/USB connector. 14. Lift up and rotate the video connector out of the opening on the front panel. 15. Remove the video/USB cable from the chassis. To replace the component, reverse the removal procedure. Processor The server supports up to four processors.
CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly. CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the processor heatsink for a description of the processor. IMPORTANT: Populate the processors in the following order: 1, 2, 4, 3.
6. Open the processor locking lever. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. 7. Remove the processor assembly. To replace a processor: 1. Update the system ROM from the HP website (http://www.hp.com/support). 2. Align the processor assembly with the processor socket.
CAUTION: To prevent possible server malfunction or damage to the equipment, be sure to completely close the processor locking lever. 5. Close and secure the processor retaining bracket. 6. Remove the PPM retaining bracket ("PPM" on page 58). 7. Install the PPM. IMPORTANT: Always install a PPM when you install a processor. The system fails to boot if the corresponding PPM is missing.
NOTE: The appearance of compatible PPMs may vary. 8. Install the PPM retaining bracket. 9. Install all other components removed while accessing the processor. IMPORTANT: To ensure proper cooling, be sure the processor air baffle is installed at all times (if applicable). 10. Install the processor air baffle. 11. Install the access panel. 12. Slide the server into the rack. 13. Power up the server. PPM The server PPMs provide the proper power to each processor.
3. Remove the access panel ("Access panel" on page 31). 4. Remove the processor air baffle ("Processor air baffle" on page 38). 5. Remove the PPM retaining bracket ("PPM" on page 58). 6. Remove the PPM. To replace the component, reverse the removal procedure. Be sure to align the groove in the PPM with the key in the PPM slot. BBWC battery pack To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: 3.
4. Remove the BBWC battery pack from the controller. To replace the component, reverse the removal procedure. BBWC cache module To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: 3. o Unlock and remove the bezel ("Tower bezel" on page 29). o Extend the server from the rack (on page 28). Remove the access panel ("Access panel" on page 31).
4. Remove the BBWC cache module from the controller. 5. Disconnect the cable from the cache module. CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. To replace the component, reverse the removal procedure. System board To remove the component: 1. Power down the server (on page 28). 2. Do one of the following: o Unlock and remove the bezel ("Tower bezel" on page 29).
13. Remove the system board. To replace the component, reverse the removal procedure. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the System Options menu. 3. Select Serial Number. The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified.
4. Remove the access panel ("Access panel" on page 31). 5. Remove the processor air baffle ("Processor air baffle" on page 38). 6. Remove the front fan cage. ("Front fan cage" on page 39) 7. Remove all expansion boards. ("Expansion boards" on page 40) 8. Remove all memory boards. ("Removing and installing a memory board (hot-plug)" on page 47, "Removing and installing a memory board (non-hot-plug)" on page 50) 9. Remove the center wall. ("Center wall" on page 41) 10.
The battery is located on the system board. To remove the component: 1. Power down the server (on page 28). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 28, "Remove the server from the rack" on page 29). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the PPM retaining bracket ("PPM" on page 58). 5. Remove the battery. To replace the component, reverse the removal procedure. Run RBSU to configure the system after replacing the battery.
Cabling Storage device cabling guidelines CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded (earthed) AC outlet before installing devices. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.
SAS cabling Video connector cabling Cabling 66
Battery-backed write cache cabling Cabling 67
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides simple procedures for resolving common problems as well as a comprehensive course of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance.
ProLiant BL, ML, and DL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these new tools to build an automated server deployment process. Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process.
• Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation). ROMPaq utility The ROMPaq utility enables you to upgrade the system firmware (BIOS) or Lights-Out 100 firmware.
o For Windows®: IML Viewer o For Linux: IML Viewer Application • From within the iLO2 user interface • From within HP Insight Diagnostics (on page 72) For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Integrated Lights-Out 2 technology The iLO2 subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability.
HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.
Port 85 code Description 4xh Port 85 codes in this format indicate memory-related errors. See "Memory-related port 85 codes (on page 74)" for more information. 6xh Port 85 codes in this format indicate expansion board-related errors. See "Expansion board-related port 85 codes (on page 74)" for more information. All other codes, including 00h, 01h, and 5xh Port 85 codes in this range cover several areas. See the section "Miscellaneous port 85 codes (on page 75)" for more information. 3.
Memory-related port 85 codes Memory-related port 85 codes display in the format 4xh. IMPORTANT: Reboot the server after completing each numbered step. If the error condition continues, proceed with the next step. To troubleshoot memory-related error codes: 1. Check the memory LEDs ("Memory board LEDs and components" on page 86) for any identified errors or failed DIMMs, and take corrective action. 2.
IMPORTANT: Processor socket 1 and PPM slot 1 must be populated at all times or the server does not function properly. o PPMs ("PPM" on page 58), except the PPM installed in slot 1 o DIMMs ("Removing and installing a memory board (hot-plug)" on page 47, "Removing and installing a memory board (non-hot-plug)" on page 50), except the first bank o Hard drives ("Hot-plug hard drives" on page 36) o Peripheral devices 3.
Server component identification Front panel components Item Description 1 Drive blank for optional diskette or DVD-ROM drive 2 DVD-ROM drive 3 Video/USB connector 4 USB connector 5 Tape drive blank 6 SAS hard drives Server component identification 76
Front panel LEDs and buttons Item Description Status 1 UID button and LED Blue = Activated Flashing blue = System being managed remotely Off = Deactivated 2 Internal health LED Green = Normal (system on) Flashing amber = System health degraded Flashing red = System health critical 3 External health (power supply) LED Green = Normal (system on) Flashing amber = Redundant power supply failure Flashing red = Power supply failure. No operational power supplies.
Rear panel components Item Description 1 NIC 1 connector 2 NIC 2 connector 3 USB connectors 4 iLO 2 connector 5 Parallel connector 6 PCI-X slot 1, 64-bit/100-MHz 7 PCI-X slot 2, 64-bit/100-MHz 8 PCI-X slot 3, 64-bit/100-MHz 9 PCI-X slot 4, 64-bit/100-MHz 10 PCI Express x4 slot 5 11 PCI Express x4 slot 6 12 PCI Express x4 slot 7 13 PCI Express x4 slot 8 14 PCI Express x4 slot 9 15 PCI Express x4 slot 10 16 Power supply (primary) 17 Power supply blank 18 T-15 Torx screwdr
Rear panel LEDs and buttons Item Description Status 1 UID LED Blue = Activated Flashing blue = System remotely managed Off = Deactivated 2 3 4 NIC activity LED (Integrated NC371i) Green or flashing green = Network activity NIC link LED (Integrated NC371i) Green = Linked to network iLO 2 NIC activity LED Green or flashing green = Network activity Off = No network activity Off = Not linked to network Off = No network activity 5 iLO 2 NIC link LED Green = Linked to network Off = Not linked to
System board components Item Description 1 PCI Express x4 slot 10 2 PCI Express x4 slot 9 3 PCI Express x4 slot 8 4 PCI Express x4 slot 7 5 PCI Express x4 slot 6 6 PCI Express x4 slot 5 7 PCI-X slot 4, 64-bit/100-MHz 8 PCI-X slot 3, 64-bit/100-MHz 9 PCI-X slot 2, 64-bit/100-MHz 10 PCI-X slot 1, 64-bit/100-MHz 11 Memory board slot 1 12 Memory board slot 2 13 Front video/USB connector 14 Memory board slot 3 15 Memory board slot 4 16 PPM slot 1 17 PPM slot 2 18 Systems Ins
Item Description 24 Fan board signal connector 25 Processor socket 3 26 Processor socket 2 27 Fan board signal connector 28 Fan board power connector 29 Processor socket 1 30 Power connector 31 Fan connector 32 Fan connector 33 Power supply signal connector 34 Internal USB connector System maintenance switches The system maintenance switch (SW1) is an eight-position switch that is reserved. The default position for all eight positions is Off.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. NMI functionality An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms. Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications.
System LED and color Internal health LED color Status DIMM failure, slot X (amber) Flashing red • DIMM in slot X has failed. • DIMM has experienced a multi-bit error. DIMM failure, slot X (amber) Flashing amber • DIMM in slot X has reached single-bit correctable error threshold. • DIMM in slot X is in a pre-failure condition. DIMM bank error (all slots in one bank, amber) Flashing red The bank is not populated entirely or DIMMs do not all match within the bank.
Code Component Status 04 Fan board cable(s) Fan board power or signal cables are not installed. 05 Memory board Base memory failure (memory board 1 is not installed or no valid memory configuration is present) 06 SAS backplane power cable SAS backplane or cable is not present 08 System interlock Main system interlock catch-all. Indicates an interlock problem not flagged by codes 01 to 07. t1 Processor 1 unsupported Processor 1 unsupported. Replace with a supported processor.
HP recommends populating hard drive bays starting with the lowest SAS device number. SAS and SATA hard drive LEDs Item Description 1 Fault/ID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternating amber and blue Interpretation The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a management application. On Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. On Off The drive is online, but it is not active currently. Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive.
• The board is removed from the system Item Description Status 1 Release latch — 2 Ejector lever — 3 Locking switch — 4 Removable Green = OK to remove the board Off = Do not remove if the system is on 5 DIMM 1 LED Green = DIMM installed Amber = Failed or degraded DIMM Flashing amber = DIMM configuration error Off = No DIMM installed 6 DIMM 2 LED Green = DIMM installed Amber = Failed or degraded DIMM Flashing amber = DIMM configuration error Off = No DIMM installed 7 DIMM 3 LED Green
Item Description Status 9 DIMM 5 LED Green = DIMM installed Amber = Failed or degraded DIMM Flashing amber = DIMM configuration error Off = No DIMM installed 10 DIMM 6 LED Green = DIMM installed Amber = Failed or degraded DIMM Flashing amber = DIMM configuration error Off = No DIMM installed 11 Online spare LED Green = Online spare mode Amber = Degraded online spare mode Flashing amber = Invalid AMP mode* Off = Not in Online Spare mode 12 Hot-plug mirrored LED Green = Mirrored mode Amber = Deg
LED Advanced ECC memory Online spare memory Hot-plug mirrored memory Hot-plug RAID memory Board status Green Green Green Green DIMM 1 to 6, if populated Green Green Green Green Online spare status Off Green Off Off Mirrored status Off Off Green Off RAID status Off Off Off Green Board removable Off Off Green Green DIMM slots Item Description 1 DIMM slot 1, PC2-3200R 2 DIMM slot 2, PC2-3200R 3 DIMM slot 3, PC2-3200R 4 DIMM slot 4, PC2-3200R 5 DIMM slot 5, PC2-320
Hot-plug power supply LEDs Item Description 1 Power LED (primary power supply) 2 Failure LED (primary power supply) 3 Power LED (redundant power supply) 4 Failure LED (redundant power supply) Power LED (green) Failure LED (amber) Status Off Off No AC power to all power supply units Off On No AC power to this power supply unit only or power supply failure (includes over voltage and over temperature) Flashing Off AC present/Standby outputs on On Off Power supply DC outputs On and OK
Hot-plug fans Item Description Configuration 1 Fan 1 Redundant 2 Fan 2 Primary 3 Fan 3 Redundant 4 Fan 4 Primary 5 Fan 5 Redundant 6 Fan 6 Primary Hot-plug fan LEDs Server component identification 91
Status Green = Operating normally Amber = Failed Off = No power Server component identification 92
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Power supply output Power supply output 910 W (low line) 1300 W (high line) * 100 to 127 VAC is required for 8 A; 200 to 240 VAC is required for 4 A. Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/). DDR SDRAM DIMM specifications NOTE: Use only 512-MB, 1-GB, 2-GB, or 4-GB; 72-bit wide; 2.
Specification Value Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA; Photo CD (single/multiple-session), CD-XA ready; CDi ready Capacity 550 MB (mode 1, 12 cm) 640 MB (mode
Specification Value Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specifications Specification Value Disk formats DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session) Capacity 4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.
Specification Value Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS and SATA hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 60-GB SATA drive Capacity 36,420 MB 73,408 MB 60,022 MB Height 15 mm 15 mm 9 mm Interface SAS SAS Serial ATA Transfer rate 3 GB/sec 3 GB/sec 1.
Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate FSB front side bus iLO 2 Integrated Lights-Out 2 IML Integrated Management Log NIC network interface controller NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express Peripheral Component Interconnect Express Acronyms and abbreviations 98
PCI-X peripheral component interconnect extended POST Power-On Self Test PPM processor power module RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SCSI small computer system interface SDRAM synchronous dynamic RAM SIM Systems Insight Manager UID unit identification USB universal serial bus Acronyms and abbreviations 99
Index A access panel 31 air baffle 38 ASR (Automatic Server Recovery) 71 Automatic Server Recovery (ASR) 71 Autorun menu 68 B backplane, power 62 backplane, SAS 44 batteries, replacing 63 battery 63, 82 battery pack, removing 59 battery-backed write cache enabler cabling 67 bezel, rack 33 bezel, removing 33 bezel, tower 29 BIOS upgrade 70 blanks 31, 34, 35, 37 blue screen event 82 buttons 76 C cables 65 cabling 65, 66, 67 cabling, storage system 65 cache module, removing 60 cautions 27 center wall 41, 42
Integrated Lights-Out (iLO) 71 Integrated Management Log (IML) 70 internal health LED 82, 85 L LED, fan 91 LEDs 76 LEDs, hard drive 85 LEDs, SAS hard drive 85 LEDs, SATA hard drive 85 M management tools 68 mechanical components 17 media bezel 33 media drive 34 media drive blank 34 memory 45 memory board cage 52 memory board LEDs and components 86 memory boards, removing and installing 45 memory dump 82 memory slot LEDs 86 memory-related port 85 codes 74 miscellaneous port 85 codes 75 N NMI switch 82 O O
T tape drive blank 31 tape drives 32 tower bezel, removing 29 tower cover, removing 30 troubleshooting 68 U UID LED 28, 82 USB connectors 53 USB support 72 utilities 68 utilities, deployment 68, 69 V video connector 53, 66, 76 W warnings 27 Index 102
