Technologies for the ProLiant ML570 G3 and ProLiant DL580 G3 Servers Technology Brief

shipment. In the G3 model, the administrator can either remove the center wall (with the fans
installed) as one piece or just remove the half of the center wall that is retaining the VRMs to update
the processor and VRM (Figure 13).
Figure 13. A portion of the center wall (image shown on the left) can be removed (image on the right) to insert additional VRMs
for the processors.
In the design of the ProLiant ML570 G3, care has been taken to remove the possibility of mishaps
when an administrator is required to upgrade or service the server. For instance, the memory modules
use an intuitive locking mechanism to prevent a user from inserting or removing a memory board
when it is in the ‘hot’ or active state. When the administrator needs to add a processor, the heat sink
on the processor has extensions that keep the processor pins from hitting any surfaces and being
inadvertently bent. The power backplane and fan backplane are designed with components only on
the top sides of the boards, to reduce any chance of failures due to components being knocked off or
damaged on the bottom side of the boards. Similarly, for boards that do have components on both
sides, subpans have been added to reduce the risk of damaging bottom-side components.
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