HP ProLiant SL250s Gen8 Server Maintenance and Service Guide Abstract This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
© Copyright 2012, 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 15 Server components .................................................
Troubleshooting .......................................................................................................................... 60 Troubleshooting resources ........................................................................................................................ 60 Diagnostic tools .......................................................................................................................... 61 HP product QuickSpecs.......................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog Server components Item Description 1 Level 2 power boards with brackets 2 Spare part number Customer self repair (on page 5) a) Right node 669753-001 Mandatory1 b) Left node* 669752-001 Mandatory1 Personality boards — a) Right node 669755-001 Mandatory1 Illustrated parts catalog 15
Item Description Spare part number Customer self repair (on page 5) b) Left node* 739873-001 Mandatory1 3 PCA riser x32 669740-001 Mandatory1 4 GPU interposer board 739872-001 Mandatory1 5 Drive backplane board 671914-001 Optional2 6 FlexibleLOM x24 riser board 700573-001 Mandatory1 7 HP SFF, 2.5 inch, hot-plug drive — — SATA solid state drives — — a) 32 GB, 1.
Item Description Spare part number Customer self repair (on page 5) f) 200 GB, MLC solid state drive 657281-001 Mandatory1 g) 400 GB, SLC solid state drive 653962-001 Mandatory1 h) 400 GB, SLC solid state drive 657279-001 Mandatory1 i) 400 GB, MLC solid state drive 653963-001 Mandatory1 j) 400 GB, MLC solid state drive 657282-001 Mandatory1 k) 800 GB, MLC solid state drive 657283-001 Mandatory1 a) 72 GB, 6G, 15,000 rpm, DP ENT drive 653949-001 Mandatory1 b) 146 GB, 10,000 rpm, SP dr
Item Description Spare part number Customer self repair (on page 5) a) 2 GB DIMM, PC3L-10600E, 256 M x8 664694-001 Mandatory1 b) 4 GB DIMM, PC3L-10600R, 256 M x8 664695-001 Mandatory1 c) 4 GB DIMM, PC3L-10600R, 512 M x4 664688-001 Mandatory1 d) 4 GB DIMM, PC3L-12800R, 512 M x4 664689-001 Mandatory1 e) 8 GB DIMM, PC3L-10600R, 512 M x8 664696-001 Mandatory1 f) 8 GB DIMM, PC3L-12800R, 1 G x4 664691-001 Mandatory1 g) 16 GB DIMM, PC3L-10600R, 1 G x4 664692-001 Mandatory1 h) 32 GB DIMM, P
Item Description Spare part number Customer self repair (on page 5) 20 Power capping cable* 708916-001 Mandatory1 21 Hot-plug drive cage Mini-SAS cable, system board* 669746-001 Mandatory1 22 x32 GPU cable* — — a) Left cable 669741-001 Mandatory1 b) Right cable 671912-001 Mandatory1 23 Hot-plug drive cage Mini-SAS cable, storage controller* 680665-001 Mandatory1 24 PCI power cables, rear GPU cage* — — a) Right node 669751-001 Mandatory1 b) Left node 669749-001 Mandatory1
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 61) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
• Remove the server from the chassis (on page 24). If the rack environment, cabling configuration, or the server location in the rack creates unstable conditions, then remove the server from the chassis. • Remove the SFF hot-plug drive cage (on page 25). • Remove the front GPU cage (on page 26). • Remove the interposer board ("Remove the interposer board assembly" on page 26). • Remove the front GPU bracket (on page 27). • Remove the PCI riser cage (on page 27).
c. 4. Use the tray handle to pull the server out of the chassis. Place the server on a flat, level work surface. Remove the SFF hot-plug drive cage 1. Back up all server data on the drive. 2. Power down the server (on page 24). 3. Disconnect all peripheral cables from the server. 4. Remove the server from the chassis (on page 24). 5. Disconnect the drive cables from the drive backplane. 6. Remove the SFF hot-plug drive cage.
Remove the front GPU cage 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage. Remove the interposer board assembly 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the interposer board assembly.
Remove the front GPU bracket 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5. Remove the interposer board assembly (on page 26). 6. Remove the front GPU bracket.
b. Lift the cage to remove it from the tray. Remove the FlexibleLOM riser cage 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the SFF hot-plug drive cage (on page 25). 5. Remove the front GPU cage (on page 26). 6. Remove the interposer board assembly (on page 26). 7. Remove the front GPU bracket (on page 27). 8. Remove the FlexibleLOM riser cage.
Remove the rear GPU cage 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the rear GPU cage. Drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Remove the drive blank. To replace the blank, slide the blank into the bay until it locks into place.
To remove the component: 1. Back up all server data on the drive. 2. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page 71). 3. Remove the drive. To replace the component, reverse the removal procedure. Hot-plug drive cage backplane To remove the component: 1. Back up all server data on the drive. 2. Power down the server (on page 24). 3. Disconnect all peripheral cables from the server. 4. Remove the server from the chassis (on page 24).
To replace the component, reverse the removal procedure. SFF quick-release drive To remove the component: 1. Back up all server data on the drive. 2. Power down the server (on page 24). 3. Disconnect all peripheral cables from the server. 4. Remove the server from the chassis (on page 24). 5. If removing a drive from the front GPU cage, remove the front GPU cage (on page 26). 6. Remove the quick-release drive: a. Slide the drive release latches to the unlocked position. b.
6. Remove the front GPU bracket (on page 27). 7. Remove all drives from the drive cage. 8. Disconnect the drive cage cable assembly: a. Disconnect the quick-release cage Mini-SAS cable from the system board. b. Disconnect the quick-release drive power cables from the personality board. — Front GPU — Rear GPU 9.
• Front GPU • Rear GPU To replace the component, reverse the removal procedure. Level 2 power board To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. If removing from the left node, remove the interposer board ("Remove the interposer board assembly" on page 26). 5. Disconnect both GPU power cables from the level 2 power board.
6. Remove the level 2 power board. To replace the component, reverse the removal procedure. Rear GPU riser board To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the interposer board assembly (on page 26). 5. Remove the rear GPU cage (on page 29). 6. Disconnect the GPU power cables 7. Disconnect the power capping cable from the riser board.
8. Remove the rear GPU riser board. To replace the component, reverse the removal procedure. x32 riser board To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the interposer board assembly (on page 26). 5. Remove the x32 riser board from the interposer board. To replace the component, reverse the removal procedure.
System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
9. Disconnect the capacitor pack cable from the cache module. 10. Remove the cache module: o Cache module on system board o Cache module on storage controller To replace the component, reverse the removal procedure.
FBWC capacitor pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5. Remove the interposer board assembly (on page 26). 6.
To replace the component, reverse the removal procedure. FBWC capacitor pack holder CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4.
To replace the component, reverse the removal procedure. Front GPU/PCI riser board To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5.
5. Remove the interposer board from the metal bracket. To replace the component, reverse the removal procedure. FlexibleLOM riser board To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the SFF hot-plug drive cage (on page 25). 5. Remove the front GPU cage (on page 26). 6. Remove the interposer board assembly (on page 26). 7.
8. Remove the FlexibleLOM riser cage. 9. Remove the FlexibleLOM riser board. To replace the component, reverse the removal procedure. DIMMs To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5. Remove the interposer board assembly (on page 26). 6. Remove the front GPU bracket (on page 27). 7.
8. Remove the DIMM. To replace the component, reverse the removal procedure. Processor air baffle To remove the component: 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5. Remove the interposer board assembly (on page 26). 6. Remove the front GPU bracket (on page 27). 7. Remove the processor air baffle.
To replace the component, reverse the removal procedure. Heatsink To remove the component: CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. 1. Power down the server (on page 24). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 24). 4. Remove the front GPU cage (on page 26). 5. Remove the interposer board assembly (on page 26). 6.
2. Remove the thermal interface protective cover from the heatsink. CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws. 3. Install the heatsink: a. Position the heatsink on the processor backplate. b.
8. Install the server into the chassis. 9. Connect the peripheral cables. 10. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
9. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 10. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
To replace the component: 1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 2. Close the processor retaining bracket.
3. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 4. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 5. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 6. Install the heatsink: a. Position the heatsink on the processor backplate. b.
c. Finish the installation by completely tightening the screws in the same sequence. 7. Install the processor air baffle. 8. Install the front GPU bracket. 9. Install the interposer board assembly. 10. Install the front GPU cage. 11. Install the server into the chassis. 12. Connect the peripheral cables. 13. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. 13. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
14. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. 15. Disconnect all cables from the system board. 16. Remove the failed system board.
To replace the system board: 1. Install the system board. 2. Connect all cables disconnected from the failed system board. 3. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
4. Remove the clear processor socket cover. Retain the processor socket cover for future use. 5. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 7. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 8. Install the processor socket cover on the failed system board. 9.
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws. 11. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c.
After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Service Options. 4. Select Serial Number. The following warning appears: Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6.
9. Remove the failed personality board. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Diagnostic tools HP product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP Product Bulletin website (http://www.hp.com/go/productbulletin).
For more information, see the HP website (http://www.hp.com/go/insightremotesupport). The HP Insight Remote Support Release Notes detail the prerequisites, supported hardware, and associated operating systems. The release notes are available on the HP website (http://www.hp.com/go/insightremotesupport/docs). HP Insight Remote Support is included as part of HP Warranty, HP Care Pack Service, or HP contractual support agreement.
• RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support External USB functionality HP provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures. For additional security, external USB functionality can be disabled through RBSU.
Component identification Front panel components Item Description 1 Hot-plug drive, Box 1 drive 1 2 Hot-plug drive, Box 1 drive 2 3 Option bay 1, PCI riser 4 Hot-plug drive, Box 1 drive 3 5 Hot-plug drive, Box 1 drive 4 6 Option bay 1, FlexibleLOM riser 7 SUV connector 8 Serial connector 9 NIC 1 connector 10 NIC 2 connector 11 iLO 4 connector Component identification 64
Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present* 2 Health LED Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec) = Power fault** 3 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = R
* Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected. ** To identify components in a degraded or critical state, see the iLO/BIOS logs and the server troubleshooting guide.
Rear panel LEDs and buttons Item Description Status 1-2, 4-7, 12-13 System fan LEDs Off = Normal Amber = Fan has failed 3 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 8-11 Power supply LEDs Solid green = Normal Off = One or more of the following conditions exists: • • • • Power Power Power Power is unavailable supply failed supply is in standby mode supply error System board components Component
Item Description 1 Cache module connector 2 PCIe x24 riser connector 3 SATA connector 2 4 SATA connector 1 5 System battery 6 Processor socket 2 7 Processor 2 DIMM slots 8 12-pin system board power connector 9 24-pin RPS connector 10 Processor 1 DIMM slots 11 Processor socket 1 12 Mini-SAS connector 2i 13 Mini-SAS connector 1i 14 microSD card slot 15 Hot-plug drive backplane sideband connector 16 FlexibleLOM x16 riser connector 17 System maintenance switch 18 TPM connect
The arrow points to the front of the server. System maintenance switch Position Default Function S1 Off Off = iLO 4 security is enabled. On = iLO 4 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = No function On = ROM reads system configuration as invalid.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. NMI functionality An NMI crash dump creates a crash dump log before resetting a system which is not responding. Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system.
• Rear SFF drive bay numbers (box 0) Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
Item LED Status Definition Off The drive is not configured by a RAID controller.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
SFF hot-plug drive cage Front quick-release cage • Left node Cabling 74
• Right node Rear quick-release drive cage • Left node Cabling 75
• Right node Front GPU • Left node Item Description 1 Front GPU riser board to L2 power board 2 Front GPU to front GPU riser board Cabling 76
• Right node Item Description 1 Front GPU riser board to L2 power board 2 Front GPU to front GPU riser board Rear GPU Item Description 1 Rear GPU riser board to L2 power board 2 Rear GPU to rear GPU riser board Cabling 77
Mini-SAS cabling SFF hot-plug drive cage Front quick-release drive cage • Left node Cabling 78
• Right node Rear quick-release drive cage • Left node Cabling 79
• Right node FBWC capacitor pack cabling • Left node Cabling 80
• Right node Cabling 81
Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) 130 W CPU option 10°C to 25°C (50°F to 77°F) Relative humidity (noncondensing)** — Operating 10% to 90% Nonoperating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048 m (10,000 ft) is applicable.
Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDR3 double data rate-3 DP dual port (drive connection) ENT enterprise (HP Enterprise drive family) ETY entry (HP Entry drive family) FBWC flash-backed write cache HP SIM HP Systems Insight Manager iLO Integrated Lights-Out IML Integrated Management Log Acronyms and abbreviations 83
LOM LAN on Motherboard MDL midline (HP Midline drive family) MLC multilevel cell (NAND memory type used in SSDs) NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor Acronyms and abbreviations 84
SIM Systems Insight Manager SLAPM SL Advanced Power Manager SLC single level cell (NAND memory type used in SSDs) SPP HP Service Pack for ProLiant SUV serial, USB, video TPM Trusted Platform Module UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus Acronyms and abbreviations 85
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Index A ASR (Automatic Server Recovery) 63 Automatic Server Recovery (ASR) 63 B buttons 22, 64, 66, 67 C cables 73 cabling 73, 76, 80 Care Pack 61 cautions 23 chassis, removing server 24 components 15, 64 components, identification 15, 64, 65, 68 components, system board 67 connectors 64 D diagnosing problems 60 diagnostic tools 61, 63 diagnostics utility 61 DIMMs 43, 68 drive blank 29 drive cage backplane 30 drive cage cable assembly 31 drive LEDs 71 drives 71 E electrostatic discharge 22 environmental
LEDs, troubleshooting 60 LEDs, unit identification (UID) 65, 67 M management tools 61 mechanical components 15 memory 43, 68 N NIC connectors 64 NMI header 67, 70 P PCI riser board 41 PCI riser cage 27 personality board 58 power board 33 power requirements 82 power supply 82 power supply LEDs 67 powering down 24 preparation procedures 23 problem diagnosis 60 processor 47 processor air baffle 44 Q specifications 82 static electricity 22 symbols on equipment 22 system battery 36 system board 51 system bo
