HP Virtual Connect Manager Command Line Interface for c-Class BladeSystem Version 3.30 User Guide

Command line 44
Item Description
Examples
->remove interconnect enc0:2
Removes the interconnect module in bay 2 from the domain
->remove interconnect *
Removes all interconnect modules from the domain that are not present physically
in any enclosure
->remove interconnect enc0:*
Removes all interconnect modules that are not physically present in a specific
enclosure
->remove interconnect *:2
Removes all interconnect modules in a specific bay from the domain that are not
physically present in any enclosure
Item Description
set interconnect
Modify the interconnect module host name setting.
Syntax
set interconnect [-quiet] [<EnclosureID>:<BayNumber>]
[<Hostname=new_hostname>]
Option
quiet
Suppresses user confirmation prompts. This option is useful when scripting
operations.
Properties
EnclosureID
The ID of the enclosure
BayNumber
The Virtual Connect IO bay number
Hostname
A string of characters that cannot be longer than 63 characters and must begin
with an uppercase or lowercase alphabetic character. If the hostname parameter
is set to "DEFAULT", the host name is set to the default VC host name.
Host names beginning with "VCE" are reserved.
Examples
->set interconnect enc0:1 Hostname="DevelopmentNetworks"
Sets the host name of interconnect bay 1 in enclosure enc0 to
DevelopmentNetworks
->set interconnect enc0:2 Hostname="DEFAULT"
Resets the host name of interconnect bay 2 in enclosure enc0 to the factory
default
Item Description
show interconnect
Display all interconnect modules in the domain.
Syntax
show interconnect [<ModuleID>|*]
Parameter
ModuleID (optional)
The ID of the interconnect module. Use “*” to display a detailed view of all
modules in the VC domain. If not specified, a summary output of all modules
appears.
Examples
->show interconnect
Displays a summary of all interconnect modules
->show interconnect *
Displays detailed information for all interconnect modules
->show interconnect *:5
Displays detailed information for all enclosures with interconnect modules in