hp server rx4610 User Guide Version 0501
Notice The information contained in this document is subject to change without notice. Hewlett-Packard makes no warranty of any kind with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. Hewlett-Packard shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.
Contents 1 Controls, Ports, and Indicators ...................................................................... 1 Introduction ........................................................................................................ 1 Front Panel .................................................................................................... 1 Additional Front Panel Controls and Indicators ............................................. 3 Rear View ........................................................
Installing the Floppy Disk Drive ................................................................... 29 Installing the DVD Drive .............................................................................. 30 Connecting External SCSI Devices ............................................................. 32 Removing and Installing the Hard Disk Bay .................................................... 32 Removing the Hard Disk Bay ......................................................................
Boot Priority ................................................................................................. 58 Installing Accessory Boards............................................................................. 58 Installing a Hot Swap PCI Board ................................................................. 58 Installing a Non-Hot Plug PCI Board ........................................................... 60 Removing Accessory Boards................................................................
HP Server rx4610 SEL Data Tables .............................................................. 120 HP Server rx4610 Sensor Codes .............................................................. 121 BIOS Error Codes\Messages ........................................................................ 125 Beep Codes ................................................................................................... 129 Beep Codes and Interpretation..................................................................
Index ..................................................................................................................
Chapter 1: Controls, Ports, and Indicators 1 Controls, Ports, and Indicators Introduction Before operating the Server, familiarize yourself with the HP Server’s controls, ports, and indicators, as shown in Figures 1-1 through 1-8. Front Panel The front panel of the HP Server provides the controls and indicators commonly used when operating the HP Server. POW ER R ES E T IN T S YS PW R PWR FA N GEN L C D D IS P L AY PWR A CT IVE FA IL PWR A CT IVE FA IL Figure 1-1.
Chapter 1: Controls, Ports, and Indicators Table 1-1. Control Panel Switch and Indicators Control / Indicator Description Power On/Off This button turns the HP Server power On or Off. The +12 V standby voltage is On whenever the server power cords are plugged in. Reset When pressed, it resets the server and causes the power on self-test (POST) to run. INIT When pressed, the system performs a crash dump provided the dump is supported by the operating system.
Chapter 1: Controls, Ports, and Indicators Additional Front Panel Controls and Indicators The input and storage devices provide additional front panel controls and indicators, which give control and operational status to the respective device. DVD Drive The server supports a slimline IDE DVD drive. This peripheral mounts directly above the top-left power bay on the front of the chassis. The drive is mounted on a removable tray that facilitates system assembly and service.
Chapter 1: Controls, Ports, and Indicators Diskette Floppy Drive The server supports a slimline IDE diskette drive for 1.44 MB and 120 MB media. This half-inch slimline peripheral mounts directly above the top-right power bay on the front of the chassis. The drive is mounted on a removable tray that facilitates system assembly and service. Activity LED P OWE R RE SE T INT S YS P WR PWR FA N Ejector Button GE N LCD DISPLAY P WR A CTIV E FA IL P WR A CTIV E FA IL Figure 1-3. Drive Table 1-3.
Chapter 1: Controls, Ports, and Indicators SCSI Hard Drives The server supports up to two hot-swap drive carriers containing standard 1-inch high by 3.5-inchwide LVDS SCSI hard drives. As part of the hot-swap implementation, drive carriers with integral heat sinks house the drives. Each drive is mounted in a carrier with four fasteners and the carrier snaps into the hard drive bay.
Chapter 1: Controls, Ports, and Indicators Power Supplies The chassis can be configured with three to four power supplies. Each power supply has a dual rating of 800W minimum over an input range of 180-264VAC and 700W minimum over an input range of 90-132VAC. Each supply is designed to minimize EMI and RFI. Each power supply also has selfcontained fans for cooling.
Chapter 1: Controls, Ports, and Indicators Rear View The ports and connectors at the rear are listed below and shown in Figure 1-6. Figure 1-6 provides a detailed view of the Legacy I/O panel that resides in the upper-right corner of the rear panel. • The power connector accepts a standard power cable to connect the HP Server with the site power supply. • Ten PCI add-in board expansion slots are available. Eight are hot plug and two are non-hot plug. • Each hot plug PCI has status LEDs.
Chapter 1: Controls, Ports, and Indicators Legacy I/O Panel This board contains all legacy I/O connections and plugs into an edge connector on the I/O baseboard. NOTE The keyboard and mouse connector must be plugged into the correct ports or the server will not boot.
Chapter 1: Controls, Ports, and Indicators PCI LEDs Each PCI slot has four indicator LEDs: two on the outside and two on the inside of the system. The two LEDs for each slot: one amber and one green are visible from the rear (also inside) of the HP Server, as shown in Figure 1-7. Eight of the ten PCI slots can be individually powered down through the respective NOS or supported GUI utility, without powering down the entire HP Server, if the board has a Hot Plug compliant driver.
Chapter 1: Controls, Ports, and Indicators Applying Power to the HP Server Before applying power to the HP Server, verify that the keyboard and mouse are connected to the proper ports. The server will not boot without these devices. Turning on the monitor prior to powering on the HP Server allows proper auto-configuration of the video output as it boots.
Chapter 1: Controls, Ports, and Indicators 2. Logoff and exit the operating system. The following prompt appears: Shell> 3. At the Shell> prompt, press and hold the Power button for several seconds. Holding the Power button in for several seconds will power down the server. 4. Disconnect the power cords from the power source. Normally this completes the power-down procedure.
2 Opening and Closing the HP Server Introduction This chapter describes how to remove and replace the front bezel and the HP Server's main cover. Mounting the Front Bezel The front handles, if not already installed on the HP Server, should be attached to the front of the HP Server before mounting the bezel. 1. Place the handles into the slots on the front of the HP Server on each edge, as shown in the figure below. 2.
Chapter 2: Opening and Closing the HP Server Figure 2-1.
Chapter 2: Opening and Closing the HP Server Removing and Replacing the HP Server’s Main Cover The server comes with a removable top cover. Removal of this cover is necessary when installing or removing many components. You do not have to remove the top cover when removing or installing PCI hot plug and non-hot plug adapter boards, the Legacy I/O board, fans, hard drives, power supplies, or components inside the Processor/Memory Complex.
Chapter 2: Opening and Closing the HP Server cover in this direction disengages the hooks on both sides of the top cover from the chassis housing. Figure 2-2. Removing the Cover 9. Lift the top cover off the chassis. Replacing the Top Cover To replace the cover, complete these steps: 1. Provide ESD protection by wearing an antistatic wrist strap attached to chassis ground of the system when handling components. 2.
Chapter 2: Opening and Closing the HP Server Figure 2-3. Replacing the Cover 7. Close the 120 mm fan cover and tighten the thumbscrew. If the door does not close then the top cover hooks have not fully engaged into the chassis. 8. Replace the PCI adapter board cover and install the screw that secures it to the top cover. 9. Close the rear half of the top cover and tighten the two thumbscrews. 10. Push the chassis back into the rack. 11.
3 Installing Fans and Power Supplies Introduction The fans and power supplies used by the HP Server are hot swappable. The HP Server has four 172 mm fans located on each side of the chassis and two 120 mm cooling fans located on the top front of the chassis. The server has a maximum of four 800 watt autoranging power supplies located in the front of the chassis. This chapter describes the procedures necessary to remove and to replace these components.
Chapter 3: Installing Fans and Power Supplies Hot Swapping the 172 mm Fans The four 172 mm cooling fans are mounted in pairs on each side of the chassis. You can hot-swap these fans without turning the server system power off. Each fan uses an amber LED located on the fan’s casing to indicate the fan has failed. If it is a failed fan, the amber LED will be illuminated on the front panel, and the amber LED on the failed fan itself will be illuminated.
Chapter 3: Installing Fans and Power Supplies Installing the 172 mm Fans To install the 172 mm fan, complete the following procedure: 1. Lift the latch on the fan-access door and open the door. NOTE Verify the connector orientation prior to installing the new fan. 2. Slide the new fan into place with the connector oriented to engage the socket inside of the fan enclosure. 3. Push the fan assembly firmly into the enclosure to seat the connector. 4.
Chapter 3: Installing Fans and Power Supplies Figure 3-2. Removing the 120 mm Fans Installing the 120 mm Fans Follow these steps to install a 120 mm fan: 1. Slide the server out of the rack far enough to expose the fan-access door on the top of the chassis. 2. Unscrew the thumbscrew on the front of the fan-access door and lift the door open. 3. Slide the new fan into place, with the connector oriented to engage the socket inside of the fan enclosure. 4.
Chapter 3: Installing Fans and Power Supplies Hot Swapping Power Supplies The power system contains four 800-watt autoranging power supplies. The third bay’s power supply from the left as you face the chassis serves a redundancy function for the server’s power supply requirements. CAUTION Because of chassis airflow disruption, the power supply bay should not be vacant for more than five minutes when server power is on.
Chapter 3: Installing Fans and Power Supplies Determining Power Supply Status When the amber power supply failure LED on the front of the chassis turns on, determine which power supply is defective by checking the three status LEDs on each supply. Each power supply has three LEDs that both indicate whether power is supplied to the power supply and the health of the power supply. The LEDs are ordered top to bottom on each power supply. Table 3-1 illustrates the states indicated by the three LEDs. Table 3-1.
Chapter 3: Installing Fans and Power Supplies Removing a Power Supply To remove a power supply, complete the following procedure: 1. Locate the power supply you want to remove. 2. Push the thumb latch to unlock the power supply handle and pull the handle down to undock the supply. CAUTION Any unused power supply slots must be covered with a blanking plug. Uncovered slots can disrupt the air flow used for cooling the system. Figure 3-4. Removing a Power Supply 3.
Chapter 3: Installing Fans and Power Supplies Installing a Power Supply The power supply bay should not be vacant for more than five minutes when server power is on. Disruption of the airflow may cause system cooling to fall below acceptable levels. To install the new power supply, complete the following procedure: 1. Remove the new power supply from the protective packaging, and place it on an antistatic surface. 2. Record the model and serial numbers of the power supply in your equipment log. 3.
4 Installing Mass Storage Devices Introduction The HP Server comes standard with a DVD and a floppy diskette drive. The internal mass storage cages support a maximum of two hot swap drive carriers. Each carrier can house a standard one inch high by three and half inch wide SCSI-2 or SCSI-3 hard drive. The internal SCSI drives are mounted to the carriers using four screws. Mass Storage Guidelines • General Guidelines Use care when unpacking and handling the SCSI disk drives.
Chapter 4: Installing Mass Storage Devices 4. PS 5. Other Boot Devices IDE DVD drive Flexible disk drive 6. PCI slot 1 7. PCI slot 2 8. PCI slot 3 9. PCI slot 4 10. PCI slot 5 11. PCI slot 6 12. PCI slot 7 13. PCI slot 8 14. PCI slot 9 15. PCI slot 10 The SCSI controller chip interfaces the PCI bus to two Ultra3 SCSI buses and contains an onboard RISC processor.
Chapter 4: Installing Mass Storage Devices from the factory. The procedures in this section describe how to determine drive status, remove a faulty drive, and install a new drive. Determining Drive Status Status LEDs arranged in sets of three over each of the two Hard Disk Bays monitor the status of each drive. Table 4-1.
Chapter 4: Installing Mass Storage Devices Figure 4-1. Removing a Hard Disk Drive 4. Carefully slide the assembly out of the bay, and place it on an antistatic surface. Installing a Hard Disk Drive Hard disk drives are packaged in their drive carriers for immediate installation. They require no assembly and may be installed without the use of any tools. To install the hard disk drive, complete the following procedure: 1. Remove the plastic bezel on the front of the server. 2.
Chapter 4: Installing Mass Storage Devices Figure 4-2 Hot Swapping a SCSI Drive 4. Replace the plastic bezel on the front of the server. Installing Non-Hot Swap Drives The HP Server supports a slimline IDE diskette drive for 1.44 MB and 120 MB media and a DVD drive. Both drives are part of the standard configuration and mount directly above the power bays on the front of the chassis. The drives are mounted on removable trays that facilitate system assembly and service.
Chapter 4: Installing Mass Storage Devices 3. Disconnect the drive’s data and power cables from cable adapter PCB at the rear of the drive. 4. Loosen the thumbscrew found at the rear of the drive carrier assembly. 5. Slide the drive and the drive carrier assembly toward the rear of the chassis so that the front part of the drive clears the opening in the chassis. 6. Remove the drive carrier assembly with the drive in it from the chassis. 7.
Chapter 4: Installing Mass Storage Devices Removing the DVD Drive To remove the DVD drive, complete the following procedure: 1. Observe the safety and ESD precautions at the beginning of this chapter. 2. Remove the top cover as described in “Removing and Replacing the HP Server’s Main Cover” in Chapter 2. 3. Disconnect the drive’s data and power cables from the drive cable adapter PCB at the rear of the drive. 4. Loosen the thumbscrew found at the rear of the drive carrier assembly. 5.
Chapter 4: Installing Mass Storage Devices 7. Install the top cover as described in “Removing and Replacing the HP Server’s Main Cover” in Chapter 2. Connecting External SCSI Devices The second SCSI channel B is connected directly to the external VHD (Very High Density) 68-pin SCSI connector on the rear panel. All external SCSI devices are connected to the HP Server using this external connector, but the external SCSI devices must provide the necessary termination at the end of the SCSI chain.
Chapter 4: Installing Mass Storage Devices Installing the Hard Disk Bay To install the Hard Disk Bay, complete the following steps: 1. Turn off the system by using the power on/off switch on the front of the chassis and remove both AC power cords. 2. If the front bezel is not already removed, remove the bezel. 3. Align the Hard Disk Bay such that the connector side is facing into the chassis and push the bay into the front of the chassis. 4.
Chapter 4: Installing Mass Storage Devices Removing and Installing the SCSI Backplane The SCSI Backplane resides on the back of the Hard Drive Bay. It is accessed by removing the Hard Disk Bay. Removing the SCSI Backplane To remove the SCSI Backplane, complete the following steps: 1. Remove the Hard Disk Bay as described in “Removing the Hard Disk Bay” earlier in this chapter. 2. Disconnect the LCD panel cable from the SCSI Backplane. 3. Remove the cap stabilizer retaining screw and the cap stabilizer.
Chapter 4: Installing Mass Storage Devices Installing the Front Panel Board The Front Panel Board displays server information. The module is attached to the front of the Hard Disk Bay, which must first be removed to gain access to the Front Panel Board. Removing the Front Panel Module To remove the Front Panel module, complete the following procedure: 1. Turn off the system by using the power on/off switch on the front of the chassis and remove both AC power cords. 2.
5 Installing Additional Memory Introduction This chapter provides the procedures for opening the Processor/Memory Complex, installing a memory board, installing DIMMs, and installing memory board DC-to-DC converters. Tools Required Use an anti-static service kit (3M 8501/8502/8503 or equivalent). This kit includes a static-dissipating work surface, a chassis clip lead, and a wrist strap. Memory Installation Guidelines Each Memory Board can support from 1 GB to 32 GB.
Chapter 5: Installing Additional Memory Removing the Processor/Memory Complex The Processor/Memory Complex mounts memory boards to the processor board and forms a module that you can remove from the main system chassis. To access this module, you need to remove the access door on the side of the chassis and remove the four screws on the left side of the chassis to slide the Processor/Memory Complex out of the system. 1. If the system is already installed and working, power down the system.
Chapter 5: Installing Additional Memory 8. Rotate the two extraction levers on the sides of the module to eject it from the Sideplane board connector. Figure 5-2. Removing the Processor/Memory Complex WARNING Fully loaded, the Processor/Memory Complex weighs 36 pounds (16.33 kg). Minimally configured, this complex weighs 24 pounds (10.80 kg). Exercise caution when lifting the complex out of the system. 9. Remove the complex from the bay and place it on a clean ESD protected surface.
Chapter 5: Installing Additional Memory Figure 5-3. Memory Board DC-DC Converters Removing and Installing Memory Boards Two Memory Boards reside in the Processor/Memory Complex: one is on top of the complex and the other underneath. You can remove or install these memory boards. Removing Memory Boards Two memory boards exist, one plugged in to each side of the processor board (the top and the underside of the Processor/Memory Complex).
Chapter 5: Installing Additional Memory 9. Place the memory board on a clean ESD-protected surface. Figure 5-4. Memory Boards Installing Memory Boards Two memory boards exist, one plugged into each side of the Processor Baseboard (the top and the underside of the Processor/Memory Complex). This procedure describes the installation process for either memory board. To re-install the memory board or install a new board, complete the following procedure: 1. Observe all safety and ESD precautions. 2.
Chapter 5: Installing Additional Memory 6. Tighten the two captive screws at the end of the extraction handle. 7. Place the two board clamps along the sides of the memory board such that the screws align with their respective holes. 8. Secure the two board clamps with the two board clamp screws. 9. Place the bracket with the thumbscrew that locks the extraction lever over the extraction levers and tighten the screw. 10.
Chapter 5: Installing Additional Memory Installing and Removing DIMMs The BIOS automatically detects, sizes, and initializes the memory array, depending on the type, size, and speed of the installed DIMMs. It reports the memory size and allocation to the system through the configuration registers. DIMMs reside in the Processor/Memory Complex and are accessible inside the server chassis.
Chapter 5: Installing Additional Memory 1 2 DIMM 1 DIMM 2 DIMM 5 DIMM 6 DIMM 9 DIMM 10 DIMM 17 DIMM 18 DIMM 25 DIMM 26 DIMM DIMM DIMM DIMM DIMM DIMM DIMM 32 DIMM 31 DIMM 28 DIMM 27 DIMM 24 DIMM 23 DIMM 16 DIMM 15 DIMM 8 DIMM 7 DIMM 20 DIMM 19 DIMM 12 DIMM 11 DIMM 4 DIMM 3 13 14 21 22 29 30 4 3 Figure 5-5. DIMM Installation Sequence 7. Insert the bottom edge of the DIMM into the socket and press down firmly until the DIMM is seated correctly. 8.
Chapter 5: Installing Additional Memory Removing DIMMs You may need to remove a DIMM module to downsize your memory configuration or to replace a defective DIMM. 1. If the system is already installed and working, power down the system. Refer to Chapter 1, "Controls, Ports, and Indicators." WARNING The power supply will continue to provide standby current to the HP Server until the power cable is disconnected. 2. Disconnect the power cables and all external cables.
Chapter 5: Installing Additional Memory Figure 5-6. Memory Board DC-to-DC Converters Installing the Processor/Memory Complex To replace the Processor/Memory Complex, complete the following procedure: 1. Orient the Processor/Memory Complex so that the high density connector is positioned to slide into the Processor/Memory Bay and connect to the Sideplane board. 2. With the two extraction levers on the top and pointed towards you, slide the Complex into the bay. 3.
Chapter 6: Installing an Additional Processor 6 Installing an Additional Processor Introduction Each processor is packaged in a Slot M pin array cartridge. Depending on the configuration, your system has two to four processors. Each processor is powered by a 48V power pod, located adjacent to the processor on the processor board. Attached to the top of each processor is a heat sink that dissipates thermal energy.
Chapter 6: Installing an Additional Processor Figure 6-1. System Board Set Removing the CPU Thermal Dummy CPU thermal dummies must be installed where a processor is absent to properly direct cooling airflow. Therefore, the CPU thermal dummy must be removed before installing an additional processor. Complete the following procedure to remove the CPU thermal dummy: 1. Observe the safety and ESD precautions at the beginning of this chapter. 2.
Chapter 6: Installing an Additional Processor Installing an Additional Processor This section provides the instructions for installing an additional processor. If only two processors are to reside in the server, both processors must reside on the top half of the Processor/Memory Complex. CAUTION The processor is sensitive to static electricity and can be easily damaged by improper handling.
Chapter 6: Installing an Additional Processor Figure 6-2. Installing the Microprocessor 10. Place the power pod into position on the Processor Baseboard. Ensure that the engaging tab is to the rear of the retention module (RM) and then slide it forward to engage its connector on the processor. Figure 6-3.
Chapter 6: Installing an Additional Processor 11. Place the triple beam into position by lowering it down over the processors/power pod or the CPU thermal dummy. 12. Connect the Y-cable to each power pod. Figure 6-4. Placing the Triple Beam Over the Processors 13. Secure the triple beam into place by tightening the top captive screws and then the four thumbscrews on the end of the beam. 14.
Chapter 6: Installing an Additional Processor Removing a Processor Use this procedure to remove a processor and its heatsink. The heatsink is attached to the back of the processor. If a processor is not replaced, a CPU thermal dummy must fill the slot to ensure proper cooling of the unit. CAUTION Always wear a wrist-strap and use a static-dissipating work surface connected to the chassis when handling components. Ensure the metal of the wrist strap contacts your skin.
Chapter 6: Installing an Additional Processor Installing a CPU Thermal Dummy CPU thermal dummies must be installed where a processor is absent to properly direct cooling airflow. Complete the following procedure to install a CPU thermal dummy: Observe the safety and ESD precautions at the beginning of this chapter. If you are installing a CPU thermal dummy, position the blank into place over the four posts on the Processor Baseboard. Figure 6-5. Inserting a CPU Thermal Dummy 2.
Chapter 6: Installing an Additional Processor Removing the Processor Baseboard To remove the processor baseboard, complete the following procedure. 1. Observe the safety and ESD precautions at the beginning of this chapter. 2. Remove the Processor/Memory Complex from the system as described in “Removing the Processor/Memory Complex” in Chapter 5. 3. Remove the topside memory board from the Processor/Memory Complex as described in “Removing and Installing Memory Boards” in Chapter 5. Figure 6-6.
Chapter 6: Installing an Additional Processor Installing the Board in a System with Three or Four Microprocessors When installing a board that contains three or four microprocessors, complete the following procedure: 1. Place the bottom half of the Processor/Memory Complex on a clean ESD-protected work surface. The bottom half of the complex has wider rails as compared to the top half. Be sure that the rail side of the complex is in contact with the work surface. 2.
Chapter 6: Installing an Additional Processor Figure 6-7. The Triple Beam 16. Install the processors and power pods into the bottom half of the Processor/Memory Complex as described in “Installing an Additional Processor” in Chapter 6. 17. Install the triple beam and the metal baffle. 18. Install the memory board into the bottom half of the Processor/Memory Complex as described in “Removing and Installing Memory Boards” in Chapter 5. 19.
Chapter 6: Installing an Additional Processor 7. Install the CPU thermal dummies into the bottom half of the Processor/Memory Complex as described in “Installing a CPU Thermal Dummy” in Chapter 6. 8. Install the memory board into the bottom half of the Processor/Memory Complex as described in “Removing and Installing Memory Boards” in Chapter 5. 9. Install the triple beam and metal baffle. 10. Carefully turn the Processor/Memory Complex over so that you can work on the topside. 11.
Chapter 7: Installing Accessory Boards 7 Installing Accessory Boards Introduction The HP Server has ten I/O expansion slots available. PCI slots P1-P2 are 64-bit/33 MHz non-Hot Plug I/O expansion slots. PCI slots P3-P10 are 64-bit/66 MHz PCI Hot Plug I/O expansion slots . The PCI expansion slots are contained in four PCI segments: • F16, 0 provides for PCI slots 1 and 2, video, and the PXB that controls the Super I/O functions.
Chapter 7: Installing Accessory Boards Boot Priority The Server’s boot priority (BIOS search order for a boot drive) should be considered when selecting a PCI slot on the system board. This is especially important if you are installing a board that requires an early number in the boot order. The board's boot priority is set by its slot location in the boot order. See Figure 7-3. The embedded SCSI controller consists of two channels, A and B. Channel A is typically used to control the internal SCSI drives.
Chapter 7: Installing Accessory Boards the system. The LEDs operate differently depending upon the operating system installed. Please refer to your operating system’s manual. To install a hot swap hot plug PCI I/O board, complete the following steps: 1. If your server is operating, use your operating system or GUI application to make sure the PCI slot that you are installing the board into is powered down.
Chapter 7: Installing Accessory Boards Figure 7-2. Open the PCI PHP Mechanism Securing the Board at the Rear of the Chassis 10. If you are adding a new board, remove the perforated rear panel cover in the slot you’re using by pushing it out from inside the chassis. 11. Press the PCI board down firmly until it seats in its slot.
Chapter 7: Installing Accessory Boards Refer to Chapter 1, "Controls, Ports, and Indicators." WARNING The power supply will continue to provide standby current to the HP Server until the power cable is disconnected. 2. Disconnect the power cables and any external cables connected to the HP Server. If necessary, label each one to expedite re-assembly. WARNING Make sure that the rack is anchored securely, so it will not tip when the server chassis is extended. 3. Pull the chassis out of the rack.
Chapter 7: Installing Accessory Boards 7. Lift the rear cover to expose the non-hot plug PCI adapter board cover. 8. Loosen the screw that secures the non-hot plug PCI adapter board cover. 9. Grasp the cover by its exposed, long side and lift the cover over the non-hot plug boards away from the chassis. You can completely remove the cover if you want by unseating the slot hinge. Access is now available to the two non-hot plug PCI slots and the Legacy I/O board. Figure 7-4.
Chapter 7: Installing Accessory Boards 19. Attach any cables to the PCI adapter board you just installed. 20. Close the rear part of the top cover and tighten the two thumbscrews. 21. Attach the power cords. 22. Push the system back into place into the equipment rack. 23. Power on any attached peripheral devices. 24. Power on the system. 25. Once the accessory board is installed, you may need to install software drivers.
Chapter 7: Installing Accessory Boards 11. Press the center of the rocker switch that secures the end of the board nearest the rear of the chassis. When the mechanism clicks open, rotate it all the way down from the outside of the chassis. 12. Carefully grasp the adapter board and gently slide it up and out of the system. Be sure not to allow the board’s components to touch any neighboring boards as you lift the board out of the system. 13.
Chapter 8: Server Management 8 Server Management Boards Introduction The server management features are implemented using three microcontrollers: the Baseboard Management Controller (BMC), the Intelligent Chassis Management Bus Controller (ICMB) controller on the Legacy I/O board, and the Hot-Swap Controller (HSC) on the Power Distribution Board (T-Docking). The firmware of the three microcontrollers is field upgradeable using the Firmware Update utility.
Chapter 8: Server Management • Processor presence monitoring • Speaker ‘Beep’ capability on standby and when system is powered up • Itanium processor SEEPROM interface • Processor temperature monitoring • Hot plug PCI slot status monitoring • Processor bus speed setting • Chassis fan failure light control • Chassis power fault light control • Chassis power light control • SDR/SEL timestamp clock • Boardset FRU information interface • Fault Resilient Booting (FRB) • System management watchdog timer • Front
Chapter 8: Server Management • Provides a path for management information via SCSI • Retrieves drive fault status, Backplane temperature, and fan failure information via IPMB • Queries the status of the power distribution board by retrieving information from the BMC via the IPMB • Controls drive power-on and power-down, facilitating hot-swapping.
Chapter 8: Server Management I/O Baseboard The I/O Baseboard resides in the upper rear of the chassis and plugs into the Sideplane. After removing all the PCI I/O boards, you can remove the I/O Baseboard. Removing the I/O Baseboard To remove the I/O baseboard, complete the following procedure: 1. Observe all safety and ESD precautions for handling electronic components.
Chapter 8: Server Management 12. Remove all DC-DC converters from the Sideplane. Figure 8-2. Removing the Sideplane DC-DC Converters 13. Loosen the two captive screws that hold the plastic shield over the I/O Baseboard. These screws also secure the baseboard tray to the server chassis. 14. Remove the PCI LED cable. 15. Remove the plastic shield. 16. Remove the Internal SCSI cable for the hard drives from the board. 17.
Chapter 8: Server Management 21. Remove the nine screws and the two hex jackscrews that secure the video connector to the I/O Baseboard in order to separate it from the I/O Baseboard tray. Installing the I/O Baseboard To install the I/O Baseboard, complete the following procedure: 1. Observe all safety and ESD precautions for handling electronic components. 2. Install the I/O Baseboard into the I/O Baseboard tray. 3.
Chapter 8: Server Management Sideplane Board The Sideplane is attached inside the left wall at the rear of the chassis. It receives the I/O Baseboard as well as the Power Distribution Board (T-Docking). To remove the Sideplane you must remove the Power Distribution Board (T-Docking), the I/O Baseboard, and the Processor/Memory Complex. Removing the Sideplane Board To remove the Sideplane board, complete the following procedure: 1. Observe all safety and ESD precautions for handling electronic components.
Chapter 8: Server Management 7. Tilt the Sideplane up and out of the chassis. 8. Remove the two retaining screws from the Sideplane to remove the mounting plate. Figure 8-5. Remove the Sideplane Installing the Sideplane Board To install the Sideplane board, complete the following steps: 1. Observe all safety and ESD precautions for handling electronic components. 2. Install the Sideplane on to the mounting plate by tightening the two mounting plate screws. 3.
Chapter 8: Server Management WARNING Make sure that the rack is anchored securely, so it will not tip when the server chassis is extended. 4. Pull the chassis out of the rack as far as it will go. 5. Loosen the two thumbscrews in the back of the chassis that secure the rear cover. 6. Lift the rear cover to expose the non-hot plug PCI adapter board cover. 7. Loosen the screw that secures the non-hot plug PCI adapter board cover. 8.
Chapter 8: Server Management Legacy I/O Board The Legacy I/O Board is plugged into the I/O Baseboard in the rear of the chassis. It is accessible only when you remove or lift the non-hot plug PCI adapter board cover. Removing the Legacy I/O Board To remove the Legacy I/O Board, complete the following procedure: 1. Observe all safety and ESD precautions for handling electronic components. 2. Turn off all peripheral devices connected to the system. 3.
Chapter 8: Server Management Server Management Cable DVD Cable Floppy Disk Drive Cable Figure 8-6. Removing Legacy I/O Board 14. Remove both IDE cables (DVD and Floppy Disk Drive) from the Legacy I/O board by grasping the ends of the cable connectors and rocking them out of their respective connectors. 15. Carefully lay the board component side up on an antistatic work surface or inside proper packaging.
Chapter 8: Server Management 8. Close the plastic latching mechanism that secures the end of the board nearest the front of the chassis. 9. Install the non-hot plug PCI adapter board cover by aligning the slotted hinge into the chassis housing, closing the cover, and securing the cover screw. 10. Close the rear part of the top cover and secure it by tightening the two thumbscrews in the back. 11. Attach any peripherals to the rear panel of the Legacy I/O board. 12. Install the power cords to the system.
Chapter 8: Server Management Changing the Legacy I/O Board Battery The lithium battery on the Legacy I/O board powers the real-time clock (RTC) for three to four years in the absence of power. When the battery weakens, it loses voltage and the system settings stored in CMOS RAM in the Real Time Clock (such as the date and time) can be wrong. Contact your customer service representative or dealer for a list of approved devices. WARNING There is a danger of explosion if the battery is incorrectly replaced.
Chapter 8: Server Management Power Distribution Board (T-Docking) The Power Distribution Board (T-Docking) resides in the upper front half of the chassis above the 172 mm fans. You can access it by removing the top cover of the chassis and removing the Hard Drive Bay. Removing the Power Distribution Board (T-Docking) 1. Observe all safety and ESD precautions for handling electronic components. 2. Turn off all peripheral devices connected to the system. 3.
Chapter 8: Server Management Figure 8-7. Removing the Power Distribution Board (T-Docking)’s Top Bracket 10. Remove the 12 V DC-DC converter from the top of the Power Distribution Board (TDocking). 11. Remove the fan, DVD, and floppy drive cable power connector from the Power Distribution Board by squeezing the lock tab and carefully pulling the connector upwards. 12. Loosen the two top captive screws from the AC Power Distribution Bracket.
Chapter 8: Server Management Figure 8-8. Removing the AC Distribution Bracket 13. Loosen the six captive thumbscrews securing the Power Distribution Board plastic overlay. Remove the overlay. 14. Remove the two hot swap drives from the Hard Drive Bay. 15. Remove the four screws securing the Hard Drive Bay and pull the bay completely out of the chassis.
Chapter 8: Server Management Figure 8-9. Removing the Hard Drive Bay from the Chassis 16. Disconnect the two 172 mm fan cables from the bottom side of the Power Distribution Board (T-Docking). You can access these cables from the emptied Hard Drive Bay. 17. Lift the small handle mounted to the top of the Power Distribution Board (T-Docking) near the Sideplane to disengage the Power Distribution Board (T-Docking) from the Sideplane. 18.
Chapter 8: Server Management Figure 8-10. Removing the Power Distribution Board (T-Docking) Installing the Power Distribution Board (T-Docking) To install the Power Distribution Board (T-Docking), complete the following procedure: 1. Remove the U-shaped handle on the original Power Distribution Board (T-Docking) and attach it to the replacement board. 2.
Chapter 8: Server Management 12. Install the bracket between the 120 mm fan housing and the AC input bracket. Make sure that the fan cable can reach the connector on the Power Distribution Board (T-Docking). 13. Install the Server Management cable. 14. Connect the power and data cables to the DVD and LS120 drives. 15. Install the power supplies. 16. Install the top cover as described in “Replacing the Top Cover” in Chapter 2.
9 Connecting the Monitor, Keyboard, and Mouse Introduction The PS/2 compatible keyboard and mouse connectors as well as the connection for the monitor are mounted on the rear panel of the server. The keyboard, mouse, and monitor should be plugged in before powering up the HP Server rx4610. The BIOS detects these peripherals and configures them accordingly. Figure 9-1.
Chapter 9 NOTE Connecting the Monitor, Keyboard, and Mouse The two USB connectors are reserved for printers, scanners, and external modems, but not the keyboard or mouse. If you have a console switch box, refer to the switch box's user guide for instructions on connecting the keyboard, mouse, and monitor. 2. If a LAN connector is provided, you may connect it now, or wait until you have verified the HP Server's operation.
Chapter 10: Configuring the HP Server 10 Configuring the HP Server Introduction This chapter provides instructions for the utilities provided with your HP Server. It supplements the basic installation steps provided in the “HP Server rx4610 Installation Guide”. The CD-ROM shipped with your server contains the latest information regarding the various software and firmware utilities.
Chapter 10: Configuring the HP Server and allows you to use the utility. For more information on entering and using the utility, refer to “Using BIOS Setup” in this chapter. 2. POST begins running. POST checks the drive carriers, processors, memory, keyboard, and most installed peripheral devices. During the memory test, POST displays the amount of memory it is able to access and test. The length of time needed to test memory depends on the amount of memory installed. POST is stored in flash memory. 3.
Chapter 10: Configuring the HP Server EFI Shell Boot Options Boot Maintenance Menu A simple, interactive environment that allows EFI device drivers to be loaded, EFI applications to be launched, and operating systems to be booted. In addition, the shell also provides a set of basic commands used to manage files and the system environment variables. For more information on the EFI Shell, refer to “The Extensible Firmware Interface (EFI) Shell”. Files that you include as boot options.
Chapter 10: Configuring the HP Server Table 10-1 describes each menu item in the Boot Maintenance Menu. Table 10-1. Boot Maintenance Menu Options Option Description Boot from a File Automatically adds EFI applications as boot options or allows you to boot from a specific file. When you choose this option, the system searches all the EFI System Partitions in the system. For each partition it looks for an EFI directory. If the EFI directory is found, then it looks in each of the subdirectories below EFI.
Chapter 10: Configuring the HP Server Option Description Exit Returns control to the EFI Boot Manager main menu. This will display the active boot devices, including a possible integrated shell (if the implementation is so constructed). The Extensible Firmware Interface (EFI) Shell The EFI Shell is an EFI application that allows other EFI Applications to be launched.
Chapter 10: Configuring the HP Server Command Description endfor Delimiter for loop constructs (scripts only) endif Delimiter for IF THEN constructs (scripts only) err [level] Sets or displays error level for var in Loop constructs (scripts only) goto label Jumps to label locations (scripts only) guid [-b] [sname] Dumps known guid ids help [-b] [internal_command] Displays help information.
Chapter 10: Configuring the HP Server Server Management Configuration Utility The Server Management Configuration Utility (SM Config) is an EFI-based program used to view or modify the Server Management firmware configuration data. The firmware configuration is maintained by the BMC. The executable program for the utility is named SMconfig.efi. SM Config provides the following functions: • Configure the Emergency Management Port (EMP) for remote server management over a modem or direct serial connection.
Chapter 10: Configuring the HP Server When you select an item from the Config menu, the utility reads the configuration data of that item from the BMC and creates a setup page containing those values. The setup pages may have dropdown boxes, edit boxes, and/or buttons. Use the , , or Down arrow keys to move forward, and use or Up arrow keys to move backwards between each item. Press the key while on a drop-down box to display the other options available.
Chapter 10: Configuring the HP Server Fault Resilient Booting (FRB) Setup Fault Resilient Booting (FRB) allows a multiprocessor system to boot in case the bootstrap processor (BSP) fails. FRB3 Timeout FRB3 refers to the level of FRB in which a timer is started at system power up or hard reset. The BIOS stops this timer in the power-on self test (POST) by asserting the FRB timer halt signal to the Bus Management Controller (BMC).
Chapter 10: Configuring the HP Server PEP Actions Enables or disables Platform Event Paging (PEP) actions when an event filter is triggered. PEP sends a phone page when an event triggers the filter. Default=Enabled. Power Down Enables or disables system power down when an event filter is triggered. Default =Enabled. Reset Enables or disables a system reset when an event filter is triggered. Default=Enabled. Power Cycle Enables or disables a system power cycle when an event filter is triggered.
Chapter 10: Configuring the HP Server EMP Feature Description Access Mode Set the times during system operation when EMP access over the specified port is available. The choices are: • Pre-boot only. The EMP is automatically activated when the system is powered off and during POST. • Always Active. The serial port is always dedicated for EMP use. • Always Disabled. The EMP is deactivated. Restricted Access Mode Enables or disables restricted mode access.
Chapter 10: Configuring the HP Server EMP Feature Set Password Description If set, this password restricts EMP access through the direct serial connection or modem. Select the Set Password button to display the password setup page for clearing or setting the password. You must select in the previous setup page to clear or set the new password to the BMC. Valid characters for this password are A-Z, a-z, and 0-9. The maximum line-length allowed is 16 characters.
Chapter 10: Configuring the HP Server DPC/LAN (Direct Platform Control/LAN) Setup The Direct Platform Control (DPC)/ Local Area Network (LAN) setup page lets you configure the following BMC LAN-Alert features. DPC/LAN Feature Description LAN Access Mode Sets the remote access mode. The choices are: • Disabled. A remote system cannot initiate a LAN session. • Enabled. A remote system can initiate a LAN session regardless of system state or health. • Restricted.
Chapter 10: Configuring the HP Server DPC/LAN Feature Description Set Password If set, this password restricts DPC LAN access. Select the Set Password button to display the password setup page for clearing or setting the password. The password setup page consists of two edit boxes, one to enter a password, another to confirm, and an button. If a password already exists, both of the edit boxes display "********".
Chapter 10: Configuring the HP Server 2. Immediately begin pressing repeatedly until you see video. If the server has an Administrator password configured, you are prompted to enter the password. If the server does not have a password configured the Main screen of the BIOS Setup Utility appears. For information on the Setup screens, refer to “Primary Screens”. Record Your Setup Settings Before altering any settings, record the current values.
Chapter 10: Configuring the HP Server Main Table 10-4 describes the menu items available on the Main screen. Default values appear in brackets. Table 10-4. BIOS Setup Main Screen Menu Items Menu Item Default Value Description BIOS Version [bios_version_number] The currently loaded version of BIOS. You cannot change this value. It is displayed for informational purposes only. Processor Type [Intel Itanium] The processor type. You cannot change this value.
Chapter 10: Configuring the HP Server Advanced Table 10-5 describes the menu items available on the Advanced screen. Five menu items exist on this screen. Each of these items contains sub-menus that in turn can also lead to subsequent sub-menus. Default values appear in brackets. Table 10-5.
Chapter 10: Configuring the HP Server BIOS Setup Advanced Screen Menu Items Primary Menu Item IDE Configuration Sub Menu Items Value Description Parallel Port [Auto] Enable Disable Determines Parallel Port configuration at boot time. Auto causes the server to determine the Base I/O address and interrupt to use for the port. Enable requires you to supply the Base I/O address and the interrupt value. Disable causes the server to disable the port.
Chapter 10: Configuring the HP Server BIOS Setup Advanced Screen Menu Items Primary Menu Item Chipset Configuration Sub Menu Items Value Description Primary IDE Master [drive_id] Not Installed A drive-specific identifier for the primary IDE master device currently installed in the system. Clicking on the value displays two subsequent sub-menu items: Type and Use ARMD Drive As. Type specifies how the server perceives the device (automatically or as an ATPI device).
Chapter 10: Configuring the HP Server BIOS Setup Advanced Screen Menu Items Primary Menu Item Sub Menu Items CPU Work Arounds Value [Auto] Manual Enters submenus that allow you to configure Processor Dispersal, DET stalls and other processor settings Enters submenus that allows you to configure System ECC, Base Memory Test Interval, Ext. Memory Test Interval, Defective DIMM Mapout and Clear Bad Memory Row Info.
Chapter 10: Configuring the HP Server Security Table 10-6 describes the menu items available on the Security screen. Default values appear in brackets. Table 10-6. BIOS Setup Security Screen Menu Items Menu Item Default Value Description Administrator Password Is [Not Installed] Installed The current Administrator password. To set the Administrator password, use the Set Administrator Password menu item. If a password was entered, the field value displays as Installed.
Chapter 10: Configuring the HP Server Service Boot [Disabled] Enabled Enabling this item will allow you to boot into Service Partition Boot mode. The item will be automatically reset to “Disabled” on the next system boot. Exit Table 10-8 describes the menu items available on the Exit screen. Default values appear in brackets. Table 10-8. BIOS Setup Exit Screen Menu Items Menu Item Description Exit Saving Changes Lets you exit the system setup and save your changes in CMOS.
Chapter 10: Configuring the HP Server Running the SELViewer Utility Follow these steps to run the SELViewer Utility: 1. Boot to the EFI Shell. 2. Change to the SELVIEW directory located on the EFI Based Offline Utilities disk. 3. Load the IPMI driver by typing the following command: load ipmi.efi 4. Run the utility by typing the following command: selview Navigation The SEL Viewer main window contains a display pane that shows all the SEL records.
Chapter 10: Configuring the HP Server Graphical User Interface The SEL Viewer main window is based on a multi-column format. The data is displayed in several columns as follows: Num Count of the system event being displayed. Starting with 1 and increasing by one for each event. Timestamp Date in hour:day:four digit year format and the time in hours:minutes:seconds Sensor type and number Sensor type and eight digit numeric identifier E Event description (based on IPMI Specification and BIOS EPS).
Chapter 10: Configuring the HP Server Option Description Open This option allows the user to open the existing SEL file Save As Save As can be used to save SEL data to a file if SELVIEW is being run from the LS120 drive. The file will be saved to the LS120 diskette. Exit This option allows the user to exit the utility.
Chapter 10: Configuring the HP Server Pull-Down Menu – SEL The SEL pull-down menu includes options for reloading SEL entries from the server, clearing the SEL entries, viewing SEL properties, and sorting the entries by different column fields. These options are further described in the table below. Table 10-12. SEL Menu Options Option Description Reload This option allows the user to reload the SEL entries from the server.
Chapter 10: Configuring the HP Server General Help This option displays a detailed description on how to use the SEL Viewer. The help window is divided into two windows. The top window lists all the main topics and the bottom one displays the description about the topic currently selected. Users can select different topics using the arrow keys. To move between windows, use or keys. To dismiss the help window, press key.
Chapter 10: Configuring the HP Server Navigation Use the keystrokes indicated in Table 10-13 to navigate the SDR Viewer Utility’s main window: Table 10-13. SDR Viewer Utility Navigation Keystroke or Combination Description ↑↓ Navigate up and down menu items or scroll through displayed SDR information. ←→ Navigate between the File, SDR, and Help menus Scroll down through displayed SDR information. Scroll up through displayed SDR information.
Chapter 10: Configuring the HP Server Pull-Down Menu – File The File pull-down menu includes menu items for opening and saving data files. These options are further described in the sections below. Table 10-14. SDR Viewer Utility File Menu Selections Menu Selection Description File Open Allows you to open an existing SDR data file for viewing. Selecting this option prompts you to specify a file name having an .SDR file name extension.
Chapter 10: Configuring the HP Server Menu Selection Description Compact Sensor Record SDR Type 02h Entity Association SDR Type 08h Generic Device Locator Record SDR Type 10h FRU Device Locator SDR Type 11h Management Controller Device Locator Record SDR Type 12h Management Controller Confirmation SDR Type 13h BMC Message Channel Information SDR Type 14h OEM SDR SDR Type 0C0h The sensor data record title consists of sensor type, sensor ID string, and SDR record ID Pull-Down Menu – Help T
11 Troubleshooting Introduction If you are having problems with installing your HP Server or booting it up, this chapter provides information on the different tools available for common installation problems, troubleshooting operational problems and error messages. Common Installation Problems The following sections contain general procedures to help you locate installation problems. WARNING Before removing the top cover, always disconnect the power cords and unplug telephone cables.
Chapter 11: Troubleshooting 6. If you suspect a hardware error, follow these steps: a. Log users off the LAN and power down the HP Server. b. Extend the HP Server out of the rack and remove the top cover. c. Simplify the HP Server configuration to the minimum required: ∗ Monitor ∗ Keyboard ∗ Mouse ∗ 1 hard disk drive and 1 flexible disk drive ∗ 1 DVD d. Remove all third-party options, and reinstall each one, one at a time, checking the HP Server after each installation. e.
Chapter 11: Troubleshooting 4. Check the processors for bent pins. If the HP Server Powers On but Fails POST (Power-On Self Test) Use this checklist to check for the following problems when the HP Server fails POST: 1. Clear CMOS and see if the HP Server boots. Check the HP Server's reference label for instructions on clearing CMOS. 2. If the monitor is working, check the POST pass code it displays. If the code is between #0 and 3Ah, and the code does not change, a.
Chapter 11: Troubleshooting vi. Ensure all disk drive power and data cables are securely and properly connected, at the rear of each drive. vii. Verify the mass storage configuration with the cabling and switch diagrams. viii. Replace the HP Server cover. ix. Replace all power cords and power cables. x. Turn on the monitor. xi. Turn on the HP Server at the control panel. xii. Check for error messages.
Chapter 11: Troubleshooting 1. Check the seating of the IDE cables and power cables. 2. Check that the IDE drives are enabled in the BIOS Setup. HP Server rx4610 SEL Data Tables The tables in this appendix provide information on the SEL viewer data on the HP Server rx4610 server platform.
Chapter 11: Troubleshooting HP Server rx4610 Sensor Codes Sensor Type Sensor Number 00 Sensor Name Spare Sensor 09 Spare Sensor 1 14 Spare Sensor 2 01 Temperature 01 Backplane (HSC TeeDock) Temperature 02 HSC SCSI Backplane Temperature 21 Processor 0 Core Temperature 22 Processor 1 Core Temperature 23 Processor 2 Core Temperature 24 Processor 3 Core Temperature 25 Upper Memory Board Temperature 26 Lower Memory Board Temperature 27 Sideplane Temperature 28 I/O Board Temperature
Chapter 11: Troubleshooting 19 SCSI TERM Volt 11 1A SCSI TERM Volt 12 41 Processor 0 Power Good 42 Processor 1 Power Good 43 Processor 2 Power Good 44 Processor 3 Power Good 45 Processor Board 1.5 Volt Power Good 46 Processor Board 1.5 Volt FOK 47 Processor Board 1.8 Volt Power Good 48 Processor Board 1.
Chapter 11: Troubleshooting 52 Upper Memory Board D2D_0 53 Upper Memory Board D2D_1 54 Lower Memory Board D2D_0 55 Lower Memory Board D2D_1 56 SP 3.3 Volt CPU 57 SP 3.3 Volt_1 D2D 58 SP 3.
Chapter 11: Troubleshooting 3F Hot Plug PCI Slot 9 40 Hot Plug PCI Slot 10 23 Watchdog 03 C7 BMC Watchdog OEM C7 2B Processor 0 Fan Boost Temperature 2C Processor 1 Fan Boost Temperature 2D Processor 2 Fan Boost Temperature 2E Processor 3 Fan Boost Temperature 2F Upper Memory Board Fan Boost Temperature 30 Lower Memory Board Fan Boost Temperature 31 Sideplane Fan Boost Temperature 32 I/O Board Fan Boost Temperature 33 Processor Board 1 Fan Boost Temperature 34 Processor Board 2 F
Chapter 11: Troubleshooting BIOS Error Codes\Messages The following list defines the BIOS error codes on the HP Server rx4610 server system. All BIOS error codes\messages, when encountered, appears on the video and are logged in the SEL unless it is full. The system event log record for these BIOS error codes has a sensor type of ‘0F’. To decode a BIOS error codes\message, use the last two bytes in the event description to identify the specific error.
Chapter 11: Troubleshooting 8103: BIST Failure : Processor in socket M3 8110: Internal error(IERR): Processor in socket M0 8111: Internal error(IERR): Processor in socket M1 8112: Internal error(IERR): Processor in socket M2 8113: Internal error(IERR): Processor in socket M3 8120: Thermal trip failure: Processor in socket M0 8121: Thermal trip failure: Processor in socket M1 8122: Thermal trip failure: Processor in socket M2 8123: Thermal trip failure: Processor in socket M3 8130: Processor in socket M0 Di
Chapter 11: Troubleshooting 84FF: System Event Log Full 8C02: ERRORS FOUND IN MEMORY SUBSYSTEM. FAILING ROWS WILL BE MAPPED OUT ON THE NEXT RESET. IT IS STRONGLY SUGGESTED THAT YOU RESET THE SYSTEM NOW. ALLOWING THE SYSTEM TO CONTINUE TO BOOT MAY RESULT IN UNSTABLE SYSTEM BEHAVIOR AND/OR HARD DISK CORRUPTION.
Chapter 11: Troubleshooting 8C6F: Error in memory subsystem: Lower Board, DIMM 31 8C70: Error in memory subsystem: Lower Board, DIMM 32 8C71: Error in memory subsystem: Upper Board, DIMM 1 8C72: Error in memory subsystem: Upper Board, DIMM 2 8C73: Error in memory subsystem: Upper Board, DIMM 3 8C74: Error in memory subsystem: Upper Board, DIMM 4 8C75: Error in memory subsystem: Upper Board, DIMM 5 8C76: Error in memory subsystem: Upper Board, DIMM 6 8C77: Error in memory subsystem: Upper Board, DIMM 7 8C78
Chapter 11: Troubleshooting 8C91: DIMMs mapped out: Lower Board, 1 - 4 8C92: DIMMs mapped out: Lower Board, 9 - 12 8C93: DIMMs mapped out: Lower Board, 17 - 20 8C94: DIMMs mapped out: Lower Board, 25 - 28 8C95: DIMMs mapped out: Lower Board, 5 - 8 8C96: DIMMs mapped out: Lower Board, 13 - 16 8C97: DIMMs mapped out: Lower Board, 21 - 24 8C98: DIMMs mapped out: Lower Board, 29 - 32 8C99: DIMMs mapped out: Upper Board, 1 - 4 8C9A: DIMMs mapped out: Upper Board, 9 - 12 8C9B: DIMMs mapped out: Upper Board, 17 -
Chapter 11: Troubleshooting Table 11-1. BMC Beep Codes Code Description 1-5-1-1 FRB failure (processor failure) 1-5-2-1 No processors installed/detected 1-5-4-2 Power control fault. Power-good dropped out. This beep code occurs during run time 1-5-4-4 PWRGD-BUF failure. System did not assert powergood on power-up. Check installed D2D configuration, verify processors seated, processor power pods are connected, and Legacy cable connector is secure with no bent pins.
Chapter 11: Troubleshooting Types of Memory Tests The HP Server rx4610 platform memory test is separated into the following three individual tests: • First Row Memory Test • Base Memory Test • Extended Memory Test Each of these tests have different functions and are explained separately. First Row Memory Test Description The First Row Memory Test will test the first 64 MB of the first populated row of memory configured. The scanning order for the first row of memory is described in Table 11-2.
Chapter 11: Troubleshooting Table 11-2. First Row Detection Order Order Row 1 2 Board DIMM C Upper 5-8 D Upper 13-16 3 E Upper 21-24 4 F Upper 29-32 5 8 Upper 1-4 6 9 Upper 9-12 7 A Upper 17-20 8 B Upper 25-28 9 4 Lower 5-8 10 5 Lower 13-16 11 6 Lower 21-24 12 7 Lower 29-32 13 0 Lower 1-4 14 1 Lower 9-12 15 2 Lower 17-20 16 3 Lower 25-28 Upon completion of the first row memory test, the memory testing continues with the base memory test.
Chapter 11: Troubleshooting 2. Clear CMOS via the front panel or via clear CMOS jumper in order to clear previous defective DIMM history. 3. Power on the system. Error Logging The defective row/DIMM(s) found during this test cannot be logged to the SEL or reported on screen. Case 2 The system is populated with only one row of memory and the first row memory test encounters a SBE (Single Bit Error).
Chapter 11: Troubleshooting “First row test” “0064 MB” - displayed on the upper LCD line - displayed on the lower LCD line “ALL DIMM MAP OUT” - displayed on the upper LCD line User Action 1. Replace the first row of DIMMs. On repacing the DIMMs, make sure the size and HP part number match. 2. Clear CMOS via the front panel or via clear CMOS jumper in order to clear previous defective DIMM history. 3. Power on the system.
Chapter 11: Troubleshooting Where ‘n’ refers to the DIMM number. Example: Consider a system that is populated with two rows of 256 MB DIMMS in the upper board rows 1-4 and 5-8.
Chapter 11: Troubleshooting 1. Determine the location of the row of defective DIMMs from the error message or by running the EFI based SELViewer Utility or by running either the Intel Server Control (ISC) or Direct Platform Control (DPC) to read the System Event Log (SEL). Replace the defective DIMMs (in the example it is 5-8). On replacing the DIMMs, make sure the size and HP part number match. 2. Clear CMOS via the front panel or via clear CMOS jumper in order to clear previous bad DIMM history. 3.
Chapter 11: Troubleshooting Upon reset, you will see the following messages on the LCD and the system will halt: “First row test” “0064 MB” “ALL DIMM MAP OUT” User Action 1. Determine the first row of DIMMs using the scanning order defined in Table 11-2. Replace the first row of DIMMs with known good DIMMs. On replacing the DIMMs, make sure the size and HP part number match. 2. Clear CMOS via the front panel or via clear CMOS jumper in order to clear previous defective DIMM history. 3.
Chapter 11: Troubleshooting Case 3 The system is populated with more than one row of memory, the first row memory test encounters a SBE (Single Bit Error), and the base row test encounters memory errors but not on all the rows. In this case, the BIOS will write the failing row from first row test into CMOS history, map out the first row of DIMMs, and continues with base memory testing. The base memory testing will write the failing rows into CMOS and map out the defective rows upon reset.
Chapter 11: Troubleshooting (in the example it is 5-8). On replacing the DIMMs, make sure the size and HP part number match. 2. Clear CMOS via the front panel or via clear CMOS jumper in order to clear previous defective DIMM history. 3. Power on the system to continue. Error Logging The defective row/DIMM(s) found during this test case will be logged to the SEL and reported on the screen.
Chapter 11: Troubleshooting User Notification The BIOS will try to map out defective rows found during base memory test but will end up in an infinite reset loop.
Chapter 11: Troubleshooting counts the memory as the test is being performed. When the test is completed, the number in this line should equal the number in the second line. A fourth line, “Memory Errors Detected”, will occur only if the memory test found errors on this latest test pass. It will not occur if the memory test found errors on previous boots; however, in that case, the size in the second line will be smaller than the first line.
Chapter 11: Troubleshooting A second set of messages will be seen later in the POST, which indicates where the memory test found errors. The sequence is as follows: Error in memory subsystem: (Lower/Upper) Board, DIMM XX ERRORS FOUND IN MEMORY SUBSYSTEM. FAILING ROWS WILL BE MAPPED OUT ON THE NEXT RESET. IT IS STRONGLY SUGGESTED THAT YOU RESET THE SYSTEM NOW. ALLOWING THE SYSTEM TO CONTINUE TO BOOT MAY RESULT IN UNSTABLE SYSTEM BEHAVIOR AND/OR HARD DISK CORRUPTION.
Chapter 11: Troubleshooting A second set of messages will be seen later in the POST that indicates where the memory test found errors. The sequence is as follows: 8C81: Error in memory subsystem: Upper Board, DIMM 17 8C82: ERRORS FOUND IN MEMORY SUBSYSTEM. FAILING ROWS WILL BE MAPPED OUT ON THE NEXT RESET. IT IS STRONGLY SUGGESTED THAT YOU RESET THE SYSTEM NOW.ALLOWING THE SYSTEM TO CONTINUE TO BOOT MAY RESULT IN UNSTABLE SYSTEM BEHAVIOR AND/OR HARD DISK CORRUPTION.
Chapter 11: Troubleshooting Aborting the Memory Test Users are given the option to abort the memory test by pressing the spacebar. The following string will appear on the bottom of the screen when executing the extended memory test: Press spacebar to abort memory test. However, this method will only work for the extended memory test, but not for the first row or base memory tests. The total amount of memory installed in the system will still be reported on the video screen.
Chapter 11: Troubleshooting Setup Dialog The BIOS setup (F2) menu has the following selections: ->Advanced->Chipset Configuration->Memory Related Items: Table 11-3.
Chapter 11: Troubleshooting 8C59: Error in memory subsystem: Lower Board, DIMM 9 8C5A: Error in memory subsystem: Lower Board, DIMM 10 8C5B: Error in memory subsystem: Lower Board, DIMM 11 8C5C: Error in memory subsystem: Lower Board, DIMM 12 8C5D: Error in memory subsystem: Lower Board, DIMM 13 8C5E: Error in memory subsystem: Lower Board, DIMM 14 8C5F: Error in memory subsystem: Lower Board, DIMM 15 8C60: Error in memory subsystem: Lower Board, DIMM 16 8C61: Error in memory subsystem: Lower Board, DIMM 1
Chapter 11: Troubleshooting 8C7B: Error in memory subsystem: Upper Board, DIMM 11 8C7C: Error in memory subsystem: Upper Board, DIMM 12 8C7D: Error in memory subsystem: Upper Board, DIMM 13 8C7E: Error in memory subsystem: Upper Board, DIMM 14 8C7F: Error in memory subsystem: Upper Board, DIMM 15 8C80: Error in memory subsystem: Upper Board, DIMM 16 8C81: Error in memory subsystem: Upper Board, DIMM 17 8C82: Error in memory subsystem: Upper Board, DIMM 18 8C83: Error in memory subsystem: Upper Board, DIMM
Chapter 11: Troubleshooting 8C9D: DIMMs mapped out: Upper Board, 5 - 8 8C9E: DIMMs mapped out: Upper Board, 13 - 16 8C9F: DIMMs mapped out: Upper Board, 21 - 24 8CA0: DIMMs mapped out: Upper Board, 29 – 32 DIMMUTIL Dimmutil will map out DIMMS that are installed in the hp server rx4610. The program will identify the DIMM location (slot number), DIMM size, DIMM manufacturer, and DIMM revision. Usage: >dimmutil.efi -b Output Example: Location: A8 Size: 128MB Manufacturer: MT18LSDT1672G-10EC2 Revision: 2.
12 Parts Information Exploded View – Hot Swap and Display 2 1 3 5 6 1 4 Figure 14.
Chapter 12: Parts Information Exploded View – Processor/Memory Access 3 Figure 15.
Chapter 12: Parts Information Exploded View – Processor/Memory Complex 7 11 8 10 9 12 13 28 29 Figure 16.
Chapter 12: Parts Information 152
Chapter 12: Parts Information Exploded View – Server Management Boards Figure 17.
Chapter 12: Parts Information Exploded View – Power Distribution Board and IDE Drives 23 24 25 27 26 Figure 18.
Chapter 12: Parts Information Replaceable Parts List The items in this list and the corresponding item numbers in the respective Exploded Views apply to the HP Server, except where noted. NOTE * The item numbers listed below are used with the part illustrations in order to identify the nomenclature of the part. If a system board needs to be replaced, remove processor modules, DIMMs, or adapter boards and transfer these to the new board.
Chapter 12: Parts Information Figure 16. Processor/Memory Complex Item Part Description No. Part Number 7 256MB DIMM 512MB DIMM 1GB DIMM A6168-67001 A6169-67001 A6170-67001 8 733MHz/2MB CPU Assy 800MHz/4MB CPU Assy A6165-67001 A6448-67001 9 Y-Cable A6153-67012 10 CPU Power Pod A6165-67040 11 Memory Board A6153-67002 12 Thermal Sheetmetal Kit (includes D2D cover, CPU Airflow Baffle, Power Supply Filler Panel) A6153-67053 13 3.
Chapter 12: Parts Information Figure 18. Power Distribution Board and IDE Drives Part Number Item Part Description No. 23 Internal SCSI Cable A6153-67015 24 Power Dist.
Appendix A Specifications Introduction This appendix provides the power requirements, operating conditions (environmental requirements), physical requirements, hardware specifications, and video resolutions of the HP Server. The system board layout is provided in Figure A-1. Figure A-1. System Board Layout Requirements The following tables provide the specifications required for normal operation of the HP Server. Table A-1.
Appendix A: Specifications 120 VAC 4.6 A 200/208 VAC 3.2 A 220/230 VAC 2.8 A In-rush Current 25 A Output Voltages +48 V +12 V standby Operating Power 256 W Continuous Table A-2. Environmental Requirements Parameter Temperature Operating Non-operating Humidity Operating Non-operating Altitude Operating Non-operating Thermal Output Maximum Operating Conditions 5 °C to 35 °C (41 °F to 95 °F).
Appendix A: Specifications Table A-3. Weight and Dimensions Weight Approx. 150 lbs (68.1 kg.), depending on configuration – excludes keyboard and monitor. Height 31.12 cm (12.25 inches, 7U) Width 44.45 cm (17.5 inches) Depth 71.12 cm (28.0 inches) Required front clearance 7.62 cm (3 inches) Required rear clearance 20.32cm (8 inches) Heat Dissipation 6174 BTU/hr Table A-4.
Appendix A: Specifications 640 x 480 60 - 200 800 x 600 48 - 180 1024 x 768 43 - 140 1152 x 864 43 - 100 1280 x 1024 43 32 24 8 16 32 32 24 16 8 32 16 24 8 16 32 8 24 8 Display Mode 16 4 Refresh Rate Hz 47 60 70 74 75 85 90 100 Connector Pinouts and Boardset Locations VGA Video Port 5 1 10 6 15 11 Figure A-2. Video Port Connector Pinout Table A-6.
Appendix A: Specifications Pin Signal Pin Signal 7 GND 15 DDCCLK 8 GND Keyboard and Mouse 6 5 4 3 2 1 Figure A-3. Keyboard and Mouse Connectors The PS/2-compatible connectors share a common housing; but they are not functionally equivalent. Table A-7.
Appendix A: Specifications Parallel Port Figure A-4. Parallel Port Connector Pinout Table A-8.Parallel Port Connector Pinout Pin Signal Pin Signal 1 STROBE_L 10 ACK_L 2 Data bit 0 11 Busy 3 Data bit 1 12 PE 4 Data bit 2 13 SLCT 5 Data bit 3 14 AUFDXT_L 6 Data bit 4 15 ERROR_L 7 Data bit 5 16 INIT_L 8 Data bit 6 17 SLCTIN_L 9 Data bit 7 18−25 GND Serial Ports A and B 1 2 3 4 5 6 7 8 9 Figure A-5. Serial Ports A and B Table A-9.
Appendix A: Specifications Pin Signal 6 DSR Data set ready 7 RTS Request to send 8 CTS Clear to send 9 RIA Ring indication active Description 164
Appendix A: Specifications Universal Serial Bus (USB) There are two external USB connectors designated A and B at the back panel. 4 1 Figure A-6. USB Connectors Table A-10.
Appendix A: Specifications SCSI There is one external SCSI connector on the back of the server. Pin 34 Pin Pin 68 Pin 35 Figure A-7. SCSI Connector Table A-11.
Appendix A: Specifications Pin Signal Pin Signal 29 S29 (+REQ) 63 S63(-REQ) 30 S30 (+I/O) 64 S64 (-I/O) 31 S31 (+DB 8) 65 S65 (-DB 8) 32 S32 (+DB 9) 66 S66(-DB 9) 33 S33 (DB 10) 67 S67 (-DB 10) 34 S34 (DB 11) 68 S68 (-DB 11) IDE One IDE connection exists inside on the Legacy I/O Board. The cable connects to both the diskette drive and DVD. If no IDE drives are present, an IDE cable should not be connected.
Appendix A: Specifications Pin Signal Pin Signal 20 Keyed 40 GND PCI PCI connectors exist inside the chassis on the I/O Baseboard. Table A-13. 33MHz, 64-bit PCI Connectors (Slots 1 and 2) Pin Signal Pin Signal Pin Signal Pin Signal A1 TRST_L A48 GND B1 -12V B48 AD10 A2 +12V A49 AD9 B2 TCK B49 M66EN A3 TMS A50 5V KEYWAY B3 GND B50 5V KEYWAY A4 TDI A51 5V KEYWAY B4 TDO B51 5V KEYWAY A5 +5V A52 C/BEO_L B5 +5V B52 AD8 A6 INTA_L A53 +3.
Appendix A: Specifications Pin Signal A34 FRAME_L A81 GND B34 GND B81 AD45 A35 GND A82 AD44 B35 IRDY_L B82 GND A36 TRDY_L A83 AD42 B36 +3.3V B83 AD43 A37 GND A84 +5V B37 DEVSEL_L B84 AD41 A38 STOP_L A85 AD40 B38 GND B85 +5V A39 +3.3V A86 AD38 B39 LOCK_L B86 AD39 A40 SDONE A87 GND B40 PERR_L B87 AD37 A41 SB0_L A88 AD36 B41 +3.
Appendix A: Specifications Pin Signal Pin Signal Pin Signal Pin Signal A23 AD26 A70 AD60 B23 AD27 B70 +3.3V A24 GND A71 AD58 B24 AD25 B71 AD59 A25 AD24 A72 GND B25 +3.3V B72 AD57 A26 IDSEL A73 AD56 B26 C/BE3_L B73 GND A27 +3.3V A74 AD54 B27 AD23 B74 AD55 A28 AD22 A75 +3.3V B28 GND B75 AD53 A29 AD20 A76 AD52 B29 AD21 B76 GND A30 GND A77 AD50 B30 AD19 B77 AD51 A31 AD18 A78 GND B31 +3.
Appendix A: Specifications Information on Jumpers The Information on Jumpers section provides an overview of how to change a jumper settings for any board and provides the jumper block diagrams for the following boards: • General Procedure to Change Jumper Settings • Processor Baseboard • Legacy I/O Board • I/O Baseboard • T-Docking Board • SCSI Backplane Board General Procedure to Change Jumper Settings These general instructions describe how to change a jumper setting: 1.
Appendix A: Specifications J 1 E2 J 2 E2 J 2 E4 J 2 E3 J2H1 J2H3 J9H1 J2H2 Figure A-9. Processor Baseboard Jumper Locations Jumpers labeled: J2E3 J2E4 J2H1 J2H2 J2H3 J1E2 J2E2 J9H1 JTAG SELECT1 JTAG SELECT2 Host Bus Frequency Host Bus Frequency Host Bus Frequency Processor Frequency Miscellaneous Miscellaneous JTAG Select1 Settings Jumper block J2E3 selects combinations of the processor, supporting chip set, memory, and I/O as routes for JTAG TDI and TDO signals.
Appendix A: Specifications JTAG Select2 Settings Jumper block J2E4 adds and skips Processor Board components to the JTAG TDI and TDO signal path. With this jumper you can choose to add memory and I/O, choose to skip Memory and I/O, choose to skip Memory and add I/O, or choose to add Memory and skip I/O. The default jumper setting skips Memory and I/O. Figure A-10 shows the jumper settings.
Appendix A: Specifications Setting Host Bus Frequencies Jumper blocks J2H1, J2H2, and J2H3 configure the host bus frequency. The settings for all three jumper blocks combine to yield the single frequency. By default, the frequency is set to 133 MHz. J2H 1 M8 1 M7 M6 M5 J2H 2 M4 1 M3 M2 M1 J2H 3 M0 1 C LK SE L N1 N0 A Figure A-12. Host Bus Frequency Settings Jumper diagram labeled: A.
Appendix A: Specifications Processor Host Core Bus Ratio Jumper block J1E2 configures the host-core bus ratio. By default, the bus ration is two to eleven and the core frequency is 733 MHz. Figure A-13 shows the jumper settings. J1E2 R AT IO 3 1 J1E2 J1E2 R AT IO 3 R AT IO 3 1 1 J1E2 R AT IO 3 R AT IO 2 R AT IO 2 R AT IO 2 R AT IO 2 R AT IO 1 R AT IO 1 R AT IO 1 R AT IO 1 R AT IO 0 R AT IO 0 R AT IO 0 R AT IO 0 A B C 1 D Figure A-13.
Appendix A: Specifications Miscellaneous Jumper Settings Jumper block J2E2 enables server management write protect, configures cache line size, disables the FRB, enables the FSB in common clock mode, applies power to the pullups on the ISP chain for stand-alone programming, and selects between using J1E2 or PCA8550 to set the host core bus ratio. By default, the FSB is enabled in common clock mode, power is not applied to pullups, and the J1E2 jumper determines the host core bus ratio.
Appendix A: Specifications Legacy I/O Board Jumpers Jumper blocks exist on the Legacy I/O Board that allow you to perform recovery boot operations, clear the CMOS register, clear the password, and configure FWH programming. To access these jumper blocks you need remove the Legacy I/O Board by following the instructions in “Legacy I/O Board” in Chapter 8. J4A1 J7B1 J7A1 Figure A-15.
Appendix A: Specifications Configuring FWH Programming Jumper block J4A1 allows you to set the FWH programming at 12 Volts. By default, FWH programming is configured for 3.3 Volts. J4A1 1 J4A1 1 A B Figure A-16. Configuring FWH Programming Jumper diagram labeled: A. FWH Programming at 12 Volts B. FWH Programming at 3.3 Volts (Default Setting) Configuring Recovery Boot Jumper block J7A1 controls whether the system attempts to boot using the BIOS programmed in flash memory.
Appendix A: Specifications Clearing the CMOS Register Jumper block J7A1 controls whether settings stored in CMOS nonvolatile memory (NVRAM) are retained during a system reset. By default, the system does not keep the default values in this register. You can configure J7A1 to restore the system defaults. J7A1 J7A1 1 1 A B Figure A-18. CMOS Register Clear Jumper Jumper settings labeled: A. Do Not Keep Default Values in the CMOS Register (Default Setting) B.
Appendix A: Specifications Jumper diagram labeled: A. Retains System Password (Default Setting) B. Clears the System Password on Reset Jumper block J7B1 controls whether the BMC is in a firmware transfer mode and forces an update to the BMC code. J7B1 J7B1 1 A 1 B Figure A-20. Configuring BMC Programming A. BMC Programming Forced B.
Appendix A: Specifications I/O Baseboard Jumpers Jumper blocks exist on the OEM I/O Baseboard that allow you to include the BMC in the JTAG chain and override the hardware PCI hot plug interlock switches. To access these jumper blocks you need to expose the OEM I/O Baseboard by following the instructions in Chapter 8 “Server Management Boards”. Figure A-21 shows the location of the jumpers on the board. J1A1 J8D1 Figure A-21.
Appendix A: Specifications Including the BMC in the JTAG Chain Jumper block J8D1 lets you include or exclude the BMC in the JTAG chain. By default, the BMC is excluded from the JTAG chain. J8D1 J8D1 1 1 A B Figure A-22. BMC Jumper Settings Jumper setting diagram labeled: A. Excludes BMC from the JTAG Chain (Default Setting) B. Includes BMC in the JTAG Chain Overriding the hardware PCI Hot Plug Interlock Jumper block J1A1 lets you override the hardware PCI hot plug interlock switches.
Appendix A: Specifications Power Distribution Board Jumpers (T-Docking) Jumper blocks exist on the Power Distribution Board (T-Docking) that allow you to force a firmware update, flash bootblock write enable, and configure for 220 Volt brownout protection. To access these jumper blocks you need expose the T-Docking Board by following the instructions in Chapter 8, “Server Management Boards”. J 4D 1 J 4E 2 J 4E 1 Figure A-24.
Appendix A: Specifications Forcing a Firmware Update and Flashing Bootblock Write Enable Jumper blocks J4E1 and J4E2 allow you force a firmware update and flash bootblock write enable. By default, both these features are disabled. J4E2 1 J4E2 1 J4E2 1 J4E2 1 J4E1 1 J4E1 1 J4E1 1 J4E1 1 A B C D Figure A-25. Firmware Update and Flash Bootblock Write Enable Jumpers Jumper setting labeled: A. No Firmware Update or Flash Bootblock Enable (Default Setting) B. Flash Bootblock Enable C.
Appendix A: Specifications OFF AC present / Standby output on. DC-to-DC outputs on and okay ON AC present / Standby output on DC-to-DC failure. DC-to-DC not installed.
B Equipment Log and Configuration Worksheet Equipment Log Use the blank equipment log provided here to record information about your system. You will need some of this information when you run BIOS Setup.
Appendix B: Equipment Log and Configuration Worksheet Item Manufacturer Name and Model Number Serial Number Date Installed Hot Plug PCI Slot (7) Hot Plug PCI Slot (8) Non-Hot Plug PCI Slot (1) Non-Hot Plug PCI Slot (2) 12V DC-DC Converter 5V DC-DC Converter (1) 5V DC-DC Converter (2) 3.3V DC-DC Converter (1) 3.3V DC-DC Converter (2) 3.3V DC-DC Converter (3) Memory Board (1) 3.3V DC-DC Converter (1) Memory Board (1) 3.3V DC-DC Converter (2) Memory Board (2) 3.3V DC-DC Converter (1) Memory Board (2) 3.
Index 1 120 mm cooling fans, 17 172 mm fans, 17 172 mm or 120 mm Fans Do Not Operate, 119 5 5.
Index VGA video port, 161 Console Redirection, 106 control panel, 1 LEDs, 1 switch, 1 cooling, 14 cover removing, 14 replacing, 15 cp command, 90 CPU thermal dummies, 47 crash dump, 2 D date command, 90 dblk device command, 90 DC outputs, 6 DC-to-DC Converters, 38 dh command, 90 DHCP, 99 Dimensions, 160 DIMM configurations, 42 DIMM slots, 42 DIMMs, 36 removing, 44 DIMMs, Removing, 44 Direct Platform Control, 98 disabling the timeout feature, 89 diskette media supported, 4 dmpstore command, 90 DPC/LAN, 98 d
Index FRB, 94 front bezel hinge mounting, 12 installing mounting hardware, 12 snap into place, 12 Front Panel Board, 35 Front Panel LCD, 2 Front Panel module, removal, 35 G Gateway IP Address, 98 General Fault LED, 2 goto command, 91 guid command, 91 guide pin, 53 H Hard Disk, 103 Hard Disk Bay, removal, 32 hard reset, 94 Host IP Address, 98 Hot Swap Controller.
Index Legacy I/O Panel, 8 load command, 91 ls command, 91 M Main BIOS Setup Utility, 100 map command, 91 mass storage installation, 25 mass storage devices boot device priority, 25 Master, Primary IDE, 104 mem command, 91 memmap command, 91 Memory Board DC-DC Converters, 38 Memory Boards, 39 Memory Installation Guidelines, 36 mkdir command, 91 mm address command, 91 Mode, 103 mode command, 91 monitor, 10 video connection, 84 mount command, 91 mouse, 84 N NIC, 103 non-hot plug PCI adapter board cover, 62 No
Index Power Distribution Board (TDocking), 78 power down, accelerated, 93 Power Fail LED, 2 Power On/Off, 2 Power on/off button, 99 power pod, 49 Power Restore Policy, 93 Power Setup, 93 power supplies, 17, 21 power supply DC outputs, 6 input voltage ranges, 6 power supply bay, 24 Power Supply LEDs, 22 power switch DC power (front panel), 1 power-down, 10 powering-down procedure, 10 powering-on procedure, 10 Primary Screens, BIOS Setup Utility, 100 Processor Baseboard, 52 Processor Configuration Guidelines
Index server management cable, 78 Server Management Configuration Utility, 92 Set Administrator Password, Security, 106 set command, 91 Set Password, 97 Set Password, DPC/LAN, 99 Setup Utility (BIOS) reenabling disabled processors, 119 sheet metal baffle, 51 Sideplane, 71 Sideplane DC-DC Converters, 69 slide clamp.
Index 194
