Intel® Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009 Document Number: 321461-001
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Contents 1 Introduction .............................................................................................................. 7 1.1 References ......................................................................................................... 8 1.2 Definition of Terms .............................................................................................. 8 2 LGA1366 Socket ...................................................................................................... 11 2.
6.5 6.6 6.7 6.8 7 A B C D 6.4.1 Extrusion ...............................................................................................42 6.4.2 Clip.......................................................................................................43 6.4.3 Core .....................................................................................................44 Mechanical Interface to the Reference Attach Mechanism ........................................44 Heatsink Mass and Center of Gravity .....
B-6 B-7 B-8 B-9 B-10 B-11 B-12 C-1 C-2 C-3 C-4 D-1 Reference Design Heatsink Assembly (2 of 2) ............................................................. 57 Reference Fastener Sheet 1 of 4 ............................................................................... 58 Reference Fastener Sheet 2 of 4 ............................................................................... 59 Reference Fastener Sheet 3 of 4 ...............................................................................
Revision History Revision Number -001 Description • Initial release Revision Date March 2009 § 6 Thermal and Mechanical Design Guide
Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for the: • Intel® Xeon® Processor 3500 Series Unless specifically required for clarity, this document will use “processor” in place of the specific product names. The components described in this document include: • The processor thermal solution (heatsink) and associated retention hardware. • The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate. Figure 1-1.
Introduction 1.1 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Location Notes Intel® Xeon® Processor 3500 Series Processor Datasheet, Volume 1 321332 1 Intel® Xeon® Processor 3500 Series Processor Datasheet, Volume 2 321344 1 Intel® Xeon® Processor 3500 Series Processor Specification Update 321333 1 Notes: 1. Available electronically 1.2 Definition of Terms Table 1-2.
Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature. Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
Introduction 10 Thermal/Mechanical Design Guide
LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for Intel® Xeon® Processor 3500 Series. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The socket has 1366 contacts with 1.016 mm X 1.
LGA1366 Socket BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A 41 40 39 38 37 36 35 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 BA 42 AY AW 43 AV AU T V Y AB AD AF AH AK AM R U W AA AC AE AG AJ AL AN 5 B D F H K M P T V Y AB AD AF AH AK AM P 6 A N AP AT AV AY AT 7 AR 8 AP 9 10 M 11 12 L 13 14 K 15 16 J 17 18 H 19 20 G 21 22 F 23 24 E 25 26 D 27 28 C 29 30 B 31 32 4 Thermal/Mechanica
LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3.
LGA1366 Socket 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. Figure 2-4. Attachment to Motherboard ILM LGA 1366 Socket 2.
LGA1366 Socket 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. 2.3.4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line.
LGA1366 Socket 2.4 Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation. • The package substrate has orientation notches along two opposing edges of the package, offset from the centerline.
LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. 2.6 Markings There are three markings on the socket: • LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion).
LGA1366 Socket 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-7 identifies the NCTF solder joints. . Figure 2-7.
Independent Loading Mechanism (ILM) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow.
Independent Loading Mechanism (ILM) Figure 3-1. ILM Cover Assembly Load Lever Captive Fastener (4x) Load Plate Frame 3.1.2 ILM Back Plate Design Overview The back plate for single processor workstation products consists of a flat steel back plate with threaded studs for ILM attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket.
Independent Loading Mechanism (ILM) . Figure 3-2.
Independent Loading Mechanism (ILM) As indicated in Figure 3-3, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-3.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism. 4.1 Component Mass Table 4-1. Socket Component Mass Component Mass Socket Body, Contacts and PnP Cover 4.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4.4 Loading Specifications The socket will be tested against the conditions listed in Chapter 7 with heatsink and the ILM attached, under the loading conditions outlined in this chapter. Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment <3.9nH The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket. Mated loop inductance, Loop Mated partial mutual inductance, L Maximum mutual capacitance, C.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Figure 4-1.
Sensor Based Thermal Specification Design Guidance 5 Sensor Based Thermal Specification Design Guidance The introduction of the sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation. The sensor based specification utilizes the Digital Thermal Sensor information accessed using the PECI interface.
Sensor Based Thermal Specification Design Guidance Figure 5-1. Comparison of Case Temperature vs. Sensor Based Specification Ta = 43.2 C Tcontrol Ta = 30 C Ψ-ca = 0.292 Power TDP Current Specification (Case Temp) Ψ-ca = 0.292 Ψ-ca = 0.362 Tcontrol Ta = 30 C TDP Power Sensor Based Specification (DTS Temp) 5.2 Sensor Based Thermal Specification The sensor based thermal specification consists of two parts.
Sensor Based Thermal Specification Design Guidance As in previous product specifications, a knowledge of the system boundary conditions is necessary to perform the heatsink validation. Section 5.3.1 will provide more detail on defining the boundary conditions. The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. See Figure 5-2 for an example of the processor TTV thermal profile. Figure 5-2. Thermal Profile 70.0 y = 43.2 + 0.19 * P 65.0 TTV Tcase in C 60.
Sensor Based Thermal Specification Design Guidance Figure 5-3. Thermal solution Performance 5.3 Thermal Solution Design Process Thermal solution design guidance for this specification is the same as with previous products. The initial design must take into account the target market and overall product requirements for the system. This can be broken down into several steps: • Boundary condition definition • Thermal design / modelling • Thermal testing 5.3.
Sensor Based Thermal Specification Design Guidance Note: If the assumed TAMBIENT is inappropriate for the intended system environment, the thermal solution performance may not be sufficient to meet the product requirements. The results may be excessive noise from fans having to operate at a speed higher than intended. In the worst case this can lead to performance loss with excessive activation of the Thermal Control Circuit (TCC). Figure 5-4.
Sensor Based Thermal Specification Design Guidance 5.3.3 Thermal Solution Validation 5.3.3.1 Test for Compliance to the TTV Thermal Profile This step is the same as previously suggested for prior products. The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions: • TTV is powered to the TDP condition • Thermal solution fan operating at full speed • TAMBIENT at the boundary condition from Section 5.3.
Sensor Based Thermal Specification Design Guidance 0.50 5.9 0.40 5.4 4.9 0.30 4.4 3.9 0.20 3.4 2.9 0.10 0.00 600 1100 1600 2100 2600 3100 Bels (BA) Thermal Solution Performance vs. Fan Speed Psi-ca Figure 5-5. 2.4 1.9 3600 RPM Psi-ca System (BA) Note: This data is taken from the validation of the RCBF5 reference processor thermal solution. The ΨCA vs. RPM data is available in Table 5-1 at the end of this chapter. 5.
Sensor Based Thermal Specification Design Guidance 5.4.1 Fan Speed Control Algorithm without TAMBIENT Data In a system that does not provide the FSC algorithm with the TAMBIENT information, the designer must make the following assumption: • When the DTS value is greater than TCONTROL the TAMBIENT is at boundary condition derived in Section 5.3.1. This is consistent with our previous FSC guidance to accelerate the fan to full speed when the DTS value is greater than TCONTROL.
Sensor Based Thermal Specification Design Guidance 5.4.2 Fan Speed Control Algorithm with TAMBIENT Data In a system where the FSC algorithm has access to the TAMBIENT information and is capable of using the data the benefits of the DTS thermal specification become more striking. As will be demonstrated below, there is still over cooling of the processor, even when compared to a nominally ambient aware thermal solution equipped with a thermistor.
Sensor Based Thermal Specification Design Guidance 5.5 System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and TAMBIENT data as well as any other device being monitored for thermal compliance. Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted TAMBIENT, additional TTV based testing in the chassis is not expected to be necessary.
Sensor Based Thermal Specification Design Guidance 5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL Table 5-1 is provided as reference for the development of thermal solutions and the fan speed control algorithm. Table 5-1. Thermal Solution Performance above TCONTROL TAMBIENT1 ΨCA at DTS = TCONTROL2 RPM for ΨCA at DTS = TCONTROL5 ΨCA at DTS = -13 RPM for ΨCA at DTS = -15 43.2 0.190 N/A 0.190 N/A 42.0 0.206 N/A 0.199 N/A 41.0 0.219 N/A 0.207 N/A 40.0 0.
Sensor Based Thermal Specification Design Guidance 38 Thermal/Mechanical Design Guide
ATX Reference Thermal Solution 6 ATX Reference Thermal Solution Note: The reference thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification.The information represents design targets, not commitments by Intel. The design strategy is to use the design concepts from the prior Intel® Radial Curved Bifurcated Fin Heatsink Reference Design (Intel® RCBFH Reference Design) designed originally for the Intel® Pentium® 4 processors.
ATX Reference Thermal Solution 6.2 Heatsink Thermal Solution Assembly The reference thermal solution for the processor is an active fan solution similar to the prior designs for the Intel® Pentium® 4 and Intel® Core™2 Duo processors. The design uses a copper core with an aluminum extrusion. It attaches to the motherboard with a fastener design reused from the RCBFH3 and RCFH4. The clip design is new to span the larger size of the LGA1366.
ATX Reference Thermal Solution 6.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical Design Figure 6-2 shows a 3-D representation of the board component keep out for the reference ATX thermal solution. A fully dimensioned drawing of the keepout information is available at Figure B-1 and Figure B-2 in Appendix B. A DXF version of these drawings is available as well as the 3-D model of the board level keep out zone is available. Contact your field sales representative for these documents.
ATX Reference Thermal Solution 6.4 Reference Design Components 6.4.1 Extrusion The aluminum extrusion is a 51 fin 102 mm diameter bifurcated fin design. The overall height of the extrusion is 38 mm tall. To facilitate reuse of the core design the center cylinder ID and wall thickness are the same as RCFH4. Figure 6-3.
ATX Reference Thermal Solution 6.4.2 Clip Structural design strategy for the clip is to provide sufficient load for the Thermal Interface Material (TIM). The clip is formed from 1.6 mm carbon steel, the same material as used in previous clip designs. The target metal clip nominal stiffness is 376 N/mm [2150 lb/in]. The combined target for reference clip and fasteners nominal stiffness is 260 N/mm [1489 lb/in]. The nominal preload provided by the reference design is 191 N ± 42 N [43 lb ± ~10 lb].
ATX Reference Thermal Solution 6.4.3 Core The core is the same forged design used in RCFH4. This allows the reuse of the fan attach and if desired the same extrusion as used in RCFH4. The machined flange height has been reduced from the RCFH4 design to match the IHS height for the Intel® Xeon® Processor 3500 Series when installed in the LGA1366 socket. The final height of the flange will be an output of the design validation and could be varied to adjust the preload. See Section 6.
ATX Reference Thermal Solution Figure 6-6. Clip Core and Extrusion Assembly Clip Core shoulder traps clip in place Figure 6-7. Critical Parameters for Interface to the Reference Clip Fan Fin Array Core See Detail A Clip Fin Array Clip 1.
ATX Reference Thermal Solution Figure 6-8. Critical Core Dimensions Dia 38.68 +/- 0.30mm Dia 36.14 +/- 0.10 mm Gap required to avoid core surface blemish during clip assembly. Recommend 0.3 mm min. 1.00 +/- 0.10 mm Core 1.00 mm min R 0.40 mm max R 0.40 mm max 2.45 +/- 0.10 mm 6.6 Heatsink Mass and Center of Gravity • Total assembly mass ≤ 550 gm (grams), excluding clip and fasteners • Total mass including clip and fasteners < 595 g • Assembly center of gravity ≤ 25.
Thermal Solution Quality and Reliability Requirements 7 Thermal Solution Quality and Reliability Requirements 7.1 Reference Heatsink Thermal Verification Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume.
Thermal Solution Quality and Reliability Requirements 7.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4.
Component Suppliers A Component Suppliers Note: The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Component Suppliers 50 Thermal/Mechanical Design Guide
Mechanical Drawings B Mechanical Drawings Table B-1 lists the mechanical drawings included in this appendix. Table B-1.
A B C D E F 6 5 4 3 2 52.00 48.70 2X 43.51 32.50 35.80 40.00 28.51 7.15 2 0.00 7.15 30.60 29.64 32.28 35.62 37.00 19.51 18.23 38.92 40.77 42.72 52.00 2X 49.55 2X 43.51 2X 41.06 40.21 38.92 2 0.00 ( 104.00 ) 2X 49.55 52.00 38.92 5.40 10.50 9.40 8 7 6 5 4 3 2 7 . COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW. 6 NON-GROUNDED COPPER SURFACE ADDED TO INCREASE PCB DURABILITY. ILM BOUNDARY 5 PACKAGE BOUNDARY LEVER UNHOOKED POSITION NOTES: 1.
A B C D E F G 7 6 5 4 (36.00 ) 8 2 (80.00 ) R2.00 4X (30.60 ) LEGEND 6 5 2.54 MM MAX COMPONENT HEIGHT ROUTING AND COMPONENT KEEP-OUT COMPONENT KEEP-OUT 7 23.50 0.00 23.50 36.10 3 4 (19.00 ) (72.20 ) 3 (30.60 ) BOARD SECONDARY SIDE 0.00 Thermal/Mechanical Design Guide 2 H 8 2 2 36.10 1 (47.00 ) 6.00 4X (14.00 ) 10.00 4X SOCKET& PROCESSOR VOLUMETRIC KEEP-IN INTEL PN D82246 (80.
Mechanical Drawings Figure B-3.
Mechanical Drawings Figure B-4.
Mechanical Drawings Figure B-5.
Mechanical Drawings Figure B-6.
Mechanical Drawings Figure B-7.
Mechanical Drawings Figure B-8.
Mechanical Drawings Figure B-9.
Mechanical Drawings Figure B-10.
A B C D E F G H 8 7 6 5 4 3 2 7 8 SEE DETAIL 105.94 [ 4.171 ] A C 7 6 B SEE DETAIL 5 45.19 [ 1.779 ] PERMANENTLY MARK PART NUMBER AND REVISION LEVEL APPROXIMATELY WHERE SHOWN XXXXXX-XXX REV XX 105.94 [ 4.171 ] B 7 4 SECTION A-A D D 3 7 A B 5 2 A 0.5 [.019] SQ 53.5 0.2 [ 2.11 .00 ] 36.44 0.2 [ 1.435 .007 ] 0.5 [.019] 4X 10 0.2 [ .394 .007 ] THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Thermal/Mechanical Design Guide A B C D 8 7 6 8 5.3 [ .209 ] 2X R0.3 MIN [ .012 ] 7 W A B 0.2 [.007] BOUNDARY 7 A B 0.1 [.003] 2X R3.6 [ .142 ] R0.3 MIN TYP [ .012 ] 1.06 [ .042 ] 1.65 [ .0650 ] 6 R5.66 [ .223 ] THIS POINT CORRESPONDS TO THE 45.19 DIMENSION ON SHEET 1 ZONE B7 DETAIL A SCALE 10 TYPICAL 4 PLACES 7.45 [ .293 ] 7.312 [ .2879 ] 135 W 5 5 140 X 3.5 [ .138 ] 4 A 3 A 3 TMD DEPARTMENT *** SECTION D-D SCALE 8 DETAIL B SCALE 20 A B A B 0.4 [.
Mechanical Drawings 64 Thermal/Mechanical Design Guide
Socket Mechanical Drawings C Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1.
Socket Mechanical Drawings Figure C-1.
Socket Mechanical Drawings Figure C-2.
Socket Mechanical Drawings Figure C-3.
Socket Mechanical Drawings Figure C-4.
Socket Mechanical Drawings 70 Thermal/Mechanical Design Guide
Processor Installation Tool D Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for availability: Billy Hsieh billy.hsieh@tycoelectronics.
Processor Installation Tool Figure D-1.
