HP 14 Notebook PC Compaq 14 Notebook PC HP 240 G3 Notebook PC HP 245 G3 Notebook PC HP 246 G3 Notebook PC - Maintenance and Service Guide

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink, processor, and system board spare part kits.
The following illustrations show replacement thermal material locations.
●
Discrete graphics: Thermal paste is used on the processor and associated heat sink area (1)(2), as well
as the graphics chip and associated heat sink area (3)(4).
●
UMA graphics: Thermal paste is used on the processor (1) and the heat sink (2).
Reverse this procedure to reassemble and install the heat sink assembly.
Component replacement procedures 93