HP ZBook 15 G2 Mobile Workstation Maintenance and Service Guide

4. Remove the fan/heat sink assembly (4).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and the system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the fan/heat sink assembly, processor, and system board spare part kits.
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Various thermal pads are used on the graphics board components (1) and (7) and the heat sink sections
(2) and (8) that service them
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Thermal paste is used on the processor (3) and the heat sink section (4) that services it
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Thermal paste is used on the graphics board processor (5) and the heat sink section (6) that services it
Component replacement procedures 75