HP EliteBook 745 G2 HP Notebook PC and EliteBook 755 G2 Notebook PC - Maintenance and Service Guide
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for Customer Self-Repair parts
- Removal and replacement procedures for Authorized Service Provider parts
- Computer Setup (BIOS), TPM, and HP Sure Start in Windows 10
- Computer Setup (BIOS) and MultiBoot in Windows 8.1
- Computer Setup (BIOS) and MultiBoot in Windows 7
- Using Setup Utility (BIOS) in Ubuntu
- Using HP PC Hardware Diagnostics (UEFI)
- Backup and recovery in Windows 10
- Backup and recovery in Windows 8.1
- Backup and recovery in Windows 7
- Backing up, restoring, and recovering in Ubuntu
- Specifications
- Computer specifications–HP EliteBook 745 models
- Computer specifications–HP EliteBook 755 models
- 35.6 cm (14.0 in) HD SVA display specifications
- 35.6 cm (14.0 in) HD+ SVA display specifications
- 35.6 cm (14.0 in) FHD, UWVA display specifications
- 39.6 cm (15.6 in) HD SVA display specifications
- 39.6 cm (15.6 in) FHD SVA display specifications
- Hard drive specifications
- Solid-state drive specifications
- Statement of Volatility
- Power cord set requirements
- Recycling
- Index
2. The following illustration shows the replacement thermal material locations. The thermal material must
be thoroughly cleaned from the surfaces of the heat sink and the system board components each time
the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and
system board spare part kits.
Thermal paste is used on the system board component (1) and on the heat sink area (2) that services it.
Reverse this procedure to install the heat sink.
Component replacement procedures 77