HP ProLiant ML310e Gen8 Server User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S.
Contents Component identification ............................................................................................................... 7 Front panel components ................................................................................................................................ 7 Front panel LEDs and buttons ............................................................................................................... 8 Rear panel components .............................................
Drive installation guidelines ............................................................................................................... 30 Installing a non-hot-plug drive ............................................................................................................ 30 Installing a hot-plug drive .................................................................................................................. 32 Drive cage options ..........................................................
Array Configuration Utility ................................................................................................................ 74 Option ROM Configuration for Arrays................................................................................................ 75 ROMPaq utility................................................................................................................................. 76 Automatic Server Recovery ............................................................
Before you contact HP ................................................................................................................................ 92 HP contact information ................................................................................................................................ 92 Customer Self Repair .................................................................................................................................. 92 Acronyms and abbreviations ....................
Component identification Front panel components Item Description 1 Optical drive (optional) 2 Media drive bay 3 USB connectors 4 Power On/Standby button and system power LED 5 Drive bays (inside) Component identification 7
Front panel LEDs and buttons Item Description Status 1 UID LED button Blue = Identification is activated Flashing blue = System is being managed remotely Off = Identification is deactivated 2 Health LED Green = Normal (system on) Flashing amber = System health is degraded Flashing red = System health is critical Off = Normal (system off) 3 NIC status LED Green = Linked to network Flashing green = Network activity Off = No network link 4 Power On/Standby button and system power LED Green = Nor
Rear panel components Item Description 1 Non-hot-plug power supply 2 Slot 4 PCIe x16 (8, 4, 1)* 3 Slot 3 PCIe x8 (8, 4, 1)* 4 Slot 2 PCIe x8 (4, 1)* 5 Slot 1 PCIe x4 (1)* 6 Expansion slot cover retainer 7 Serial connector 8 Video connector 9 Dedicated iLO management port (optional) 10 NIC 1/shared iLO management connector 11 NIC connector 2 12 USB connectors * For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page 12).
Rear panel LEDs and buttons Item Description Status 1 NIC link LED Green = Link exists Off = No link exists 2 NIC status LED Green = Activity exists Flashing green = Activity exists Off = No activity exists 3 UID LED button Blue = Identification is activated Flashing blue = System is being managed remotely Off = Identification is deactivated 4 Power supply LED (for hot-plug HP Green = Normal CS power supplies only)* Off = One or more of the following conditions exists: • • • • Power Power Po
System board components Item Description 1 RPS connector 2 Processor socket 3 System battery 4 24-pin power supply connector 5 Mini-SAS connector 6 SATA connectors 7 Internal USB cable connector 8 Internal USB connector 9 SD card slot 10 Front USB connector 2 11 Front USB connector 1 12 Front panel LED connector 13 Fan connector 2 14 Reserved 15 Ambient thermal sensor connector 16 NMI header 17 System maintenance switch 18 Slot 1 PCIe x4 (1)* 19 Slot 2 PCIe x8 (4, 1)*
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page 12)." DIMM slot locations DIMM slots are numbered sequentially (1 through 4) for the processor. The supported AMP modes use the letter assignments for population guidelines. PCIe expansion slot definitions The transfer rate of the PCIe expansion slots 3 and 4 depends on the processor model installed. The slots can either run in PCIe2 (5 GT/s) or PCIe3 (8 GT/s) rate.
Switch Default Function 2 Off Off = System configuration can be changed On = System configuration is locked 5 Off Off = Power-on password is enabled On = Power-on password is disabled 6 Off Off = No function On = ROM reads configuration as invalid 3, 4, 7, 8, 9, 10, 11, 12 — Reserved When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.
Drive numbering • Four-bay LFF drive model • Eight-bay SFF drive model Component identification 14
Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
FBWC module LED definitions The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. 1 - Amber 2 - Green 3 - Green Interpretation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller.
Fan locations Item Description 1 Rear system fan (fan 1, for processor cooling) 2 Front system fan (fan 2, for expansion board cooling) T-10/T-15 Torx screwdriver The server includes a T-10/T-15 Torx screwdriver located on the side of the media drive cage. Use the screwdriver to loosen screws during hardware configuration procedures.
Operations Power up the server 1. Connect each power cord to the server. 2. Connect each power cord to the power source. 3. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
Unlock the tower bezel The tower bezel must be unlocked and opened to access the drive cage and media bays. It must be unlocked to remove the access panel. The bezel must remain closed during normal server operations. Remove the tower bezel 1. Unlock and open the tower bezel ("Unlock the tower bezel" on page 19). 2. Pull the bezel away from the front chassis. Install the tower bezel 1. Insert the tabs on the tower bezel to the slots on the front chassis.
2. Close and lock the tower bezel. Remove the access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Power down the server (on page 18). 2. Remove all power: a.
c. Lift the access panel away from the chassis. Install the access panel 1. Install the access panel: a. Place the access panel on the chassis, and slide it toward the front of the server. b. Tighten the thumbscrew. 2. Lock the tower bezel. Remove the air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
1. Power down the server (on page 18). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 19). 4. Remove the access panel (on page 20). 5. Remove the air baffle. Install the air baffle 1. Insert the tabs on the baffle into the slots on the rear chassis. 2. Push the front end of the baffle inside the chassis. 3. Install the access panel (on page 21).
4. Lock the tower bezel. 5. Power up the server (on page 18).
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Space and airflow requirements Leave at least a 7.6-cm (3-inch) clearance space at the front and back of the server for proper ventilation. Temperature requirements To ensure continued, safe, and reliable equipment operation, install or position the system in a well-ventilated, climate-controlled environment. The maximum recommended TMRA for most server products is 35°C (95°F). The temperature in the room where the server is located must not exceed 35°C (95°F).
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for the server is not recommended. Server warnings and cautions WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack: • At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters. • Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides.
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations.
a. Connect the Ethernet cable, and then power on the server. b. During server POST, press the F10 key. c. Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 69). d. At the 1 Start screen, click the Configure and Install button. e. To finish the installation, follow the onscreen prompts. An Internet connection is required to update the firmware and systems software.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
4. Remove the drive carrier. 5. Remove the two metal brackets from the drive carrier. 6. Install the drive in the carrier.
7. Install the drive. 8. Close and lock the tower bezel. 9. Connect each power cord to the server. 10. Connect each power cord to the power source. 11. Power up the server (on page 18). Installing a hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To install the component: 1. Unlock and open the tower bezel ("Unlock the tower bezel" on page 19). 2. Remove the drive blank.
3. Prepare the drive. 4. Install the drive. 5. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page 15). 6. Close and lock the tower bezel. Drive cage options Four-bay LFF hot-plug drive backplane option To install the component: 1. Power down the server (on page 18). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the tower bezel (on page 19). 4.
6. Remove all installed drives. 7. Disconnect the drive cage cables: a. Disconnect the Mini-SAS cable from the system board or from the storage controller option. b. Disconnect the drive power cable from the 10-pin power supply connector. 8. Remove the drive cage assembly. 9. Loosen the bracket thumbscrew, and then remove the non-hot-plug bracket assembly from the drive cage. For image clarity, the non-hot-plug Mini-SAS and power cables attached to the bracket are not shown in the following figure.
10. Attach the hot-plug drive backplane to the drive cage, and then tighten the thumbscrew. 11. Install the drive cage assembly. 12. Connect the drive backplane cables: a. Connect the power cable to the backplane. b. Do one of the following: — Connect the Mini-SAS cable to the system board (SATA drive support only).
For cable routing information, see "Hot-plug, SATA drive support (on page 62)." — Connect one end of the Mini-SAS cable to the backplane and the other end to a storage controller option (SATA and SAS drive support). For cable routing information, see "Hot-plug, SATA and SAS drive support (on page 63)." 13. Install the drives ("Drive options" on page 30). CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
19. Power up the server (on page 18). Eight-bay SFF hot-plug drive cage option To install the component: 1. Power down the server (on page 18). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the tower bezel (on page 19). 4. Remove the access panel (on page 20). 5. Remove the air baffle (on page 21). 6. Remove all installed drives. 7. Disconnect the drive cage cables: a.
9. Install the SFF drive cage assembly. 10. Connect the drive backplane cables: a. Connect the power cable to the backplane. b. Connect the Mini-SAS cables to the backplane and to a storage controller option. For cable routing information, see "Eight-bay SFF drive cabling (on page 63)." 11. Install the drives ("Drive options" on page 30). CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 12.
16. Connect each power cord to the power source. 17. Power up the server (on page 18). Controller options The server ships with an embedded Smart Array B120i controller. For more information about the controller and its features, see the HP Dynamic Smart Array RAID Controller User Guide on the HP website (http://www.hp.com/support/DSA_RAID_UG_en). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website (http://www.hp.com/support/CASAC_RG_en).
2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Unlock the tower bezel (on page 19). 4. Remove the access panel (on page 20). 5. Remove the air baffle (on page 21). 6. If necessary, disconnect the Mini-SAS cable from the system board. 7. Install the storage controller. 8. Connect all necessary internal and external cabling to the option.
6. Install the cache module on the storage controller. 7. Connect the capacitor pack cable to the cache module. 8. Install the storage controller ("Installing a storage controller" on page 39).
9. Install the capacitor pack. 10. Install the air baffle (on page 22). 11. Install the access panel (on page 21). 12. Lock the tower bezel. 13. Connect each power cord to the server. 14. Connect each power cord to the power source. 15. Power up the server (on page 18). Optical drive option To install the component: 1. Power down the server (on page 18). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
5. Remove the media bay blank. 6. Remove the EMI shield.
7. Install the optical drive into the media drive bay. 8. Connect the drive cables: a. Connect the power cable to the drive. b. Connect one end of the SATA cable to the drive and the other end to the system board. For cable routing information, see "Media drive cabling (on page 64)." 9. Install the access panel (on page 21). 10. Install the tower bezel (on page 19). 11. Connect each power cord to the server. 12. Connect each power cord to the power source. 13. Power up the server (on page 18).
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization. The server supports single- and dual-rank UDIMMs operating at a speed of up to 1600 MHz. Depending on the processor model and the number of DIMMs installed, the memory clock speed might be reduced to 1333 or 1066 MHz. The server supports a maximum system memory of 32 GB, using 2-GB, 4-GB, and 8-GB UDIMMs.
Item Description Definition 4 Voltage rating L = Low voltage (1.35V) U = Ultra low voltage (1.25V) Blank or omitted = Standard 5 Memory speed 12800 = 1600-MT/s 10600 = 1333-MT/s 8500 = 1066-MT/s 6 DIMM type R = RDIMM (registered) E = UDIMM (unbuffered with ECC) L = LRDIMM (load reduced) For the latest supported memory information, see the QuickSpecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/ProductBulletin.html).
General DIMM slot population guidelines • The server has four memory slots. • The server supports two channels with two DIMM slots per channel. o Memory channel 1 consists of the two DIMMs that are closest to the processor. o Memory channel 2 consists of the two DIMMs that are farthest from the processor. • White DIMM slot indicates the first slot of a channel (2-A, 4-B). • Memory speed support depends on the type of processor installed.
7. Install the DIMM. 8. Install the air baffle (on page 22). 9. Install the access panel (on page 21). 10. Lock the tower bezel. 11. Connect each power cord to the server. 12. Connect each power cord to the power source. 13. Power up the server (on page 18). After installing the DIMMs, to configure memory protection mode, use RBSU ("HP ROM-Based Setup Utility" on page 72).
6. Remove the expansion slot cover retainer. 7. Identify the expansion slot compatible with the new option, and then remove the cover opposite that slot.
8. If installing a full-length expansion board, remove the board retainer. 9. Install the expansion board.
10. If installing a full-length expansion board, install the board retainer that was removed. 11. Install the expansion slot cover retainer. 12. Connect all necessary internal and external cables to the expansion board. For more information on these cabling requirements, see the documentation that ships with the option. 13. Install the air baffle (on page 22). 14. Install the access panel (on page 21). 15. Lock the tower bezel. 16. Connect each power cord to the server. 17.
Dedicated iLO management port option To install the component: 1. Power down the server (on page 18). 2. Unlock the tower bezel (on page 19). 3. Remove the access panel (on page 20). 4. Remove the air baffle (on page 21). 5. Remove any existing expansion board that blocks the access to the rear system fan connector. 6. Remove the rear system fan. 7. Using a flat screwdriver, toggle the knockout to loosen it, and then pull it out of the chassis.
8. Install the dedicated iLO management module. 9. Install the rear system fan. 10. Install any removed expansion board. 11. Install the air baffle (on page 22). 12. Install the access panel (on page 21). 13. Lock the tower bezel. 14. Connect each power cord to the server. 15. Connect each power cord to the power source. 16. Power up the server (on page 18). Enabling the dedicated iLO management port The onboard NIC 1/shared iLO connector is set as the default system iLO port.
HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections: 1. Installing the Trusted Platform Module board (on page 54). 2. Retaining the recovery key/password (on page 56). 3. Enabling the Trusted Platform Module (on page 56). Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 72). For more information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs).
4. Remove the air baffle (on page 21). 5. Remove any existing expansion board that blocks the access to the rear system fan connector. 6. Remove the rear system fan. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data. 7. Install the TPM board.
8. Install the TPM security rivet by pressing the rivet firmly into the system board. 9. Install the rear system fan. 10. Install any removed expansion board. 11. Install the air baffle (on page 22). 12. Install the access panel (on page 21). 13. Lock the tower bezel. 14. Connect each power cord to the server. 15. Connect each power cord to the power source. 16. Power up the server (on page 18).
5. Select Enable, and then press the Enter key to modify the TPM Functionality setting. 6. Press the Esc key to exit the current menu, or press the F10 key to exit RBSU. 7. Reboot the server. 8. Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.
6. Remove the power supply. 7. Disconnect all cables from installed media drives. 8. Remove all installed devices and any EMI shields from the media drive bays. 9. Install the RPS cage.
10. Insert the RPS backplane module cables into the media drive cage, and then slide in the module into the lower media drive bay. Align the left edge of the module with the guide mark on the bay. 11. Connect the eight-pin to four-pin adapter cable to the eight-pin power supply connector of the RPS backplane module. 12. Connect the RPS cables to the system board. For detailed cabling information, see "Redundant power supply cabling (on page 65).
a. Remove the EMI shield. b. Install the HP CS power supplies. 15. Install any device originally installed in the upper media drive bay. 16. Install the EMI shield in the lower media drive bay. 17. Install the access panel (on page 21). 18. If the lower media bay blank is not attached to the tower bezel, install it. 19. Lock the tower bezel. 20. Connect each power cord to the server. 21. Connect each power cord to the power source. 22. Power up the server (on page 18).
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Non-hot-plug, SATA and SAS drive support Item Description 1 Power cable 2 Data cable Hot-plug, SATA drive support Item Description 1 Power cable 2 Mini-SAS cable Cabling 62
Hot-plug, SATA and SAS drive support Item Description 1 Power cable 2 Mini-SAS cable Eight-bay SFF drive cabling This drive configuration supports hot-plug SATA and SAS drives.
Media drive cabling • Item Media drives in a nonredundant power configuration Description 1 Upper media drive power cable 2 Lower media drive SATA cable 3 Upper media drive SATA cable 4 Lower media drive power cable • Media drive in a redundant power configuration Item Description 1 Upper media drive SATA cable 2 Upper media drive power cable Cabling 64
Power supply cabling Nonredundant power supply cabling Item Description 1 24-pin power supply cable 2 4-pin power supply cable Redundant power supply cabling Item Description 1 24-pin power supply cable 2 26-pin RPS cable Cabling 65
Item Description 3 4-pin power supply cable (with the 8-pin to 4-pin adapter cable connected) Capacitor pack cabling Cabling 66
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO enables and manages the Active Health System (on page 68) and also features Agentless Management. All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host operating system or even if no host operating system is installed. HP Insight Remote Support software (on page 71) is also available in HP iLO with no operating system software, drivers, or agents.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.
HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning (on page 69).
HP Insight Remote Support software HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement.
HP Service Pack for ProLiant SPP is a release set that contains a comprehensive collection of firmware and system software components, all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures, and limited HP external storage. SPP has several key features for updating HP ProLiant servers.
• Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key.
Boot options Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following: • Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key.
o Advanced Capacity Expansion (SATA to SAS and SAS to SATA) o Offline Split Mirror o RAID 6 and RAID 60 o RAID 1 (ADM) and RAID 10 (ADM) o HP Drive Erase o Video-On-Demand Advanced Controller Settings • Provides different operating modes, enabling faster configuration or greater control over the configuration options • Remains available any time that the server is on • Displays on-screen tips for individual steps of a configuration procedure • Provides context-sensitive searchable help co
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website (http://www.hp.com/support/CASAC_RG_en). ROMPaq utility The ROMPaq utility enables you to upgrade the system firmware (BIOS).
NOTE: The server ships with the same version programmed on each side of the ROM. Safety and security benefits When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM.
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website (http://www.hp.com/go/hpsim). HP operating systems and virtualization software support for ProLiant servers For information about specific versions of a supported operating system, see the HP website (http://www.hp.com/go/ossupport).
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
System battery replacement If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Vietnam compliance marking notice This marking is for applicable products only. Ukraine notice Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation: • Do not try to open the module enclosure. There are no user-serviceable components inside. • Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
Acoustics statement for Germany (Geräuschemission) Schalldruckpegel LpA < 70 dB(A) Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation) Nach ISO 7779:1999 (Typprüfung) Regulatory compliance notices 88
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (non-condensing) Operating, maximum wet bulb 10% to 90% temperature of 28°C (82.4°F) Non-operating, maximum wet 5% to 95% bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
HP 350 W 4U Integrated Power Supply Specification Value Input requirements — Rated input voltage 100 V AC to 240 V AC Rated input frequency 47 Hz to 63 Hz Rated input current 6A Rated input power 440 W at 100 V AC input 440 W at 200 V AC input Efficiency No less than 82% at 100% load No less than 85% at 50% load No less than 82% at 20% load Power supply output — Rated steady-state power 350 W at 100 V AC input 350 W at 200 V AC input Maximum peak power 400 W at 100 V AC input 400 W at 200
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 98
Support and other resources 99
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility AMP Advanced Memory Protection ASR Automatic Server Recovery BMC baseboard management controller BSMI Bureau of Standards, Metrology and Inspection CE Conformité Européenne (European Conformity) CSA Canadian Standards Association CSR Customer Self Repair DDR double data rate EMI electromagnetic interference FBWC flash-backed write cache Acronyms and abbreviations 100
FCC Federal Communications Commission HP CS HP Common Slot (power supply) HP SIM HP Systems Insight Manager HP SUM HP Smart Update Manager IEC International Electrotechnical Commission iLO Integrated Lights-Out IML Integrated Management Log ISO International Organization for Standardization LFF large form factor LRDIMM load reduced dual in-line memory module NMI nonmaskable interrupt NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe Peripheral Component Interconnect Express
PDU power distribution unit POST Power-On Self Test PXE preboot execution environment RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack RF radio frequency RFI radio frequency interference RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor SPP HP Service Pack for ProLiant Acronyms and abbreviations 102
TMRA recommended ambient operating temperature TPM Trusted Platform Module UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 103
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Index A D access panel 20, 21 air baffle 21, 22 Array Configuration Utility (ACU) 74 ASR (Automatic Server Recovery) 76 authorized reseller 92 auto-configuration process 73 Automatic Server Recovery (ASR) 76 dedicated iLO management connector 52, 53 device numbers 14 diagnostic tools 67, 70, 76 diagnostics utility 70 DIMM identification 45 DIMM slot locations 12 DIMMs 46, 47 DIMMs, installing 47 DIMMs, single- and dual-rank 46 drive LEDs 15 drivers 77 drives 14, 15, 30, 32, 33, 37, 42 drives, installing
G grounding methods 89 grounding requirements 25 guidelines 30 H hardware options installation 30 health driver 76 help resources 92 Hot-plug SAS/SATA hard drive cabling 61 HP Insight Diagnostics 70 HP Insight Remote Support software 71 HP Smart Update Manager overview 67, 72 HP technical support 92 I identification number 82 iLO (Integrated Lights-Out) 52, 53, 67, 68, 69 IML (Integrated Management Log) 67, 69 Insight Diagnostics 70, 77 Insight Remote Support Software 71 installation services 24, 27 insta
Q QuickSpecs 67 R rack installation 24, 27 rack resources 24 rack warnings 26 RBSU (ROM-Based Setup Utility) 67, 72, 73, 74 rear components 9 rear panel buttons 10 rear panel components 9 rear panel LEDs 10 recovering a lost password 56 redundant power supply cabling 65 redundant ROM 76 re-entering the server serial number 74 registering the server 29 regulatory compliance notices 82 removing the access panel 20 replacing the batteries 80 required information 92 retaining the recovery key/password 56 ROM r
