HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide September 2003 (Second Edition) Part Number 316336-002
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Contents About This Guide Audience Assumptions............................................................................................................................... vii Technician Notes........................................................................................................................................ vii Where to Go for Additional Help.................................................................................................................ix Integrated Management Log ...
Contents Expansion Board......................................................................................................................................2-28 Memory Module Guidelines ....................................................................................................................2-30 Memory Modules.....................................................................................................................................2-31 Processors and Processor Power Modules ...........
Contents HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide v
About This Guide This maintenance and service guide can be used for reference when servicing HP ProLiant ML350 Generation 3 servers. WARNING: To reduce the risk of personal injury from electric shock and hazardous energy levels, only authorized service technicians should attempt to repair this equipment. Improper repairs can create conditions that are hazardous. Audience Assumptions This guide is for service technicians.
About This Guide WARNING: To reduce the risk of electric shock or damage to the equipment: • Disconnect power from the system by unplugging all power cords from the power supplies. • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. CAUTION: To properly ventilate the system, you must provide at least 7.6 cm (3.0 in.
About This Guide Where to Go for Additional Help In addition to this guide, the following information sources are available: • User documentation • Service Quick Reference Guide • Service training guides • Service advisories and bulletins • QuickFind information services • Insight Manager software Integrated Management Log The server includes an integrated, nonvolatile management log that contains fault and management information.
1 Illustrated Parts Catalog This chapter provides the illustrated parts breakdown and spare parts lists for the HP ProLiant ML350 Generation 3 server. Refer to Table 1-1, and Table 1-2 for the names of referenced spare parts.
Illustrated Parts Catalog Mechanical Parts Exploded View 2c 1 2a 2b 6 10 7 5a 5b 5b 9 4 3 8 Figure 1-1: Mechanical parts exploded view 1-2 HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide
Illustrated Parts Catalog Mechanical Spare Parts List Table 1-1: Mechanical Spare Parts List Item Description Spare Part Number Chassis 1 Bezel door (tower model only) 322315-001 2 Cover kit 216104-001 a) Hood panel (tower model only) b) Access panel c) Top panel 3 Hot-plug hard drive cage 262171-001 4 Hot-plug hard drive blank 122759-001 5 Miscellaneous plastics kit 250843-001 a) Expansion board retainer b) Feet (4) (tower model only) c) Expansion board guide* d) Retainer clips* 6 Power
Illustrated Parts Catalog System Components Exploded View 19 15 11 16 14 13 20 18 22 17 21 23 12 Figure 1-2: System components exploded view 1-4 HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide
Illustrated Parts Catalog System Components Spare Parts List Table 1-2: System Components Spare Parts List Item Description Spare Part Number 11 CPU fan module, 120 mm 301017-001 12 I/O fan module, 92 mm 289562-001 Boards 13 14 System board 400 MHz 292234-001 System board 533 MHz* 322318-001 Power supply backplane board with cover 292235-001 Mass storage devices 15 IDE CD-ROM drive (48X) 288894-001 16 Diskette drive 233409-001 17 Hot-plug hard drive cage 262171-001 Power 18 Power
Illustrated Parts Catalog Table 1-2: System Components Spare Parts List continued Item Description Spare Part Number Miscellaneous 24 Enhanced keyboard (carbon)* 311059-001 25 Mouse (carbon)* 311060-001 26 Signal cable kit* 163353-001 a) IDE ribbon cable assembly b) Diskette drive cable assembly c) Removable media device SCSI cable 27 SCSI Point-to-Point cable* 292232-001 28 Return kit (tower model only)* 249929-001 29 Return kit (rack model only)* 250189-001 30 Country kit for 400-MH
2 Removal and Replacement Procedures This chapter provides subassembly/module-level removal and replacement procedures for the HP ProLiant ML350 Generation 3 server. After completing any removal or replacement procedure, run the diagnostics program to verify that all components operate properly. To service the server, a Torx T-15 screwdriver may be needed.
Removal and Replacement Procedures Electrostatic Discharge Information An electrostatic discharge (ESD) can damage static-sensitive devices or microcircuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. To prevent electrostatic damage, observe the following precautions: 2-2 • Transport products in static-safe containers such as conductive tubes, bags, or boxes. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Removal and Replacement Procedures Symbols on Equipment These symbols may be located on equipment in areas where hazardous conditions may exist. WARNING: This symbol, in conjunction with any of the following symbols, indicates the presence of a potential hazard. The potential for injury exists if warnings are not observed. Consult your documentation for specific details. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.
Removal and Replacement Procedures Preparation Procedures WARNING: Only authorized technicians trained by HP should attempt to repair this equipment. Because of the complexity of the individual boards and subassemblies, no one should attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create a safety hazard. CAUTION: Electrostatic discharge (ESD) can damage electronic components.
Removal and Replacement Procedures To power down the server: 1. Press the power button to toggle to Standby. This places the server in standby mode, disabling the main power supply output and providing auxiliary power to the server. Standby does not completely disable or remove power from the system. 2. Be sure that the system LED closest to the right on the front panel is amber and that the fan noise has stopped. 3. Disconnect the AC power cord from the AC outlet, and then from the server. 4.
Removal and Replacement Procedures Bezel Door (Tower Model Only) To remove the bezel door: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. If the keylock is locked, unlock the bezel door using the included key (1). 3. Open the bezel door fully to the right (2). 4. Lift the bezel door and then pull it away from the chassis (3). 3 2 1 Figure 2-1: Removing the bezel door (tower model only) To replace the bezel door, reverse steps 3 and 4.
Removal and Replacement Procedures Access Panel To remove the access panel: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door fully to the right. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Loosen the two thumbscrews located on the left of the front chassis (1). 4. Slide the access panel back about 1.5 cm (0.5 inch), then lift and remove the panel (2).
Removal and Replacement Procedures Bezel (Rack Model Only) To remove the bezel: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Loosen the thumbscrews holding the chassis in the rack (1). 3. Fully extend the chassis from the rack.
Removal and Replacement Procedures 4. Loosen the access panel thumbscrews (1). 5. Slide the access panel back about 1.5 cm (0.5 inch), then lift and remove the panel (2). 2 1 Figure 2-4: Loosening the access panel thumbscrews 6. Loosen the two thumbscrews securing the rack bezel to the chassis.
Removal and Replacement Procedures 7. Pull the bezel up and away from the chassis. Figure 2-6: Removing the bezel (rack model only) To replace the bezel, reverse steps 2 through 7.
Removal and Replacement Procedures Removable Media Device Blank IMPORTANT: To install a removable media device or a hard drive for the first time, the removable media device blank must be removed from an available removable media bay. To remove a removable media device blank from the front chassis: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3.
Removal and Replacement Procedures Cable Routing Diagrams Figure 2-8 through Figure 2-11 show the cable routing for the server. CAUTION: When routing cables, be sure that the cables are not in a position where they can be pinched or crimped.
Removal and Replacement Procedures IDE CD-ROM Drive Signal Cable Figure 2-9: IDE CD-ROM drive signal cable routing Removable Media Device Cable 2 1 Figure 2-10: Removable media device cable routing Table 2-1: Removable Media Device Cable Routing Item Description 1 Signal cable 2 Power cable HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide 2-13
Removal and Replacement Procedures SCSI Point-to-Point Cable Figure 2-11: SCSI LVD Point-to-Point cable routing 2-14 HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide
Removal and Replacement Procedures Air Baffle To remove the air baffle: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Loosen the thumbscrew (1) and remove the PCI card retainer. 5. Loosen the thumbscrew that secures the air baffle to the server chassis (2). 6.
Removal and Replacement Procedures System Fan Modules To remove the system CPU fan module: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Remove the air baffle. Refer to “Air Baffle” earlier in this chapter. 5. Disconnect the system CPU fan cable (1) from the system board.
Removal and Replacement Procedures 6. Loosen the thumbscrew securing the system CPU fan module to the chassis (1). 7. Carefully pull the system CPU fan module away from and out of the chassis (2). 1 2 Figure 2-14: Removing the system CPU fan module To replace the system CPU fan module, reverse steps 2 through 7.
Removal and Replacement Procedures To remove the front I/O system fan module: 1. Disconnect the I/O fan cable from the system board (2). Refer to Figure 2-13. 2 1 Figure 2-15: Removing the system I/O fan module 2. Loosen the thumbscrew securing the I/O fan module to the chassis (1). 3. Carefully lift the I/O fan module out and away from the chassis (2). To replace the I/O fan module, reverse steps 1 through 3.
Removal and Replacement Procedures Drive Bay Configuration The server supports a maximum of ten internal drive bays (four are for removable media devices; six are for hot-plug hard drives). The removable media device bays contain a one-third height, 1.44-MB diskette drive; a one-half height IDE CD-ROM drive; and two empty half-height drive bays. The empty bays may be used for a DVD-ROM drive, tape drive, non-hot-pluggable hard drive, any SCSI device or a 2-bay SCSI drive cage, including a DLT tape drive.
Removal and Replacement Procedures Hot-Plug Hard Drive Blank NOTE: The server does not need to be powered off to complete this operation. To remove a hot-plug hard drive blank: 1. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 2. Slide the release latch to the left (1), and then pull the hot-plug drive blank out of the drive bay (2). 1 2 Figure 2-17: Removing a hot-plug hard drive blank To replace a hot-plug hard drive blank, reverse steps 1 and 2.
Removal and Replacement Procedures Hot-Plug Hard Drive NOTE: The server does not need to be powered off to complete this operation. To remove a hot-plug hard drive: 1. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 2. Slide the hard drive release latch (1) to open the ejector lever (2). 3. Pull the hot-plug hard drive out of the drive bay.
Removal and Replacement Procedures Hot-Plug Hard Drive Cage To remove a hot-plug hard drive cage: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Remove the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Disconnect the power cable from the back of the hot-plug hard drive cage (1). 5.
Removal and Replacement Procedures 6. Remove all drive blanks and hard drives. Refer to “Hot-Plug Hard Drive Blank” and “Hot-Plug Hard Drive” earlier in this chapter. 7. Remove the four screws securing the drive cage to the chassis with a Torx T-15 screwdriver (1). 8. Pull the hot-plug hard drive cage out from the chassis (2). 1 2 1 1 Figure 2-20: Removing a hot-plug hard drive cage To replace a hot-plug hard drive cage, reverse steps 2 through 8.
Removal and Replacement Procedures Removable Media Device To remove a removable media device: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Disconnect the cables from the back of the removable media device and the system board.
Removal and Replacement Procedures 5. While pushing up the drivelock (1), pull the removable media device out of the bay (2).
Removal and Replacement Procedures To replace removable media devices, other than HP StorageWorks AIT or SDLT tape drives, insert the device into the bay until it clicks into place. CAUTION: Install all other options and blanks prior to installing the tape drive. CAUTION: If you are replacing HP StorageWorks AIT or SDLT tape drives, be sure to replace the left rear mounting screw with a Torx T-8 drive screw. Failure to do so prevents proper installation and can damage the tape drive.
Removal and Replacement Procedures Expansion Slots 1 2 3 4 5 Figure 2-24: Expansion slot locations Table 2-3: Expansion Slots Item Slot Slot Number 1 64-bit 100-MHz PCI-X, 3.3-V, bus 2 1 2 64-bit 100-MHz PCI-X, 3.3-V, bus 2 2 3 64-bit 100-MHz PCI-X, 3.3-V, bus 5 3 4 64-bit 100-MHz PCI-X, 3.3-V, bus 5 4 5 32-bit 33-MHz PCI, 5-V 5 Note: Slots 1, 2, 3 and 4 are optimized for PCI-X 100 add-in cards.
Removal and Replacement Procedures Expansion Board To remove an expansion board: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Disconnect any cables connected to the expansion board. 5. If an expansion board retainer is in place: a.
Removal and Replacement Procedures 6. Press on the top of the expansion slot latch (1) and open the latch toward the rear of the chassis (2). 7. Remove the expansion board (3). 8. Close the expansion slot latch. 9. Replace the expansion board retainer if the expansion board is not immediately being replaced. 2 1 3 Figure 2-26: Removing the expansion board To replace an expansion board, reverse steps 2 through 9.
Removal and Replacement Procedures Memory Module Guidelines CAUTION: To prevent damage to equipment or loss of information, make sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded (earthed) AC outlet before removing the access panel. CAUTION: To prevent damage to the system when handling components, refer to the HP ProLiant ML350 Generation 3 Server Setup and Installation Guide.
Removal and Replacement Procedures • Do not mix ECC and non-ECC DIMMs. If different types of DIMMs are mixed, the system will not properly function. • A DIMM will only fit one way in the socket. Be sure to match the two key slots in the DIMM with the tabs in the DIMM socket. Push the memory module into the DIMM socket, ensuring that it is fully inserted and properly seated. Memory Modules CAUTION: Electrostatic discharge (ESD) can damage electronic components.
Removal and Replacement Procedures Processors and Processor Power Modules 1 2 3 4 Figure 2-29: Processor and Processor Power Module (PPM) locations Table 2-4: Processor and Processor Power Module (PPM) Locations 2-32 Item Description 1 PPM socket 1 (populated) 2 Processor socket 1 (populated) 3 Processor socket 2 4 PPM socket 2 HP ProLiant ML350 Generation 3 Server Maintenance and Service Guide
Removal and Replacement Procedures Processor CAUTION: Electrostatic discharge (ESD) can damage electronic components. Be sure that you are properly grounded (earthed) before beginning any installation procedure. Refer to “Electrostatic Discharge Information” earlier in this chapter. To remove a processor: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3.
Removal and Replacement Procedures 7. Rotate the processor cage upward. Figure 2-31: Rotating the processor cage 8. Rotate the processor-locking lever to release the processor.
Removal and Replacement Procedures 9. Remove the processor/heatsink assembly from the socket. Figure 2-33: Removing the processor/heatsink assembly CAUTION: Failure to fully open the processor locking lever will prevent the processor from seating properly during installation and can potentially lead to hardware damage. CAUTION: To prevent possible server malfunction, be sure to completely close the processor locking lever. To replace the processor, reverse steps 2 through 9.
Removal and Replacement Procedures Processor Power Module WARNING: To reduce the risk of personal injury from hot surfaces, allow the internal system components to cool before touching them. To remove a Processor Power Module (PPM): 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4.
Removal and Replacement Procedures System Board To remove the system board: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Remove the air baffle. Refer to “Air Baffle” earlier in this chapter. IMPORTANT: For tower models, lay the system on the right side. 5. Remove the CPU fan module.
Removal and Replacement Procedures IMPORTANT: The server serial number must be re-entered through RBSU after replacing the system board. Refer to “Re-entering the Server Serial Number” in this chapter. Re-entering the Server Serial Number After replacing the server host module or clearing the NVRAM, the server serial number must be re-entered. To re-enter the serial number: During the server startup sequence, press the F9 key to access RBSU. 1. Select the System Options menu. 2. Select Serial Number.
Removal and Replacement Procedures System Battery The server uses nonvolatile memory that requires a battery to retain system information when power is removed. The battery is on the system board. System Board Battery If the server no longer automatically displays the correct date and time, the system board battery that provides power to the real-time clock may need to be replaced. Under normal use, battery life is 5 to 10 years. WARNING: The system board contains a lithium battery.
Removal and Replacement Procedures To replace the system board battery: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Open the bezel door. Refer to “Bezel Door (Tower Model Only)” earlier in this chapter. 3. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 4. Locate the battery on the system board. 5. Press the battery release lever away from the battery (1). 6. Lift the battery up from that side and out of its holder (2).
Removal and Replacement Procedures Power Supply To remove the power supply: IMPORTANT: The power supply of the server is hot-pluggable. When removing a power supply, do not power down the server when the redundant power supply option is used. 1. Remove the power cord from the power supply to be removed from the server. 2. Push down on the power supply release latch (1). 3. Slide the power supply out of the server (2).
Removal and Replacement Procedures Power Supply Backplane Board To remove the power supply backplane board: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Remove the access panel. Refer to “Access Panel” earlier in this chapter. 3. Remove any installed power supplies. Refer to “Power Supply” in the previous section. 4. Remove all cables from the power supply backplane board. 5.
Removal and Replacement Procedures Feet (Tower Model Only) To remove the four feet from the chassis, one at a time: 1. Complete the preparation procedures. Refer to “Preparation Procedures” earlier in this chapter. 2. Place the server upside down. 3. Remove the Torx T-15 screw that secures each foot to the chassis (1). 4. Lift up the other end of each foot (2) and pull it off the base of the chassis (3).
3 Diagnostic Tools This chapter provides an overview of the software and firmware diagnostic tools available for the HP ProLiant ML350 Generation 3 server. Diagnostic Tools Utility Overview The following utilities were developed to assist in diagnosing problems, testing the hardware, and monitoring and managing the server hardware. Table 3-1: Diagnostic Tools Tool Description How to run it Diagnostics Utility Utility to assist testing and/or verifying operation of HP hardware.
Diagnostic Tools Table 3-1: Diagnostic Tools continued Tool Description How to run it Survey Utility An online information-gathering program that runs on servers, gathering critical hardware and software information from various sources. A utility for servers running Microsoft Windows NT, Linux, or Novell NetWare. Survey Utility automatically runs at startup and user-specified time intervals. Modify the command-line parameters to change the datagathering interval.
Diagnostic Tools Table 3-1: Diagnostic Tools continued Tool Description How to run it System Firmware Update Utility that enables Windows NT 4 and Windows 2000 to efficiently update system and array controller ROMs on remote servers from a central location. Latest maintenance ROM executable file can be downloaded from www.hp.com/servers/proliant/manage ROM-Based Setup Utility (RBSU) Utility used to configure some hardware installed in or connected to the server.
Diagnostic Tools Table 3-1: Diagnostic Tools continued Tool Description How to run it INSPECT A utility that provides a report detailing system information. INSPECT can be run from the Diagnostics program. Integrated Management Log (IML) A log of system events, such as system failures or nonfatal error conditions. View events in the IML from within: The IML requires operating system-dependent drivers. Refer to the Software Support CD for instructions on installing the appropriate drivers.
4 Connectors, Switches, and LEDs This chapter contains illustrations and tables identifying and describing connectors, switches, and LED locations on the front panel, rear panel, system board and hard drives for the HP ProLiant ML350 Generation 3 server.
Connectors, Switches, and LEDs Connectors and Components This section contains illustrations and tables identifying connector locations and components on the server rear panel and system board. Rear Panel Components Figure 4-1 and Table 4-1 show and describe the location of the components on the rear panel of the server.
Connectors, Switches, and LEDs System Board Components Figure 4-2 and Table 4-2 show and describe the location of the components on the server system board.
Connectors, Switches, and LEDs Switches System Configuration Switch Settings The server system board has two sets of switches, an 8-position configuration switch and a 4-position system ID switch. Figure 4-3, Table 4-3, and Table 4-4 show and describe the use of each switch.
Connectors, Switches, and LEDs Table 4-3: System Configuration Switch Settings Switch Default Position Function Description Settings 1 Off Reserved N/A N/A 2 Off Lock configuration Enables or disables the ability to write to NVRAM to reconfigure the system Off = Configuration may be changed.
Connectors, Switches, and LEDs Resetting System Configuration Settings It may be necessary at some time to clear and reset system configuration settings. When the system configuration switch position 6 is set to the on position, the system is prepared to erase all system configuration settings from both CMOS and nonvolatile RAM (NVRAM): IMPORTANT: Clearing NVRAM deletes the configuration information.
Connectors, Switches, and LEDs LEDs Several status LEDs and buttons are located on the front and back of the server. Problem diagnosis is aided by the LEDs that indicate the status of the components and operations of the server. LEDs are also located on the system board.
Connectors, Switches, and LEDs Power Button, System Status LEDs, and Unit Identification Button The power button, system status LEDs, and Unit Identification (UID) button are located on the front of the server. The power button: • Powers up the server. • Places the server in standby mode. • Powers down the server.
Connectors, Switches, and LEDs 1 2 5 3 4 6 7 Figure 4-4: Power button, system status LEDs, and UID button Table 4-5: Power Button, System Status LEDs, and Unit Identification Button Item Description Status Description 1 UID button N/A Allows the user to activate or deactivate unit identification. Pushing the button activates unit identification, shown by the blue UID LED, so that the onsite administrator can identify a particular server.
Connectors, Switches, and LEDs Table 4-5: Power Button, System Status LEDs, and Unit Identification Button continued Item 5 6 7 Description Status Description NIC LED Off No connection Green Linked to network Flashing green System linked and activity present on network Off System off, no AC power Amber System is shut down but power is applied Green System is on with AC power applied N/A Allows the user to power up the server, place the server in standby mode, and power down the server.
Connectors, Switches, and LEDs System Board LEDs Figure 4-5 and Table 4-6 show and describe LEDs on the system board of the server that indicate when a processor, PPM, memory module, or fan fails. System board LEDs also indicate when the Server Feature Board is not properly seated or when a thermal threshold is exceeded.
Connectors, Switches, and LEDs Table 4-6: System Board LEDs continued Item 5 Description Status I/O fan status Off = Fan functioning Amber = Fan is not installed or has failed 6 Processor 2 status Off = Processor 2 functioning Amber = Processor 2 failed 7 Processor 2 thermal Off = Normal Amber = Thermal trip detected for processor 2. Refer to the HP ProLiant ML350 Generation 3 Server Setup and Installation Guide for the appropriate instructions.
Connectors, Switches, and LEDs Hot-Plug Hard Drive LEDs The hot-plug SCSI hard drive LEDs, located on each physical drive, are visible on the front of the server or external storage unit. They provide status information regarding drive activity (1), connectivity (2), and fault (3) status for each corresponding drive when configured as part of an array and connected to an array controller. Their behavior may vary, depending on the status of other drives in the array.
Connectors, Switches, and LEDs Table 4-7: Hot-Plug SCSI Hard Drive LED Combinations Activity Online Fault Meaning On Off Off Do not remove the drive. Removing a drive during this process causes data loss. The drive is being accessed and is not configured as part of an array. On Flashing Off Do not remove the drive. Removing a drive during this process causes data loss. The drive is rebuilding or undergoing capacity expansion. Flashing Flashing Flashing Do not remove the drive.
Connectors, Switches, and LEDs Table 4-7: Hot-Plug SCSI Hard Drive LED Combinations continued Activity Online Fault Meaning Off On Off OK to replace the drive online if a predictive failure alert is received (refer to the “Predictive Failure Alert” section in the HP Servers Troubleshooting Guide for details), provided that the array is configured for fault tolerance and all other drives in the array are online. The drive is online and is configured as part of an array.
Connectors, Switches, and LEDs Network Interface Controller LEDs The NIC LEDs are located on the back of the server. They provide the following information: • The speed at which the network is being accessed • If the server is linked to the network • If there is current network activity Refer to the HP Servers Troubleshooting Guide for more information on troubleshooting network controller problems.
5 Physical and Operating Specifications This chapter provides physical and operating specifications for the HP ProLiant ML350 Generation 3 server. The following specifications are provided: • System unit • Rack server system unit • Memory • 1.
Physical and Operating Specifications System Unit Table 5-1: System Unit Specifications Item Description Height (without feet) 44.5 cm (17.5 in) Height (with feet) 46.99 cm (18.5 in) Depth (without bezel) 60.96 cm (24.0 in) Depth (with bezel) 66.04 cm (26.0 in) Width (without feet) 21.59 cm (8.5 in) Width (with feet) 26.04 cm (10.25 in) Weight (no drives installed) 27.24 kg (60.
Physical and Operating Specifications Rack Server System Unit Table 5-2: Rack Server System Unit Specifications Feature International Units (English Units) Dimensions Height 21.87 cm (8.61 in) Depth 60.96 cm (24 in) Width 48.26 cm (19.0 in) Weight (no drives installed) 27.24 kg (60 lb) Input requirements Rated input voltage 200 VAC to 240 VAC (100 VAC to 120 VAC) Rated input frequency 50 Hz to 60 Hz Rated input current 3.7 A (7.
Physical and Operating Specifications Memory Table 5-3: Memory Specifications Item Description Size 256 MB, 512 MB, 1 GB and 2 GB Speed 200/266 MHz Type PC2100 ECC Registered DDR SDRAM DIMMs Note: DIMMs must be industry-standard 184-pin PC2100 DDR DIMMs. The DDR DIMMs must support CAS Latency 2 or greater. They must also contain the mandatory Joint Electronic Device Engineering Council (JEDEC) Serial Presence Detect (SPD). 1.44-MB Diskette Drive Table 5-4: 1.
Physical and Operating Specifications IDE CD-ROM Drive Table 5-5: IDE CD-ROM Drive Specifications Item Description Capacity 540 MB (mode 1, 12 cm) 650 MB (mode 2, 12 cm) Block size 2,048 bytes (mode 1); 2,340; 2336 bytes (mode 2); 2,352 bytes (CD-DA); 2,328 (CD-XA) Dimensions Height 12.7 mm (0.5 in) Width 130 mm (5.11 in) Depth 131 mm (5.16 in) Weight <1,200 g (<42.
Physical and Operating Specifications Wide Ultra3 SCSI Hot-Plug Hard Drives Table 5-6: Wide Ultra3 SCSI Hard Drive Specifications Item 9-GB Drive 18-GB Drive 36-GB Drive 72-GB Drive Capacity 9100.0 MB 18,209.8 MB 36,419.6 MB 72,839.2 MB Height One-third, 1.0 in One-third, 1.0 in One-third, 1.0 in One-third, 1.0 in Size 3.5 in 3.5 in 3.5 in 3.
Physical and Operating Specifications Integrated Dual Channel Wide Ultra3 SCSI Adapter Table 5-8: Integrated Dual Channel Wide Ultra3 SCSI Adapter Specifications Item Description Protocol Wide Ultra160 SCSI, Wide Ultra3 SCSI, Wide Ultra SCSI, Fast-Wide SCSI-2, and Fast SCSI-2 Compatibility All PCI server configurations are backward compatible with Fast, Fast-Wide SCSI-2, Wide Ultra2 SCSI, and Wide Ultra3 SCSI devices Drives supported Up to 15 SCSI devices per channel Data transfer method 32-bit PC
Physical and Operating Specifications Remote Insight Lights-Out Edition II Option Board Table 5-9: Remote Insight Lights-out Edition II Option Board Specifications 5-8 Item Description Architecture 32-bit PCI-based remote management board (For the ProLiant ML350 Generation 3 server, install the board in the 32-bit PCI slot.
Index A AC power, caution 4-10 access panel part number 1-3 removing 2-7 replacing 2-7 ADU (Array Diagnostics Utility) 3-4 air baffle part number 1-3 removing 2-15 replacing 2-15 Array Diagnostics Utility See ADU ASR (Automatic Server Recovery), running 3-3 B battery handling, warning 2-39 part number 1-5 system board 2-39 system board, location 2-40 system board,replacing 2-40 bezel (rack) part number 1-3 removing 2-8 removing, illustrated 2-10 replacing 2-10 bezel door (tower) part number 1-3 removing 2
Index sensitive parts 2-2 storing 2-2 tools recommended 2-2 transporting 2-2 work area recommendations 2-2 event log described 3-4 viewing 3-4 expansion board removing 2-28 replacing 2-29 expansion board guide, part number 1-3 expansion board retainer part number 1-3 removing, illustrated 2-28 exploded view, mechanical parts 1-2 hot-plug hard drive cage part number 1-3, 1-5 removing 2-22 replacing 2-23 HP authorized reseller ix HP Insight Manager 3-1 I F fan See system fan module feet part number 1-3 re
Index external health 4-9 hard drive , table of combinations 4-14, 4-15 hard drive activity, defined 4-14, 4-15 hard drive fault 4-14, 4-15 hard drive online 4-14, 4-15 hot-plug hard drive, illustrated 4-13 I/O fan status 4-12 internal health 4-9 network activity 4-16 network link 4-16 network speed, illustrated 4-16 NIC (Network Interface Connector) 4-10 NIC, illustrated 4-16 NIC, summary 4-16 overview 4-7 Power On/Standby 4-10 power supply 4-11 PPM 1 status 4-11 PPM 2 status 4-12 processor 1 status 4-11
Index transporting 2-2 PCI boards, configuring automatically 3-3 personal injury, warning 2-4 POST described 3-3 running 3-3 power button location 4-10 positions 2-4 summary 4-8 power cords, disconnecting, warning 2-4 power fluctuations, caution 2-4 Power On/Standby status, LED 4-10 power sources symbol 2-3 power supply blank, part number 1-3 LED 4-11 removing 2-41 replacing 2-41 power supply backplane board part number 1-5 removing 2-42 replacing 2-42 power supply backplane board cover, part number 1-3 po
Index symbols on equipment 2-3 system board components 4-3 configuration switch settings 4-5 ID switch settings 4-5 LEDs 4-11 part number 1-5 removing 2-37 replacing 2-38 switches 4-4 system components exploded view 1-4 illustrated 1-4 spare parts list 1-5, 1-6 system configuration switch CMOS, clearing 4-6 location 4-4 NVRAM, clearing 4-6 settings 4-5 system fan modules, connector locations 2-16 System Firmware Update 3-3 system status LEDs location 4-9 summary 4-8 system unit acoustic noise 5-2 input vol
