HP ProLiant ML370 Generation 5 Server Maintenance and Service Guide June 2006 (First Edition) Part Number 404682-001
© Copyright 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express limited warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Contents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog ............................................................................................................... 15 Mechanical components..............................................
Diskette drive cabling .............................................................................................................................. 66 SAS cabling ........................................................................................................................................... 67 CD-ROM drive cabling............................................................................................................................. 68 Video cabling .........................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair). Servicio de garantía exclusivo de componentes La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes.
Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen. Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Customer self repair 11
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog In this section Mechanical components ......................................................................................................................... 16 System components ................................................................................................................................
Mechanical components Item Description Assembly part number Spare part number Customer self repair (on page 5) 1 Access panel (top cover) 389059-001 409410-001 Mandatory1 2 Front bezel (tower model only) 389070-001 409411-001 Optional2 3 Rack bezel (rack model only) 389064-001 409412-001 Optional2 4 Tower configuration panels — 409413-001 — Illustrated parts catalog 16
Description Assembly part number Spare part number Customer self repair (on page 5) a) Wrap-around panel 389077-001 — Mandatory1 b) Top cover 389078-001 — Mandatory1 5 Center wall 384886-001 409433-001 Optional2 6 Removable media blank 394777-001 409414-001 Mandatory1 7 Media bay spacer 389079-001 409415-001 Mandatory1 8 SAS drive cage blank 393850-001 409416-001 Mandatory1 9 Hard drive blank 376383-001 392613-001 Mandatory1 10 Power supply blank 394436-001 409417-001
1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario.
Illustrated parts catalog 19
System components Item Description Assembly part number Spare part number Customer self repair (on page 5) System components 14 Hot-plug power supply, 1000 W 380622-001 403781-001 Optional2 15 Hot-plug fan, 120 mm 384881-001 409421-001 Optional2 16 3.
Item 18 Description Assembly part number Spare part number Customer self repair (on page 5) a) Dual-core, Intel® Xeon™ Processor 5050 (3.00-GHz, 667-MHz FSB, 2x2MB L2 cache)† 405176-004 409423-001 Optional2 b) Dual-Core, Intel® Xeon™ Processor 5060 (3.20-GHz, 1066-MHz FSB, 2x2-MB L2 cache)*† 398571-002 409424-001 Optional2 c) Dual-Core, Intel® Xeon™ Processor 5080 (3.73-GHz, 1066-MHz FSB, 2x2-MB L2 cache)*† 398571-001 412955-001 Optional2 d) Dual-Core, Intel® Xeon™ Processor 5110 (1.
Description Assembly part number Spare part number Customer self repair (on page 5) b) Receptacle, door snap, stone* 148525-004 — Optional2 c) PCI retainer, card guide* 250967-004 — Optional2 d) Clip, cable, adhesive, 1.77-in* 241347-007 — Optional2 e) Clip, retainer, 0.
Description Assembly part number Spare part number Customer self repair (on page 5) c) 60-GB SATA, 5,000-rpm* 379306-B21 382264-001 Optional2 40 Keyboard* 382641-001 382925-001 Mandatory1 41 Mouse* 334684-003 390937-001 Mandatory1 42 AC power cord* 163719-002 187335-001 Mandatory1 43 x4/x8 PCI bus expander* 012772-001 411009-001 Optional2 44 HP Smart Array E200 Controller* 012891-001 412799-001 Optional2 45 HP Smart Array E200 Controller cache module, 64-MB without battery*
1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
Illustrated parts catalog 25
Removal and replacement procedures In this section Required tools........................................................................................................................................ 26 Safety considerations.............................................................................................................................. 27 Preparation procedures...........................................................................................................................
Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system. Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks.
Power down the server WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. 1. Shut down the OS as directed by the OS documentation. 2.
3. Extend the server from the rack. Reverse the server installation steps in the documentation that ships with the rack-mounting option. 4. Press the server rail-release latches and remove the server from the rack. 5. Place the server on a sturdy, level surface. Front bezel Tower servers have a removable front bezel that must be unlocked and opened before accessing the hard drive cage, and before removing the access panel. To remove the component: 1. Open the front bezel (tower servers only).
Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the component: 1. Power down the server (on page 29). 2.
4. Remove the rack bezel. To replace the component, reverse the removal procedure. Feet NOTE: This procedure applies to tower servers only. To remove the component: 1. Power down the server (on page 29). 2. Place the server on its side. 3. Remove the feet. To replace the component, slide it back into the locking slot. Be sure that the foot clicks securely into the chassis. Repeat with the remaining feet, as necessary.
Tower configuration panels To remove the component: 1. Power down the server (on page 29). 2. Remove the tower feet ("Feet" on page 32). 3. Remove the tower configuration panels: a. Use the T-10/T-15 Torx screwdriver to remove the two front panel screws. b. Remove the tower configuration panels. To replace the component, reverse the removal procedure. Rack rails NOTE: This procedure applies to rack servers only. To remove the component: 1. Power down the server (on page 29). 2.
5. Remove the rail. 6. Repeat the steps to remove the other rail. To replace the component, reverse the removal procedure. Power supply blank CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies. Remove the component as indicated. To replace the component, reverse the removal procedure.
Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part. CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies. To remove the component: 1. Disconnect the power cord from the AC source. 2. Remove the power cord. 3. Remove the power supply.
2. Remove the blank. To replace the component, reverse the removal procedure. Hard drive To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 83). 2. Back up all server data on the hard drive. 3. Remove the hard drive.
Hard drive cage and backplane To remove the component: 1. Power down the server (on page 29). 2. Do one of the following: • Open or remove the tower bezel, as needed ("Front bezel" on page 30). • Extend the server from the rack (on page 29). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the rack bezel (rack servers only) ("Rack bezel" on page 31). 5. Remove all hard drives ("Hard drive" on page 36) and hard drive blanks ("Hard drive blank" on page 35). 6.
8. Remove the four screws that secure the drive cage to the chassis. 9. Remove the SAS cage. To replace the component, reverse the removal procedure. System fans The server supports redundant hot-plug fans to provide proper airflow to the system if a primary fan fails. In the standard configuration, fans 1, 2, and 3 cool the server. For the redundant configuration, fans 4, 5, and 6 are added to back up the primary fans.
3. Remove the fan. To replace the component, reverse the removal procedure. Expansion slot cover To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 29). 3. Remove the access panel ("Access panel" on page 31). 4. Press the slot release lever and swing the slot release lever upward. 5. Remove the expansion slot cover. Retain the slot cover for future use.
To replace the component, reverse the removal procedure. Expansion board CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the expansion boards. To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 29). 3. Remove the access panel ("Access panel" on page 31). 4.
CAUTION: Make a note of board locations. Be sure to install replacements in the same slots. To replace the component, reverse the removal procedure. Slot release lever To remove the component: 1. Power down the server (on page 29). 2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 29). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the expansion slot cover ("Expansion slot cover" on page 39). 5.
4. Remove the processor air baffle. To replace the component, reverse the removal procedure. Center wall To remove the component: 1. Power down the server (on page 29). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 29, "Remove the server from the rack" on page 29). 3. Remove the access panel. ("Access panel" on page 31) 4. Remove the processor air baffle ("Processor air baffle" on page 41). 5.
To replace the component, reverse the removal procedure. Media blanks To remove the component: 1. Power down the server (on page 29). 2. Open or remove the tower bezel ("Front bezel" on page 30). CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 3. Remove the media blanks. NOTE: HP recommends that you remove all media blanks to facilitate drive installation. Retain the blanks for future use.
4. Slide the media latch to release the drive and extend the drive from the bay to access the cabling. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 5. Disconnect the data and power cables from the device. 6. Remove the half-height or full-height drive. To replace the component, reverse the removal procedure. Systems Insight Display To remove the component: 1. Power down the server (on page 29).
4. Press the HP Systems Insight Display ejector button to extend the HP Systems Insight Display. 5. Disconnect the Systems Insight Display cable from the system board ("System board components" on page 80). 6. Remove two T-10 screws on the side of the Systems Insight Display. 7. Remove the Systems Insight Display. To replace the component, reverse the removal procedure. Memory boards and FBDIMMs The server utilizes two memory boards. Each memory board consists of eight slots, numbered sequentially.
WARNING: Always comply with all electrostatic and thermal guidelines to prevent bodily injury and ensure a properly functioning system when performing hot-plug operations. WARNING: To prevent personal injury from hazardous energy: • Remove watches, rings, or other metal objects. • Use tools with insulated handles. • Do not place tools or metal parts on top of batteries. Memory board To remove the component: 1. Power down the server (on page 29). 2.
6. Remove the FBDIMM. To replace the component, reverse the removal procedure. Processor CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the processor heatsink for a description of the processor. CAUTION: Be sure that you have the current version of the system ROM. Failure to flash the ROM with the correct version before installing or replacing the processor causes system failure.
6. Remove the heatsink. 7. Open the processor retaining latch and the processor socket retaining bracket.
8. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor remains inside the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the spare processor.
CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions. 3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: 7. Install the heatsink.
8. Close the heatsink retaining latches. 9. Install the processor air baffle. 10. Install the access panel. 11. Do one of the following: • Install and lock the bezel. • Slide the server back into the rack. 12. Power up the server. Heatsink To remove the component: 1. Power down the server (on page 29). 2. Do one of the following: • Unlock and remove the bezel ("Front bezel" on page 30). • Extend the server from the rack (on page 29). 3. Remove the access panel ("Access panel" on page 31).
6. Remove the heatsink. To replace the heatsink: 1. Clean the old thermal grease from the heatsink and processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. 3. Install the heatsink.
4. Close the heatsink retaining latches. 5. Install the processor air baffle. 6. Install the access panel. 7. Do one of the following: 8. • Install and lock the bezel. • Slide the server back into the rack. Power up the server. PPM To remove the component: 1. Power down the server (on page 29). 2. Do one of the following: • Unlock and remove the bezel ("Front bezel" on page 30). • Extend the server from the rack (on page 29). 3. Remove the access panel ("Access panel" on page 31). 4.
5. Remove the PPM. NOTE: The appearance of compatible PPMs may vary. To replace the component, reverse the removal procedure. CAUTION: Only install a PPM if the processor is installed. Both the PPM and the processor must be installed together, otherwise the system does not boot. IMPORTANT: PPMs do not seat if turned the wrong way. Power supply backplane To remove the component: 1. Power down the server (on page 29). 2. Do one of the following: • Unlock and remove the bezel ("Front bezel" on page 30).
8. Disconnect the signal cable from the power supply backplane. 9. Disconnect all cables from the system board, as necessary, to access the power supply backplane. 10. Remove the power supply backplane. To replace the component, reverse the removal procedure. IMPORTANT: Be sure to align the two retaining guides on the chassis with the holes on the power supply backplane when replacing it. Video connector To remove the component: 1. Power down the server (on page 29). 2.
3. Remove the access panel ("Access panel" on page 31). 4. Remove all expansion boards ("Expansion board" on page 40). 5. Remove the processor air baffle ("Processor air baffle" on page 41). 6. Remove the center wall ("Center wall" on page 42). 7. Remove the memory board ("Memory board" on page 46). 8. Disconnect the cable from the internal video connector on the system board. 9. Extend or remove the media bay spacer from the chassis. 10. Remove the video connector. 11.
BBWC battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module.
5. Remove the battery pack. To replace the component, reverse the removal procedure. System board IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server serial number through RBSU. To remove the component: 1. Power down the server (on page 29). 2. Do one of the following: • Unlock and remove the bezel ("Front bezel" on page 30). • Extend the server from the rack (on page 29). 3. Remove the access panel ("Access panel" on page 31). 4.
11. Open the processor retaining latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket. CAUTION: To avoid damage to the processor: • Handle the processor only by the edges.
15. Lift the system board out of the chassis and tilt it to one side to clear the cable guide. To replace the system board: 1. Install the spare system board in the server before installing the processor. 2. Prepare the processor socket on the spare system board: a. Open the processor retaining latch and the processor socket retaining bracket.
b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the processor socket of the failed system board. The cover protects the socket during shipping when the failed board is returned. 4. Install the processor onto the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
2. Select the System Options menu. 3. Select Serial Number. The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis. 4. Press the Enter key to clear the warning. 5. Enter the serial number and press the Enter key. 6. Select Product ID. 7.
5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Cabling In this section Cabling overview................................................................................................................................... 66 Diskette drive cabling ............................................................................................................................. 66 SAS cabling .......................................................................................................................................... 67 CD-ROM drive cabling ..........
SAS cabling NOTE: The center wall is removed for illustration purposes only.
CD-ROM drive cabling Video cabling Cabling 68
Parallel/serial port cabling BBWC option cabling Cabling 69
Internal USB connector Storage device cabling guidelines CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded (earthed) AC outlet before installing devices. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Diagnostic tools In this section Automatic Server Recovery ...................................................................................................................... 71 HP Systems Insight Manager.................................................................................................................... 71 Integrated Management Log .................................................................................................................... 71 Integrated Lights-Out 2 technology ....
• From within Survey Utility • From within operating system-specific IML viewers • For NetWare: IML Viewer • For Windows®: IML Viewer • For Linux: IML Viewer Application • From within the iLO 2 user interface • From within HP Insight Diagnostics (on page 74) For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.
HP ROM-Based Setup Utility RBSU, an embedded configuration utility, performs a wide range of configuration activities that may include: • Configuring system devices and installed options • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/servers/smartstart).
• Preparing the system for installing "off-the-shelf" versions of leading operating system software • Installing optimized server drivers, management agents, and utilities automatically with every assisted installation • Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 74) • Installing software drivers directly from the CD.
Component identification In this section Front panel components .......................................................................................................................... 75 Front panel LEDs and buttons ................................................................................................................... 77 Rear panel components........................................................................................................................... 78 Rear panel LEDs ..........
Item Description 6 DVD/CD-ROM drive 7 Removable media bays 8 Hard drive bays 1-8 • Tower model Item Description 1 Media bay spacer 2 DVD/CD-ROM drive 3 Removable media bays 4 Hard drive bays 1-8 5 Hard drive bays 9-16 (optional drive cage) 6 USB connectors 7 HP Systems Insight Display 8 HP Systems Insight Display ejector button Component identification 76
Front panel LEDs and buttons Item Description Status 1 UID button — 2 UID LED Blue = Activated Flashing blue = System is being managed remotely Off = Deactivated 3 Internal system health LED Green = Normal (system on) Amber = System health is degraded Red = System health is critical Off = Normal (system off) 4 External system health LED (power supply) Green = Normal (system on) Amber = Redundant power supply failure Red = Power supply failure. No operational power supplies.
Rear panel components Item Description 1 Keyboard connector 2 Mouse connector 3 USB connectors 4 iLO 2 management connector 5 Video connector 6 Serial connector 7 NIC 2 connector 8 PCI expansion slots 9 Hot-plug power supply (primary bay) 10 Hot-plug power supply blank (redundant bay) 11 NIC 1 connector 12 T-10/T-15 Torx screwdriver Component identification 78
Rear panel LEDs Item Description Status 1 UID LED Blue = Activated Flashing blue = system is being remotely managed Off = Deactivated 2 iLO 2 activity LED Green or flashing green = Network activity Off = No network activity 3 iLO 2 link LED Green = Linked to network Off = No network connection 4 NIC 2 activity LED Green or flashing green = Network activity Off = No network activity 5 NIC 2 link LED Green = Linked to network Off = No network connection 6 NIC 1 link LED Green = Linked to
System board components Item Description 1 PCI Express slot 1, x4 2 PCI-X slot 2, 64-bit/133-MHz 3 PCI-X slot 3, 64-bit/133-MHz 4 PCI Express slot 4, x4 5 PCI Express slot 5, x4 (optional x8 when PCIe Bus Expander is installed in slot 4) 6 PCI Express slot 6, x4 7 PCI Express slot 7, x4 (optional x8 when PCIe Bus Expander is installed in slot 6) 8 PCI Express slot 8, x4 9 PCI Express slot 9, x4 (optional x8 when PCIe Bus Expander is installed in slot 8) 10 System maintenance switch (SW
Item Description 24 Internal USB connector 25 Serial 2 connector 26 Parallel connector 27 Diskette drive connector System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled.
HP Systems Insight Display LED color Internal system health LED color Status PPM failure, slot X (amber) Red One or more of the following conditions may exist: DIMM failure, slot X (amber) Red Amber DIMM bank error (all slots in one bank, amber) DIMM failure (all slots, amber) Red Red • PPM in slot X has failed. • PPM is not installed in slot X, but the corresponding processor is installed. One or more of the following conditions may exist: • DIMM in slot X has failed.
SAS and SATA hard drive LEDs Item Description Status 1 Fault/UID LED Amber = Drive failure Flashing amber = Fault-process activity Blue = Unit identification is active Off = No fault-process activity 2 Online/activity LED Green = Drive activity Flashing green = High activity on the drive or drive is being configured as part of an array Off = No drive activity SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternating amber an
Online/activity LED (green) Fault/UID LED (amber/blue) Flashing regularly Off (1 Hz) Interpretation Do not remove the drive. Removing a drive may terminate the current operation and cause data loss. The drive is rebuilding, or it is part of an array that is undergoing capacity expansion or stripe migration. Flashing irregularly Amber, flashing regularly (1 Hz) The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible.
Item Description 8 FBDIMM slot 8, bank D Power supply backplane LED If the power supply backplane LED is illuminated, the power supply backplane has failed.
Item Description Configuration 5 Fan 5 Redundant 6 Fan 6 Redundant Systems Insight Display LEDs To view a quick reference for component identification and status, access the Systems Insight Display.
Item Description Status 9 Processor 2 LED Amber = Failure Off = Normal 10 PPM 2 LED Amber = Failure Off = Normal 11 Hot-plug fan LEDs Amber = Failure or fan is not installed 12 Internal system health LED Green = Normal (system on) Off = Normal Amber = System health is degraded Red = System health is critical Off = Normal (system off) 13 External system health LED (power supply) Green = Normal (system on) Amber = Redundant power supply failure Red = Power supply failure.
Specifications In this section Environmental specifications .................................................................................................................... 88 Server specifications ............................................................................................................................... 88 Hot-plug power supply calculations .......................................................................................................... 89 FBDIMM specifications.............
Specification Value Weight (maximum) 40.8 kg (110 lb) Weight (when lightly loaded) 24.9 kg (55 lb) Input requirements Rated input voltage 100 VAC to 240 VAC * Rated input frequency 47 Hz to 63 Hz Rated input current 10 A (100 V) to 6.
Specification Value Drives supported 1 Drive height One-third height Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mo
Specification Value Track pitch 1.6 µm (6.3 × 10-7 in) Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.
Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System DDR double data rate DIMM dual inline memory module FBDIMM fully buffered DIMM IDE integrated device electronics iLO 2 Integrated Lights-Out 2 IML Integrated Management Log LED light-emitting diode NIC network interface controller Acronyms and abbreviations 92
NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test PPM processor power module RAID redundant array of inexpensive (or independent) disks RBSU ROM-Based Setup Utility RDP Remote Desktop Protocol ROM read-only memory SAS serial attached SCSI SATA serial ATA SCSI small computer system interface Acronyms and abbreviations 93
SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus VHDCI very high density cable interconnect Acronyms and abbreviations 94
Index A AC power supply 79 access panel 31 air baffle 28, 41 ASR (Automatic Server Recovery) 71, 92 Automatic Server Recovery (ASR) 71, 92 Autorun menu 73 B battery 80 battery-backed write cache (BBWC) 69 battery-backed write cache cabling 69 BIOS upgrade 73 buttons 75 C cables 66 cabling 66, 70 cabling, storage system 70 CD-ROM drive 68, 90 CD-ROM drive connectors 80 center wall 42 chassis ID switch 80 components 75 components, system board 80 connectors 70, 75, 80 CSR (customer self repair) 5 customer s
LEDs, SATA hard drive 83 LEDs, Systems Insight Display 86 M management tools 71 media drive 43 media drive blank 43 memory boards 46 memory slots 80, 84 N network connector LEDs 79 NIC (network interface controller) 92 NIC LEDs 77, 86 O Online ROM Flash Component Utility 73 ORCA (Option ROM Configuration for Arrays) 72 overtemperature LED 86 P part numbers 15, 16, 20 PCI riser cage connector 80 power connectors, internal 80 power LEDs, system 77 Power On/Standby button 29, 77 power requirements 89 power
V video connector 75 Index 97
