HP ProLiant SL270s Gen8 Server User Guide Abstract This document provides detailed instructions to configure and use the HP ProLiant SL270s Gen8 Server.
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Component identification ............................................................................................................... 6 Front panel components ............................................................................................................................. 6 Front panel LEDs and buttons ...................................................................................................................... 7 Rear panel components .........................................
Memory configurations................................................................................................................... 33 General DIMM slot population guidelines ......................................................................................... 35 Installing a DIMM .......................................................................................................................... 36 Hot-plug hard drive guidelines ................................................................
Troubleshooting .......................................................................................................................... 81 Troubleshooting resources ........................................................................................................................ 81 System battery ............................................................................................................................ 82 Regulatory compliance notices ..............................................
Component identification Front panel components Item Description 1 Hot-plug hard drive 1 2 Hot-plug hard drive 2 3 Hot-plug hard drive 3 4 Hot-plug hard drive 4 5 Hot-plug hard drive 5 6 Hot-plug hard drive 6 7 Hot-plug hard drive 7 8 Hot-plug hard drive 8 9 Option bay 2, FlexibleLOM 10 Option bay 1, PCI riser board 11 iLO 4 network port 12 NIC 2 network port 13 NIC 1 network port 14 Power On/Standby button and system power LED 15 Health LED 16 UID LED button 17 Serial po
Front panel LEDs and buttons Item Description Status 1 iLO 4 network speed LED Green—LAN connection using a GbE link Amber—LAN connection using a 10 Mbps/100 Mbps link Off—No LAN connection exists. 2 iLO 4 network activity LED Flashing green—Network data activity exists. Off—No network data activity exists, or no network connection exists. 3 NIC 2 activity LED Flashing green—Network data activity exists. Off—No network data activity exists, or no network connection exists.
Rear panel components The server has four power supplies, eight fans, and a single SLAPM interface located on the rear panel of the chassis. Item Description 1 SLAPM interface 2 Power supply 4 3 Power supply 3 4 Power supply 2 5 Power supply 1 Rear panel LEDs and buttons Item Description Status 1 Fan 8/16 power LED Off—Normal Amber—Fan has failed. 2 Fan 7/15 power LED Off—Normal Amber—Fan has failed.
Item Description Status Flashing blue—System is being remotely managed. Off—Deactivated 4 Fan 4/12 power LED Off—Normal Amber—Fan has failed. 5 Fan 3/11 power LED Off—Normal Amber—Fan has failed. 6 Fan 1/9 power LED Off—Normal Amber—Fan has failed. 7 Fan 2/10 power LED Off—Normal Amber—Fan has failed.
Item Description 4 SATA hard drive connector 2 5 System battery 6 Processor socket 2 7 Processor 2 DIMM slots 8 Power connector 9 RPS connector 10 x32 riser connector 11 Processor 1 DIMM slots 12 Processor socket 1 (populated) 13 Mini-SAS hard drive connector port 2i 14 Mini-SAS hard drive connector port 1i 15 Internal USB connector 16 uSD card slot 17 Data LED connector 18 x16 FlexibleLOM slot 19 System maintenance switch NOTE: This server supports PCIe Gen3 only in the Fl
System maintenance switch Position Default Function S1 Off Off = iLO 4 security is enabled. On = iLO 4 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = No function On = ROM reads system configuration as invalid.
Device numbers Item Description 1 Hard drive 1 2 Hard drive 2 3 Hard drive 3 4 Hard drive 4 5 Hard drive 5 6 Hard drive 6 7 Hard drive 7 8 Hard drive 8 Component identification 12
GPU numbering Left node Right node Component identification 13
Drive LED definitions Item LED Status 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
Operations Power up the server To power up the server, press the Power On/Standby button. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system. To power down the server, use one of the following methods: • Press and release the Power On/Standby button.
3. Remove the server from the chassis. Remove the processor air baffle To remove the component: 1. Power down the server (on page 15). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 15). 4. Remove the hard drive cage.
5. Remove all shipping brackets. 6. Loosen screws securing the GPU shelf.
7. Remove the GPU shelf. 8. Remove the air baffle ("Remove the server from the chassis" on page 15, "Remove the processor air baffle" on page 16). To replace the component, reverse the removal procedure.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack: • Leave a minimum clearance of 63.5 cm (25 in) in front of the rack. • Leave a minimum clearance of 76.2 cm (30 in) behind the rack. • Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.
Power requirements Installation of this equipment must comply with local and regional electrical regulations governing the installation of information technology equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992 (code for Protection of Electronic Computer/Data Processing Equipment).
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • • • • • The leveling jacks are extended to the floor. The full weight of the rack rests on the leveling jacks. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Installing components WARNING: The server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Reduce the weight of the server by removing the hard drives and power supplies before installing the server into the rack. • Get help to lift and stabilize the server during installation. When the server weighs more than 22.5 kg (50 lb), two people might be required to install the server into the rack.
2. Rotate the tray handle to lock. 3. Connect peripheral devices to the server.
Item Description 12 NIC 2 network port 13 NIC 1 network port 14 Power On/Standby button and system power LED 15 Health LED 16 UID LED button 17 Serial port SUV port 18 * Not shown WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into RJ-45 connectors. 4. Connect the power cords to the power supplies. 5. Connect the power cord to the AC power source.
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the controller defaults to a RAID configuration based on the size and number of hard drives installed. For more information on modifying the controller default settings, see the documentation on the Documentation CD. For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the iLO Management Engine Information Library (http://www.hp.com/go/ilomgmtengine/docs).
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
8. Remove the clear processor socket cover. Retain the processor socket cover for future use. 9. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 11. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 12. Remove the thermal interface protective cover from the heatsink.
13. Install the heatsink. 14. Install the air baffle. 15. Install the server into the chassis. 16. Power up the server. Memory options IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization. The memory subsystem in this server can support LRDIMMs, RDIMMs, or UDIMMs. All three types are referred to as DIMMs when the information applies to all three types.
Certain performance features are unique with HP SmartMemory. HP SmartMemory 1.35V DDR3-1333 Registered memory is engineered to achieve the same performance level as 1.5V memory. For example, while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM at 1.35V. This difference equates to up to 20% less power at the DIMM level with no performance penalty. Memory subsystem architecture The memory subsystem in this server is divided into channels.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank 2R = Dual-rank 4R = Quad-rank 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35v) U = Ultra low voltage (1.
is degrading. This configuration enables DIMMs that have a higher probability of receiving an uncorrectable memory error (resulting in system downtime) to be removed from operation. Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 73).
contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and automatically switches over to the online spare rank. Lockstep memory configuration Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device. Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each channel must have identical HP part numbers.
• Each populated channel must have a spare rank: o A single dual-rank DIMM is not a valid configuration. o LRDIMMs are treated as dual-rank DIMMs. Lockstep Memory population guidelines For Lockstep memory mode configurations, observe the following guidelines: • Observe the general DIMM slot population guidelines (on page 35). • DIMM configuration on all channels of a processor must be identical. • In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.
6. Install the DIMM. 7. Install the processor air baffle. 8. If removed, install the FBWC capacitor pack. 9. Install the server into the chassis ("Installing the server into the chassis" on page 23). 10. Power up the server (on page 15). If you are installing DIMMs in online spare, mirrored, or lock-step configuration, configure this mode in RBSU ("HP ROM-Based Setup Utility" on page 73).
Removing the hard drive blank Remove the component as indicated. Installing a hot-plug SAS hard drive 1. Remove the drive blank. 2. Prepare the drive.
3. Install the drive. 4. Determine the status of the drive from the drive LED definitions (on page 14). Controller options The server ships with HP Smart Array P220i Controller. For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website (http://www.hp.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.
5. Remove all shipping brackets. 6. Loosen screws securing the GPU shelf.
7. Remove the GPU shelf. 8. Install the cache module in the SAS cache module connector on the system board. For connector locations, see "System board components (on page 9)." 9. Install all components removed from the server. 10. Install the server into the chassis ("Installing the server into the chassis" on page 23). 11. Power up the server (on page 15).
1. Back up all data on the server. 2. Power down the server (on page 15). 3. Disconnect all peripheral cables from the server. 4. Remove the server from the chassis (on page 15). 5. Remove the hard drive cage. 6. Remove all shipping brackets.
7. Loosen screws securing the GPU shelf. 8. Remove the GPU shelf.
9. Install the FBWC module into the holder mounted in the server tray. 10.
o Right node 11. Attach the FBWC cable to the cache module on the system board or to the controller card. 12. Install all components removed from the server. 13. Install the server into the chassis ("Installing the server into the chassis" on page 23). 14. Power up the server (on page 15). Expansion board options Installing an expansion board or FlexibleLOM The server ships with PCIe riser boards and expansion slots.
4. Remove the hard drive cage. 5. Remove all shipping brackets.
6. Loosen screws securing the GPU shelf. 7. Remove the GPU shelf.
8. Remove the PCI cage. 9. Remove the expansion slot cover from the PCI riser board assembly. IMPORTANT: If the expansion board ships with an extender bracket, remove it from the expansion board before inserting the board into the expansion slot of the PCI riser board assembly. 10. Install the expansion board or FlexibleLOM into the slot until it seats firmly. 11. Connect all internal or external cabling to the installed board. 12. Install all components removed from the server. 13.
Installing a PCI riser board assembly 1. Power down the server (on page 15). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 15). 4. Remove the hard drive cage. 5. Remove all shipping brackets.
6. Loosen screws securing the GPU shelf. 7. Remove the GPU shelf.
8. Remove the PCI cage. 9. Install the riser card into the PCI cage. 10. If necessary, install the expansion boards ("Installing an expansion board or FlexibleLOM" on page 46). IMPORTANT: The server does not power up if the PCI riser board assembly is not seated properly. 11. Connect all internal cabling to the expansion boards. 12. Install all components removed from the server. 13. Install the server into the chassis ("Installing the server into the chassis" on page 23). 14.
CAUTION: All power supplies installed in the server must have the same output power capacity. Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies. Label color Output Orange 750W Green 1,200W White 1,200W -48Vdc CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To install the component: 1.
WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the power cord to the power supply until the power supply is installed. 4. Install the redundant power supply into the bay until it clicks. 5. Connect the power cord to the power supply. 6. Use the strain relief clip from the server hardware kit to secure the power cord. 7. Route the power cord through the cable management solution. 8. Connect the power cord to the power source. 9.
4. Remove the hard drive cage. 5. Remove all shipping brackets.
6. Loosen screws securing the GPU shelf. 7. Remove the GPU shelf.
8. Remove the PCI cage. 9. Install the riser card into the PCI cage.
10. Install the controller card into the PCI cage. 11. Install the PCI cage into the server. 12. Install the HDD cage. 13. Disconnect the existing mini-SAS cables from the SFF HDD cage.
14. Install the mini-SAS cable included in this kit to the HDD cage. 15. Connect the mini-SAS cable to the SAS connection on the controller card.
o Right node 16. Install all components removed from the server. 17. Install the server into the chassis ("Installing the server into the chassis" on page 23). 18. Power up the server (on page 15). Connecting the SUV cable CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment.
Item Connector Description 3 Video For connecting a video monitor 4 USB For connecting up to two USB devices 5 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections: 1. Installing the Trusted Platform Module board. 2. Retaining the recovery key/password (on page 64). 3.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. 1. Power down the server (on page 15). 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis (on page 15). 4. Remove the hard drive cage. 5. Remove all shipping brackets.
6. Loosen screws securing the GPU shelf. 7. Remove the GPU shelf. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
8. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 9). 9. Install the TPM security rivet by pressing the rivet firmly into the system board. 10. Install all components removed from the server. 11. Install the server into the chassis ("Installing the server into the chassis" on page 23). 12. Power up the server (on page 15).
• Always store copies of the recovery key/password away from the server. • Do not save the recovery key/password on the encrypted hard drive. Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2. From the Main Menu, select Server Security. 3. From the Server Security Menu, select Trusted Platform Module. 4. From the Trusted Platform Module Menu, select TPM Functionality. 5.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Right node Cabling 67
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO 4 enables and manages the Active Health System (on page 69) and also features Agentless Management. All key internal subsystems are monitored by iLO 4. SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed. Using iLO 4, you can do the following: • Access a high-performance and secure Remote Console to the server from anywhere in the world.
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can download from the HP website (http://www.hp.com/go/spp/download).
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning. HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if configured and available in your country.
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the server is booted to the ISO so that the server can be updated automatically with no user interaction or updated in interactive mode. For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).
Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key. IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does not prompt you for confirmation of settings before you exit the utility.
• Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key. Configuring AMP modes Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported by the server.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following: • POST • RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support Redundant ROM support The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has a single ROM that acts as two separate ROM images.
Software and firmware Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, download the SPP ("HP Service Pack for ProLiant" on page 72) from the HP website (http://www.hp.com/go/spp). Version control The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.
HP Technology Service Portfolio HP Technology Services offers a targeted set of consultancy, deployment, and service solutions designed to meet the support needs of the most business and IT environments. Foundation Care services deliver scalable hardware and software support packages for HP ProLiant server and industry-standard software. You can choose the type and level of service that is most suitable for your business needs.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
System battery If the server no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Vietnam compliance marking notice This marking is for applicable products only. Ukraine notice Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation: • Do not try to open the module enclosure. There are no user-serviceable components inside. • Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
Acoustics statement for Germany (Geräuschemission) Schalldruckpegel LpA < 70 dB(A) Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation) Nach ISO 7779:1999 (Typprüfung) Regulatory compliance notices 89
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Nonoperating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048 m (10,000 ft) is applicable. No direct sunlight allowed.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 98
Support and other resources 99
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADM Advanced Data Mirroring AMP Advanced Memory Protection ASR Automatic Server Recovery BMC baseboard management controller CSA Canadian Standards Association CSR Customer Self Repair DDDC Double Device Data Correction DDR double data rate FBWC flash-backed write cache GPU graphics processing unit Acronyms and abbreviations 100
HDD hard drive HP SIM HP Systems Insight Manager HP SUM HP Smart Update Manager IEC International Electrotechnical Commission iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor LRDIMM load reduced dual in-line memory module NMI nonmaskable interrupt NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test Acronyms and abbreviations 101
RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack SAS serial attached SCSI SATA serial ATA SDDC Single Device Data Correction SFF small form factor SIM Systems Insight Manager SLAPM SL Advanced Power Manager SPP HP Service Pack for ProLiant SUV serial, USB, video TMRA recommended ambient operating temperature TPM Trusted Platform Module UDIMM unregistered dual in-line memory module Acronyms and abbreviations 102
UID unit identification UPS uninterruptible power system USB universal serial bus VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 103
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Index A ACU (Array Configuration Utility) Advanced ECC memory 34, 35, airflow requirements 19, 20 Array Configuration Utility (ACU) ASR (Automatic Server Recovery) authorized reseller 92 auto-configuration process 74 Automatic Server Recovery (ASR) 68, 76 75 76 77 77 B batteries, replacing 88 battery 82, 88 BIOS upgrade 68, 77 boot options 25, 74 BSMI notice 86 buttons 6, 8 C cables 66, 84 cabling 60, 66 Canadian notices 84 Care Pack 19, 80 Change Control 80 components 6 components, identification 6, 8,
iLO (Integrated Lights-Out) 68, 69, 70 IML (Integrated Management Log) 68, 70 Insight Diagnostics 70, 71, 78 installation services 19 installation, server options 27 installing hardware 27 Integrated Lights-Out (iLO) 68 Integrated Management Log (IML) 70 J Japanese notice 86 K Korean notices 86 L laser devices 87 LEDs 6, 8, 14 LEDs, drive 14 LEDs, hard drive 14 LEDs, power supply 8 LEDs, SAS hard drive 14 LEDs, troubleshooting 81 M memory 32, 33, 34 memory subsystem architecture 32 memory, Advanced ECC
static electricity 90 support 92 supported operating systems 79 system battery 82 system board battery 88 system board components 9 System Erase Utility 71 system maintenance switch 11 T Taiwan battery recycling notice 88 technical support 80, 92 telephone numbers 92 temperature requirements 20 TPM (Trusted Platform Module) 61, 64, 65 troubleshooting 81 Trusted Platform Module (TPM) 61, 64, 65 U UID LED 8 updating the system ROM 78 USB support 77 utilities 68, 76 utilities, deployment 68, 72, 73 V ventil
