HP ENVY Notebook Intel Models 17-n100 17-n199 3D camera Models 17-r100 17-r199 (worldwide) 3D camera Models m7-r100 m7-r199 (North America) - Maintenance and Service Guide
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for Customer Self-Repair parts
- Removal and replacement procedures for Authorized Service Provider parts
- Component replacement procedures
- Bottom cover
- Hard drive
- WLAN module
- Memory module
- USB board
- Fan
- Heat sink
- RTC battery
- Speakers (front)
- Subwoofer
- System board
- Solid State Drive
- Speaker (rear)
- LID board
- TouchPad assembly
- Fingerprint reader board (select products only)
- Power connector cable
- Display assembly – touch screen
- Display assembly – non-touch screen
- Component replacement procedures
- Computer Setup (BIOS), TPM, and HP Sure Start – Windows 10
- Using Setup Utility (BIOS) in Windows 8.1
- Using Setup Utility (BIOS) in Windows 7
- HP PC Hardware Diagnostics (UEFI) – Windows 10
- Using HP PC Hardware Diagnostics (UEFI) in Windows 8.1
- Backup and recovery – Windows 10
- Backing up, restoring, and recovering in Windows 8.1
- Backing up, restoring, and recovering in Windows 7
- Ubuntu Linux – Backing up, restoring, and recovering
- Specifications
- Power cord set requirements
- Recycling
- Index
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits. Thermal paste is used on the processor (1), (2) and
the heat sink section (3), (4) that services it.
Reverse this procedure to install the heat sink.
Component replacement procedures 45