HP ZBook Studio G3 Mobile Workstation - Maintenance and Service Guide

4. Remove the fan/heat sink assembly (5).
CAUTION: When lifting the heat sink out of the computer, be careful not to bend the arm that connects
the fans.
Discrete models:
UMA models:
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the thermal module, processor, and system board spare part kits.
Discrete graphics models:
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Various thermal pads are used on the system board components and the heat sink sections and that
service them. See the following image for thermal pad locations.
Component replacement procedures 41